Resultado final
It will present all dissemination actions performed during the first period for the different targets.
Report on dissemination activities during second reporting periodIt will present all dissemination actions performed during the second period for the different targets.
The project website will be an important tool for scientific project management, internal communication and project communication. It will include: • A Public area with dedicated parts for each target (Public, Scientifics, Policy Makers, …) • A Consortium area, where all relevant project documentation (such as scientific results, records of samples and masks, official documents, reports, drafts of publications, minutes of meetings) will be available. European Commission and reviewers will have access to specified pages of the Consortium area (such as Publications and Deliverables)
Publicaciones
Autores:
Thomas Demes, Céline Ternon, David Riassetto, Valérie Stambouli, Michel Langlet
Publicado en:
Journal of Materials Science, Edición 51/23, 2016, Página(s) 10652-10661, ISSN 0022-2461
Editor:
Kluwer Academic Publishers
DOI:
10.1007/s10853-016-0287-8
Autores:
Ganesh Jayakumar, Maxime Legallais, Per-Erik Hellström, Mireille Mouis, Isabelle Pignot-Paintrand, Valérie Stambouli, Céline Ternon, Mikael Östling
Publicado en:
Nanotechnology, Edición 30/18, 2019, Página(s) 184002, ISSN 0957-4484
Editor:
Institute of Physics Publishing
DOI:
10.1088/1361-6528/aaffa5
Autores:
G Jayakumar, M Östling
Publicado en:
Nanotechnology, Edición 30/22, 2019, Página(s) 225502, ISSN 0957-4484
Editor:
Institute of Physics Publishing
DOI:
10.1088/1361-6528/ab0469
Autores:
G. Jayakumar, P.-E. Hellström, M. Östling
Publicado en:
Microelectronic Engineering, Edición 212, 2019, Página(s) 13-20, ISSN 0167-9317
Editor:
Elsevier BV
DOI:
10.1016/j.mee.2019.03.006
Autores:
Ganesh Jayakumar, Per-Erik Hellström, Mikael Östling
Publicado en:
Micromachines, Edición 9/11, 2018, Página(s) 544, ISSN 2072-666X
Editor:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/mi9110544
Autores:
Thi Thu Thuy Nguyen, Maxime Legallais, Fanny Morisot, Thibauld Cazimajou, Valérie Stambouli, Mireille Mouis, Bassem Salem, Céline Ternon
Publicado en:
Materials Research Express, Edición 6/1, 2019, Página(s) 016301, ISSN 2053-1591
Editor:
IOP
DOI:
10.1088/2053-1591/aae0d5
Autores:
G. Ghibaudo, G. Pananakakis
Publicado en:
Composants nanoélectroniques, Edición 2/1, 2019, ISSN 2516-3914
Editor:
ISTE
DOI:
10.21494/iste.op.2019.0347
Autores:
Muhammed Kayaharman, Maxime Legallais, Celine Ternon, Sangtak Park, Bassem Salem, Mehrdad Irannejad, Eihab Abdel-Rahman, Mustafa Yavuz
Publicado en:
Proceedings, Edición 2/3, 2018, Página(s) 124, ISSN 2504-3900
Editor:
MDPI
DOI:
10.3390/ecsa-4-04925
Autores:
Claudio Zuliani, Lisa Jerg, Alison Hart, Wolfram Simmendinger, Malick Camara, Zeeshan Ali
Publicado en:
Proceedings, Edición 2/13, 2018, Página(s) 774, ISSN 2504-3900
Editor:
MDPI
DOI:
10.3390/proceedings2130774
Autores:
M. Legallais, T.T.T. Nguyen, M. Mouis, B. Salem, E. Robin, P. Chenevier, C. Ternon
Publicado en:
Solid-State Electronics, Edición 143, 2018, Página(s) 97-102, ISSN 0038-1101
Editor:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2017.11.008
Autores:
T. Cazimajou, M. Legallais, M. Mouis, C. Ternon, B. Salem, G. Ghibaudo
Publicado en:
Solid-State Electronics, Edición 143, 2018, Página(s) 83-89, ISSN 0038-1101
Editor:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2017.11.013
Autores:
Thomas Demes, Céline Ternon, Fanny Morisot, David Riassetto, Maxime Legallais, Hervé Roussel, Michel Langlet
Publicado en:
Applied Surface Science, Edición 410, 2017, Página(s) 423-431, ISSN 0169-4332
Editor:
Elsevier BV
DOI:
10.1016/j.apsusc.2017.03.086
Autores:
Maxime Legallais, Thi Thu Thuy Nguyen, Thibauld Cazimajou, Mireille Mouis, Bassem Salem and Céline Ternon
Publicado en:
2016
Editor:
IOP
Autores:
Demes-Causse, T and Morisot, F and Legallais, M and Calais, A and Pernot, E and Pignot-Paintrand, I and Ternon, C and Stambouli, V.
Publicado en:
Materials Today, Proc, 2016
Editor:
Elsevier
Autores:
Duc-Trung NGUYEN
Publicado en:
2018
Editor:
à renseigner
Autores:
Morisot F., Nguyen V. H., Montemont C., Maindron T., Muñoz-Rojas D., Mouis M., Langlet M., Ternon C.
Publicado en:
Nanotechnology, 2016
Editor:
IOP
Autores:
Thi Thu Thuy Nguyen, Thibauld Cazimajou, Maxime Legallais, Tabassom Arjmand, Viet Huong Nguyen, Mireille Mouis, Bassem Salem, Eric Robin, and Céline Ternon
Publicado en:
Nano Futures, 2016
Editor:
IOP
Autores:
Fanny MORISOT, Claudio ZULIANI, Joaquim LUQUE1, Zeeshan ALI, , Mireille MOUIS, Viet Huong NGUYEN, David MUNOZ-ROJAS, Oumayma LOURHZAL, Michael TEXIER, Thomas W. CORNELIUS, Celine TERNON
Publicado en:
Material Research Express, 2016
Editor:
IOP
Autores:
F. Morisot
Publicado en:
2016
Editor:
Université Bourgogne-Franche Comté
Autores:
F. Morisot
Publicado en:
2016
Editor:
ESIREM Dijon
Autores:
Maxime LEGALLAIS
Publicado en:
Micro et nanotechnologies/Microélectronique. Université Grenoble Alpes, 2017, 2018
Editor:
à renseigner
Autores:
T. Demes
Publicado en:
2017
Editor:
Communauté Université Grenoble Alpes
Autores:
T. Cazimajou, M. Mouis, G. Ghibaudo
Publicado en:
2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2018, Página(s) 1-3, ISBN 978-1-5386-4811-7
Editor:
IEEE
DOI:
10.1109/ulis.2018.8354760
Autores:
T Cazimajou, TTT Nguyen, M Legallais, M Mouis, CTernon, G Ghibaudo
Publicado en:
Proceedings of EUROSOI-ULIS, 2019, 2019
Editor:
IEEE
Autores:
T Cazimajou, C Theodorou, M Mouis, TTT Nguyen, M Legallais, C Ternon and G Ghibaudo
Publicado en:
Proceedings of ICNF 2019 (Neufchatel, Switzerland), 2019
Editor:
IEEE
Autores:
M. Legallais, T. T. T. Nguyen, M. Mouis, B. Salem, C. Ternon
Publicado en:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Página(s) 231-234, ISBN 978-1-5090-5313-1
Editor:
IEEE
DOI:
10.1109/ULIS.2017.7962570
Autores:
T. Cazimajou, M. Legallais, M. Mouis, C. Ternon, B. Salem, G. Ghibaudo
Publicado en:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Página(s) 23-26, ISBN 978-1-5090-5313-1
Editor:
IEEE
DOI:
10.1109/ULIS.2017.7962591
Buscando datos de OpenAIRE...
Se ha producido un error en la búsqueda de datos de OpenAIRE
No hay resultados disponibles