Deliverables
It will present all dissemination actions performed during the first period for the different targets.
Report on dissemination activities during second reporting periodIt will present all dissemination actions performed during the second period for the different targets.
The project website will be an important tool for scientific project management, internal communication and project communication. It will include: • A Public area with dedicated parts for each target (Public, Scientifics, Policy Makers, …) • A Consortium area, where all relevant project documentation (such as scientific results, records of samples and masks, official documents, reports, drafts of publications, minutes of meetings) will be available. European Commission and reviewers will have access to specified pages of the Consortium area (such as Publications and Deliverables)
Publications
Author(s):
Thomas Demes, Céline Ternon, David Riassetto, Valérie Stambouli, Michel Langlet
Published in:
Journal of Materials Science, Issue 51/23, 2016, Page(s) 10652-10661, ISSN 0022-2461
Publisher:
Kluwer Academic Publishers
DOI:
10.1007/s10853-016-0287-8
Author(s):
Ganesh Jayakumar, Maxime Legallais, Per-Erik Hellström, Mireille Mouis, Isabelle Pignot-Paintrand, Valérie Stambouli, Céline Ternon, Mikael Östling
Published in:
Nanotechnology, Issue 30/18, 2019, Page(s) 184002, ISSN 0957-4484
Publisher:
Institute of Physics Publishing
DOI:
10.1088/1361-6528/aaffa5
Author(s):
G Jayakumar, M Östling
Published in:
Nanotechnology, Issue 30/22, 2019, Page(s) 225502, ISSN 0957-4484
Publisher:
Institute of Physics Publishing
DOI:
10.1088/1361-6528/ab0469
Author(s):
G. Jayakumar, P.-E. Hellström, M. Östling
Published in:
Microelectronic Engineering, Issue 212, 2019, Page(s) 13-20, ISSN 0167-9317
Publisher:
Elsevier BV
DOI:
10.1016/j.mee.2019.03.006
Author(s):
Ganesh Jayakumar, Per-Erik Hellström, Mikael Östling
Published in:
Micromachines, Issue 9/11, 2018, Page(s) 544, ISSN 2072-666X
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/mi9110544
Author(s):
Thi Thu Thuy Nguyen, Maxime Legallais, Fanny Morisot, Thibauld Cazimajou, Valérie Stambouli, Mireille Mouis, Bassem Salem, Céline Ternon
Published in:
Materials Research Express, Issue 6/1, 2019, Page(s) 016301, ISSN 2053-1591
Publisher:
IOP
DOI:
10.1088/2053-1591/aae0d5
Author(s):
G. Ghibaudo, G. Pananakakis
Published in:
Composants nanoélectroniques, Issue 2/1, 2019, ISSN 2516-3914
Publisher:
ISTE
DOI:
10.21494/iste.op.2019.0347
Author(s):
Muhammed Kayaharman, Maxime Legallais, Celine Ternon, Sangtak Park, Bassem Salem, Mehrdad Irannejad, Eihab Abdel-Rahman, Mustafa Yavuz
Published in:
Proceedings, Issue 2/3, 2018, Page(s) 124, ISSN 2504-3900
Publisher:
MDPI
DOI:
10.3390/ecsa-4-04925
Author(s):
Claudio Zuliani, Lisa Jerg, Alison Hart, Wolfram Simmendinger, Malick Camara, Zeeshan Ali
Published in:
Proceedings, Issue 2/13, 2018, Page(s) 774, ISSN 2504-3900
Publisher:
MDPI
DOI:
10.3390/proceedings2130774
Author(s):
M. Legallais, T.T.T. Nguyen, M. Mouis, B. Salem, E. Robin, P. Chenevier, C. Ternon
Published in:
Solid-State Electronics, Issue 143, 2018, Page(s) 97-102, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2017.11.008
Author(s):
T. Cazimajou, M. Legallais, M. Mouis, C. Ternon, B. Salem, G. Ghibaudo
Published in:
Solid-State Electronics, Issue 143, 2018, Page(s) 83-89, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2017.11.013
Author(s):
Thomas Demes, Céline Ternon, Fanny Morisot, David Riassetto, Maxime Legallais, Hervé Roussel, Michel Langlet
Published in:
Applied Surface Science, Issue 410, 2017, Page(s) 423-431, ISSN 0169-4332
Publisher:
Elsevier BV
DOI:
10.1016/j.apsusc.2017.03.086
Author(s):
Maxime Legallais, Thi Thu Thuy Nguyen, Thibauld Cazimajou, Mireille Mouis, Bassem Salem and Céline Ternon
Published in:
2016
Publisher:
IOP
Author(s):
Demes-Causse, T and Morisot, F and Legallais, M and Calais, A and Pernot, E and Pignot-Paintrand, I and Ternon, C and Stambouli, V.
Published in:
Materials Today, Proc, 2016
Publisher:
Elsevier
Author(s):
Duc-Trung NGUYEN
Published in:
2018
Publisher:
à renseigner
Author(s):
Morisot F., Nguyen V. H., Montemont C., Maindron T., Muñoz-Rojas D., Mouis M., Langlet M., Ternon C.
Published in:
Nanotechnology, 2016
Publisher:
IOP
Author(s):
Thi Thu Thuy Nguyen, Thibauld Cazimajou, Maxime Legallais, Tabassom Arjmand, Viet Huong Nguyen, Mireille Mouis, Bassem Salem, Eric Robin, and Céline Ternon
Published in:
Nano Futures, 2016
Publisher:
IOP
Author(s):
Fanny MORISOT, Claudio ZULIANI, Joaquim LUQUE1, Zeeshan ALI, , Mireille MOUIS, Viet Huong NGUYEN, David MUNOZ-ROJAS, Oumayma LOURHZAL, Michael TEXIER, Thomas W. CORNELIUS, Celine TERNON
Published in:
Material Research Express, 2016
Publisher:
IOP
Author(s):
F. Morisot
Published in:
2016
Publisher:
Université Bourgogne-Franche Comté
Author(s):
F. Morisot
Published in:
2016
Publisher:
ESIREM Dijon
Author(s):
Maxime LEGALLAIS
Published in:
Micro et nanotechnologies/Microélectronique. Université Grenoble Alpes, 2017, 2018
Publisher:
à renseigner
Author(s):
T. Demes
Published in:
2017
Publisher:
Communauté Université Grenoble Alpes
Author(s):
T. Cazimajou, M. Mouis, G. Ghibaudo
Published in:
2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2018, Page(s) 1-3, ISBN 978-1-5386-4811-7
Publisher:
IEEE
DOI:
10.1109/ulis.2018.8354760
Author(s):
T Cazimajou, TTT Nguyen, M Legallais, M Mouis, CTernon, G Ghibaudo
Published in:
Proceedings of EUROSOI-ULIS, 2019, 2019
Publisher:
IEEE
Author(s):
T Cazimajou, C Theodorou, M Mouis, TTT Nguyen, M Legallais, C Ternon and G Ghibaudo
Published in:
Proceedings of ICNF 2019 (Neufchatel, Switzerland), 2019
Publisher:
IEEE
Author(s):
M. Legallais, T. T. T. Nguyen, M. Mouis, B. Salem, C. Ternon
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 231-234, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962570
Author(s):
T. Cazimajou, M. Legallais, M. Mouis, C. Ternon, B. Salem, G. Ghibaudo
Published in:
2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, Page(s) 23-26, ISBN 978-1-5090-5313-1
Publisher:
IEEE
DOI:
10.1109/ULIS.2017.7962591
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