Pilot line for micro-transfer-printing of functional components on wafer level

Resultado final

Internal and external IT communication infrastructure and project website

The external IT communication infrastructure constitutes a guideline for communication of the MICROPRINCE project to external target groups including conferences, marketing measures and communication channels. Furthermore this deliverable constitutes the launch of the internal MICROPRINCE communication infrastructure including the establishment of mailing lists or a subversion server, and the MICROPRINCE website.

Publicaciones

Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride waveguides for near-infrared applications

Autores: Jeroen Goyvaerts, Sulakshna Kumari, Sarah Uvin, Jing Zhang, Roel Baets, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Günther Roelkens
Publicado en: Optics Express, Edición 28/14, 2020, Página(s) 21275, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/oe.395796

A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems

Autores: Robert Fischbach, Tilman Horst, Jens Lienig
Publicado en: 2019 International 3D Systems Integration Conference (3DIC), 2019, Página(s) 1-6, ISBN 978-1-7281-4870-0
Editor: IEEE
DOI: 10.1109/3DIC48104.2019.9058886

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

Autores: S. Dempwolf, L. Hofmann, C. Bowers, D. Guenther, R. Knechtel, S. Schulz, R. Gerbach
Publicado en: 2017
Editor: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
DOI: 10.5281/zenodo.1043259

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

Autores: Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny
Publicado en: Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors, Edición 1, 2017
Editor: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
DOI: 10.5281/zenodo.1043259

Transfer printing for heterogeneous silicon PICs

Autores: Roelkens, Gunther; Zhang, Jing; Kumari, Sulakshna; Juvert, Joan; Liles, Alexandros; Muliuk, Grigorij; Goyvaerts, Jeroen; Hag, Bahawal; Mahmoud, Nayyera; Van Thourhout, Dries
Publicado en: Presentation at smart Systems Integration, Edición 1, 2019
Editor: Zenodo
DOI: 10.5281/zenodo.2678181

Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT

Autores: Fischbach, Robert; Heinig, Andy; Lienig, Jens
Publicado en: Fraunhofer EAS, Edición 1, 2017
Editor: Zenodo
DOI: 10.5281/zenodo.1043277

Micro-Transfer-Printing and Potential Process Optimizations by FEA

Autores: Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk
Publicado en: NTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (Eurosime 2019), Hannover, Germany, 24 - 27 March 2019, Edición 1, 2019
Editor: ZENODO
DOI: 10.5281/zenodo.2677535

Micro-transfer-printing for heterogeneous integration

Autores: B. Corbett, Z. Li, K. Buehler, F. Naumann, U. Krieger, S. Wicht, C. A. Bower
Publicado en: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2019, Página(s) 34-34, ISBN 978-4-9047-4307-2
Editor: IEEE
DOI: 10.23919/ltb-3d.2019.8735381

Design Methodologies and Co-Design Options for Novel 3D Technologies

Autores: Horst, Tilman; Fischbach, Robert; Lienig, Jens
Publicado en: Edición 6, 2018
Editor: VDE Verlag
DOI: 10.5281/zenodo.3632449

MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level

Autores: Wicht, Sebastian; Krieger, Uwe; Guenther, Daniela; Heise, Niclas; Krojer, Matthias; Kittler, Gabriel; Naumann, Falk; Altmann, Frank; Gomez, David; Fecioru, Alin
Publicado en: Edición 1, 2019
Editor: ZENODO
DOI: 10.5281/zenodo.2654502

MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA

Autores: Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk
Publicado en: Edición 1, 2019
Editor: zenodo
DOI: 10.5281/zenodo.2677551

Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing

Autores: Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank
Publicado en: International Conference on Innovation in Failure Analysis and Material Diagnostics of Electronics Components (CAM 2019), Halle, Germany, 10-11 April 2019, Edición 1, 2019
Editor: Zenodo
DOI: 10.5281/zenodo.2702429

Manufacturing Capability of Micro-Transfer Printing

Autores: Gomez, David; Moore, Tanya; Meitl, Matthew A.; Bonafede, Salvatore; Pearson, Andrew; Ghosal, Kanchan; Raymond, Brook; Radauscher, Erich; Kneeburg, David; Roe, Julia; Fecioru, Alin; Kelleher, Steven; Trindade, Antonio Jose; Bower, Christopher A.
Publicado en: Smart Systems Integration (SSI), Barcelona, 10-11 April 2019, Edición 1, 2019
Editor: Zenodo
DOI: 10.5281/zenodo.2654512

MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly

Autores: Gerbach, Ronny; Ghosal, Kanchan; Krieger, Uwe; Kittler, Gabriel; Bower, Christopher; Knechtel, Roy
Publicado en: 2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Fairfax, Alaska, 29 November 2017, Edición 1, 2019
Editor: Zenodo
DOI: 10.5281/zenodo.2651911

Autores: Fischbach, Robert; Horst, Tilman; Lienig, Jens
Publicado en: 2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Edición 1, 2019
Editor: ZENODO
DOI: 10.5281/zenodo.3234391

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