Pilot line for micro-transfer-printing of functional components on wafer level

Informazioni relative al progetto

MICROPRINCE

ID dell’accordo di sovvenzione: 737465

DOI 10.3030/737465

Progetto chiuso

Data della firma CE 18 Maggio 2017

Data di avvio 1 Aprile 2017

Data di completamento 30 Settembre 2020

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale € 10 854 745,94

Contributo UE € 2 614 618,01

Coordinato da

X-FAB MEMS FOUNDRY GmbH
Germany

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Websites, patent fillings, videos etc. (1)

Internal and external IT communication infrastructure and project website

The external IT communication infrastructure constitutes a guideline for communication of the MICROPRINCE project to external target groups including conferences, marketing measures and communication channels. Furthermore this deliverable constitutes the launch of the internal MICROPRINCE communication infrastructure including the establishment of mailing lists or a subversion server, and the MICROPRINCE website.

Pubblicazioni

Peer reviewed articles (1)

Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride waveguides for near-infrared applications

Autori: Jeroen Goyvaerts, Sulakshna Kumari, Sarah Uvin, Jing Zhang, Roel Baets, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Günther Roelkens
Pubblicato in: Optics Express, Numero 28/14, 2020, Pagina/e 21275, ISSN 1094-4087
Editore: Optical Society of America
DOI: 10.1364/oe.395796

Conference proceedings (7)

A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems

Autori: Robert Fischbach, Tilman Horst, Jens Lienig
Pubblicato in: 2019 International 3D Systems Integration Conference (3DIC), 2019, Pagina/e 1-6, ISBN 978-1-7281-4870-0
Editore: IEEE
DOI: 10.1109/3DIC48104.2019.9058886

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

Autori: S. Dempwolf, L. Hofmann, C. Bowers, D. Guenther, R. Knechtel, S. Schulz, R. Gerbach
Pubblicato in: 2017
Editore: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
DOI: 10.5281/zenodo.1043259

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

Autori: Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny
Pubblicato in: Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors, Numero 1, 2017
Editore: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
DOI: 10.5281/zenodo.1043259

Transfer printing for heterogeneous silicon PICs

Autori: Roelkens, Gunther; Zhang, Jing; Kumari, Sulakshna; Juvert, Joan; Liles, Alexandros; Muliuk, Grigorij; Goyvaerts, Jeroen; Hag, Bahawal; Mahmoud, Nayyera; Van Thourhout, Dries
Pubblicato in: Presentation at smart Systems Integration, Numero 1, 2019
Editore: Zenodo
DOI: 10.5281/zenodo.2678181

Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT

Autori: Fischbach, Robert; Heinig, Andy; Lienig, Jens
Pubblicato in: Fraunhofer EAS, Numero 1, 2017
Editore: Zenodo
DOI: 10.5281/zenodo.1043277

Micro-Transfer-Printing and Potential Process Optimizations by FEA

Autori: Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk
Pubblicato in: NTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (Eurosime 2019), Hannover, Germany, 24 - 27 March 2019, Numero 1, 2019
Editore: ZENODO
DOI: 10.5281/zenodo.2677535

Micro-transfer-printing for heterogeneous integration

Autori: B. Corbett, Z. Li, K. Buehler, F. Naumann, U. Krieger, S. Wicht, C. A. Bower
Pubblicato in: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2019, Pagina/e 34-34, ISBN 978-4-9047-4307-2
Editore: IEEE
DOI: 10.23919/ltb-3d.2019.8735381

Book chapters (1)

Design Methodologies and Co-Design Options for Novel 3D Technologies

Autori: Horst, Tilman; Fischbach, Robert; Lienig, Jens
Pubblicato in: Numero 6, 2018
Editore: VDE Verlag
DOI: 10.5281/zenodo.3632449

Other (6)

MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level

Autori: Wicht, Sebastian; Krieger, Uwe; Guenther, Daniela; Heise, Niclas; Krojer, Matthias; Kittler, Gabriel; Naumann, Falk; Altmann, Frank; Gomez, David; Fecioru, Alin
Pubblicato in: Numero 1, 2019
Editore: ZENODO
DOI: 10.5281/zenodo.2654502

MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA

Autori: Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk
Pubblicato in: Numero 1, 2019
Editore: zenodo
DOI: 10.5281/zenodo.2677551

Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing

Autori: Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank
Pubblicato in: International Conference on Innovation in Failure Analysis and Material Diagnostics of Electronics Components (CAM 2019), Halle, Germany, 10-11 April 2019, Numero 1, 2019
Editore: Zenodo
DOI: 10.5281/zenodo.2702429

Manufacturing Capability of Micro-Transfer Printing

Autori: Gomez, David; Moore, Tanya; Meitl, Matthew A.; Bonafede, Salvatore; Pearson, Andrew; Ghosal, Kanchan; Raymond, Brook; Radauscher, Erich; Kneeburg, David; Roe, Julia; Fecioru, Alin; Kelleher, Steven; Trindade, Antonio Jose; Bower, Christopher A.
Pubblicato in: Smart Systems Integration (SSI), Barcelona, 10-11 April 2019, Numero 1, 2019
Editore: Zenodo
DOI: 10.5281/zenodo.2654512

MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly

Autori: Gerbach, Ronny; Ghosal, Kanchan; Krieger, Uwe; Kittler, Gabriel; Bower, Christopher; Knechtel, Roy
Pubblicato in: 2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Fairfax, Alaska, 29 November 2017, Numero 1, 2019
Editore: Zenodo
DOI: 10.5281/zenodo.2651911

Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing

Autori: Fischbach, Robert; Horst, Tilman; Lienig, Jens
Pubblicato in: 2017 Materials Research Society Fall Meeting & Exhibit (MRS 2017), Numero 1, 2019
Editore: ZENODO
DOI: 10.5281/zenodo.3234391