The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade.

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Multiport Electric Vehicle Charger (Task 5.1.5, Month 36)

A laboratory scale demonstrator of 10 kW will be constructed, implementing the selected PEBB concept, which will verify the multiplexing circuit technique functionality and charging power flows. Additionally, an extra 10 kW prototype to test the integration of energy storage into the EV charge will be developed and tested.

Rolling stock PEBB in specific test bench demonstrator (Task 5.1.1, Month 40)

A universal test bench able to provide all the features needed to test the power stacks.

xHP2 PEBB for energy recovery systems in railway specific test bench demonstrator (Task 5.3.2, Month 40)

The purpose of this demonstrator is to assemble and partially test in real-world operating conditions the performance of xHP2 based Power Stacks for energy recovery systems in railway.

10-15kW Rolling stock battery charger-converter (Task 5.1.4, Month 40)

An industrial scale demonstrator for a converter-charger will be manufactured and tested in a simulated environment, subjecting it to typical challenging disturbances encountered in rail vehicles.

Fast DC EV-charger with bi-directional power flow (V2G compatible) (Task 5.3.1, Month 40)

Fast DC EV-charger with bi-directional power flow (V2G compatible) demonstrator to be build. Demonstrator to be built at power range of 2 x 20 kW (output voltage of 500V, 50 A). This size allow to make all necessary tests and comparison, but are still “small scale” model from most of the real cases. Comparison between different component technologies to be made with demonstrator. Demonstrator will also include new design of IGBT related component to get full performance out from developed semiconductors.

Power converter to welding industrial demonstrator (Task 5.2.2, Month 40)

One or two different size welding power sources to be build. In case of result of project two different component size/types to be developed (smaller discrete and larger module IGBTs) then both component types can be demonstrated at different size power source. In case only one component type is available, then one demonstrator. Demonstrator will include also new development at another component related to developed IGBT (ie. driving circuit, passive components etc.) and comparative tests to other technologies.

Automotive inverter demonstrator at TRL5 (Task 5.1.3, Month 36)

An automotive inverter with a power level of up to 80kW and an operating voltage of 800V built from new IGBT modules.

Setup of commutation cell demonstrator in extended operating range (Task 5.2.1,Month 40)

The demonstrator, which will be built and implemented, is a commutation cell of a converter to verify the thermal management and the electrical characteristics.

Battery storage and EV charger (Task 5.3.4, Month 40)

A battery energy system integrated into a power electronics circuit will be installed in the Netherlands in a controlled environment to provide various flexible functions like congestion management, power quality and other functions studied in this task. The theoretical research will be verified and validated in this demonstration site during the course of this project.

Technical power supply demonstrator for the testing of high-performance capacitors (Task 5.3.3, Month 40)

A single demonstrator is currently planned for the technical power supply for the testing of high performance capacitors. This demonstrator will be assembled at the facilities of EAAT and will be validated using high performance capacitors with output currents of over 1000A, voltages up to 800VAC and more. Various tests using a power frequency spectrum (100 or more frequencies up to 2500 Hz) will be run on the capacitors to determine the results of harmonics and other problematic occurrence resulting from renewable energy sources on the power grid on the high performance capacitors. These results will be used for the content of the report regarding the results of the demonstrator.

High-speed driver with regenerative system to grid industrial demonstrator (Task 5.2.3, Month 34)

The demonstrator is a prototype of a drive fulfilling the goals described before capable of driving high speed spindles for the machine tool market and high frequency torque or linear motors. This prototype will be tested under Fagor’s facilities and characterized for validation of models (mainly thermal models). Data will be continuously gathered and transmitted to improve models at real time.

Three-phase electric vehicle charger (Task 5.1.2, Month 40)

Functional laboratory demonstrator of the 11kW three-phase charger with galvanic isolation between the battery and the mains.

Initial online communication (Task 7.1.1, Month 01)

Publish press release at project start and online communication via corporate social media channels.

Automation in Backend facilities: requirements (Task 4.2.1, Month 6)

Report on requirements for and design of automation in backend facilities.

Corporate Design Documentation (Task 7.1.1, Month 01)

The project logo, document templates (reports, letters etc.) and presentation templates will be prepared and distributed before the project start.

Website (Task 7.1.1, Month 01)

The website will be setup as a content management system (CMS) before the official start of the project. The initial contents will be integrated within the first project month.

Pubblicazioni

Scheduling by High-Performance Computing - An example for AGV considering transport carrier transfers

Autori: P. Boden, S. Rank, T. Schmidt
Pubblicato in: 1. Virtual European Advanced Process Control and Manufacturing Conference, 2021
Editore: -

Assessing the Impact of Information Assistance Systems on a Worker Level. A Pre-Study towards an Evaluation Framework

Autori: F. Lindner, D. Winkler, A. Müller, K. Mühlan, S. Keil
Pubblicato in: Mensch und Computer: MuC 2020 (online), Numero "Workshop on ""Smart Collaboration – Mitarbeiterzentrierte Informationssysteme in der Produktentstehung""", 2020
Editore: HSZG
DOI: 10.18420/muc2020-ws116-001

Local Decision Making based on Distributed Digital Twin Framework

Autori: A. Villalonga, E. Negri, L. Fumagalli, M. Macchi, F. Castaño, R. Haber
Pubblicato in: 1st Virtual IFAC World Congress, 2020
Editore: IFAC-V 2020

Torqe Dynamics Enhancement of Railway Traction Drives Using Scalar Control

Autori: A. Abouzeid, J. Guerrero, A. Endemano, I. Muniategui, D. Ortega, F. Briz
Pubblicato in: IEEE, 2021
Editore: IEEE

Co-Simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization

Autori: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro
Pubblicato in: 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation, 2020
Editore: EuroSimE

The influence of electrical stress on the distribution of electrically active defects in IGBT

Autori: J. Drobny, J. Marek, A. Chvala, J. Faraga, M. Jagelka, L. Stuchlikova
Pubblicato in: 2021
Editore: Stuba

Influence of the gate driver circuit and common source inductance on the short circuit type II & III behavior of IGBT modules and protection

Autori: Xing L., C. Herrmann, C. Bäumler, J. Kowalsky, J. Lutz
Pubblicato in: PCIM Europe 2020 (online), 2020
Editore: PCIM Europe 2020

Experimentelle Analyse und Modellierung des Verbindungsaufbaus beim Ultraschall-Dickdrahtboden

Autori: C. Scheidemann, R. Schemmel, T. Hemsel, O. Kirsch, W. Sextro
Pubblicato in: IMAPS autumn conference, 2019
Editore: -

SImulation of electrical poperties and reliability of power IGBT module

Autori: F. Koval, A. Chvala
Pubblicato in: ADEPT 2022: 10th International conference on advances in electronic and photonic technologies, 2022
Editore: ADEPT

Techno-economical comparison between Si and SiC switches in a VIENNA rectifier

Autori: Petri Korhonen
Pubblicato in: ISIE2021, 2021
Editore: 30th International Symposium of Industrial Electronics

Electrothermal model of power IGBT for circuit simulation

Autori: P. Pribytny, A. Chvala, J. Marek, D. Donoval
Pubblicato in: ASDAM 2020: 13th International Conference on advanced semiconductor devices and microsystems, 2020
Editore: ASDAM

Visual analytics framework for condition monitoring in cyber-physical systems

Autori: A. Villalonga, F. Castano, G. Beruvides, R. Haber, S. Strzelczak, J. Kossakowska
Pubblicato in: 23rd International Conference on System Theory, Control and Computing, 2019
Editore: ICSTCC
DOI: 10.1109/icstcc.2019.8885611

A Review and Implementation Framework of Industrial Augmented Reality

Autori: K. Mühlan, K. A. Przybysz, F. Lindner, F. Akrmanova, D. Winkler, S. Keil
Pubblicato in: 26th IEEE International Conference on Emerging Technologies and Factor Automation, 2021
Editore: IEEE
DOI: 10.1109/etfa45728.2021.961

Experimental parameter identification and validation of a process model for ultrasonic eavy wire bonding

Autori: R. Schemmel, N. Müller, L. Klahold, T. Hemsel, W. Sextro
Pubblicato in: 2021
Editore: -

Study of semi-vertical GaN-on-Si FETs by DLFTS with optical excitation

Autori: J. Drobny, M. Matus, J. Marek, A. Chvala, K. Geens, M. Borga, H. Liang, S. You, S. Decoutere, L. Stuchlikova
Pubblicato in: ADEPT 2021: 9th International conference on advances in electronic and photonic technologies, 2021
Editore: ADEPT

Assessment of Overmodulation Strategies for AC Drives Considering Harmonics Content and Switching Losses

Autori: A. Abouzeid, J. Guerrero, A. Endemano, Iker, Muniategui, D. Ortega, F. Briz
Pubblicato in: 2021
Editore: IEEE

Power Electronics Building Block: Development and Validation for Traction Converters

Autori: -
Pubblicato in: RailLive! Conference, 2021
Editore: -

SImulation of Thermo Mechanical Properties and Reliability of Power IGBT Module

Autori: F. Koval, A. Chvala
Pubblicato in: ASDAM 2022: 14th International conference on advanced semiconductor devices and microsystems, 2022
Editore: ASDAM

Impacts of Different Charging Strategies on the Electric Vehicle Battery Charger Circuit Using Phase-Shift Full-Bridge Converter

Autori: D. Lyu, T. B. Soeiro, P. Bauer
Pubblicato in: IEE PEMC, 2021
Editore: 19th International Power Electronics and Motion Control Conference

Finding solder cavities in high power modules with temperature sensitive parameters

Autori: J. Fuhrmann, S. Klauke, H.-G. Eckel
Pubblicato in: PCIM Europe 2020 (online), 2020
Editore: PCIM Europe 2020

Calibration of electrothermal circuit model of power IGBT module

Autori: A. Chvala, J. Marek, P. Pribytny, J. Kozarik, D. Donoval
Pubblicato in: 2021
Editore: Stuba

Si-Ti-W-AlCu thin film stacks investigated with SThM and TDTR for improved thermal management

Autori: K. Fladischer, V. Leitgeb, L. Mitterhuber and S. Defregger
Pubblicato in: nanoFIS, 2020
Editore: Functional Integrated nanoSystems Conference

Methodology for Designing Embedded Real Time Electrothermal Models in PYNQ Z1 System on Chip

Autori: J. M. Baron, F. Vergara, P. J. Arnaiz, M. Vasic
Pubblicato in: 2nd Design Mehodologies Conference, 2022
Editore: IEEE Explore

Lotfehlstellen - elektrisch über temperatursensitive Parameter messbar

Autori: UROS
Pubblicato in: Power Seminconductor Colloquium, 2019
Editore: -

Lotfehlstellen im Leistungsmodul mit Hilfe einer Zth-Messung erkennen

Autori: J. Fuhrmann, H. Wang, H.-G- Eckel
Pubblicato in: Leistungshalbleiterkolloquium Freiburg, 2021
Editore: -

Bump planarization to enhance Cu to Cu thermosonic flipchip bonding

Autori: A. Roshanghias and A. Rodrigues
Pubblicato in: ESTC 2020, 2020
Editore: Electronics System-Integration Technology Conference

Detecting Solderin Quality in Power Modules with Zth in the Loading Phase

Autori: H. Wang, J. Fuhrmann, H.-G. Eckel
Pubblicato in: PCIM Europe 2022, 2022
Editore: PCIM

Interface management concerning disruptions within supply chains: empricial evidence from the semiconductor industry during the Covid-19 pandemic

Autori: K. A. Przybysz, F. Lindner, A. Ismail, H. Ehm, S. Keil
Pubblicato in: 29th European Operations Management Association Conference 2022, 2022
Editore: EurOMA

Interface Optimization Potential Concerning Disruptions along the Semiconductor Value Chain

Autori: K. Przybysz, F. Lindner, K. Mühlan, S. Keil
Pubblicato in: 20th European Advanced Process Control and Manufacturing Conferene 2022, 2022
Editore: APC-M

Electro-thermal simulation analysis and optimization of power IGBT under uis test condition

Autori: A. Chvala, J. Marek, P. Pribytny, D. Dovonal
Pubblicato in: ADEPT 2022: 10th International conference on advances in electronic and photonic technologies, 2022
Editore: ADEPT

Power2Power Genergal Overview

Autori: O. Pyper
Pubblicato in: EFECS 2020, 2020
Editore: -

TCAD simulation of improved surge curren capability of power diode module with copper metallization

Autori: P. Pribytny, A. Chvala, J. Marek, D. Donoval
Pubblicato in: ASDAM 2022: 14th International conference on advanced semiconductor devices and microsystems, 2022
Editore: ASDAM

Finding solder cavities in high power modules with temperature sensitive parameters

Autori: J. Fuhrmann, S. Klauke, H. G. Eckel
Pubblicato in: PCIM, 2020
Editore: PCIM

Weighted Linear Regression based Data Analytics for Decision Making after Early Failures

Autori: R. Ross, P. Ypma, G. Koopmans
Pubblicato in: 2021
Editore: IWO

Der Mensch im Mittelunt von Arbeiten und Lernen mit Industrial Augmented Reality

Autori: K. Mühlan, K. A. Przybysz, F. Lindner, D. Winkler, S. Keil
Pubblicato in: 15. Ingenieurspädagogische Jahrestagung 2022, 2022
Editore: HSZG

Power cycling - methods, measurement accuracy, comparability

Autori: J. Lutz
Pubblicato in: 11th International Conference on Integrated Power Electronics Systems, 2020
Editore: CIPS 2020

Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding

Autori: R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro
Pubblicato in: 11th International Conference on Integrated Power Electronics Systems, 2020
Editore: CIPS 2020

Methodology for multi-die package semiconductor Termal Model in a Dynamic Environment

Autori: J. M. Baron, G. Salinas, X. Mo, F. Vergara, P. J. Arnaiz, P. Alou, M. Vasic
Pubblicato in: 28th International Workshop on Electric Drives: Improving Reliability of Electri Drives, 2021
Editore: IEEE Explore
DOI: 10.1109/iwed52055.2021.9376341

Partner in Power2Power

Autori: -
Pubblicato in: Pwer electronics colloquium, 2019
Editore: -

Fully Printed Planar Interconnect Technology for Power Module Packaging

Autori: A. Roshanghias and J. Kaczynski, L. Mitterhuber and S. Defregger
Pubblicato in: ESTC 2020,, 2020
Editore: Electronics System-Integration Technology Conference

Digital twin-based Optimization on the basis of Grey Wolf Method. A Case Study on Motion Control Systems

Autori: F. Castaño, R. Haber, S. Strzelczak, Z. Miljković, L. Fumagalli, M. Petrović
Pubblicato in: IEEE International Conference on Industrial Cyber-Physical Systems, 2020
Editore: ICPS 2020

Electro-thermal characterizations, compact modeling and tcad based device simulations of power electronics modules

Autori: P. Pribytny, A. Chvala, J. Marek, D. Donoval
Pubblicato in: ADEPT 2022: 10th International conference on advances in electronic and photonic technologies, 2022
Editore: ADEPT

Low-frequency oscillations analysis in ac railway networks using eigenmode identication

Autori: P. Frutos, J. M. Guerrero, I. Muniategui, I. Vicente, A. Endemano, F. Briz
Pubblicato in: IEEE Explore, 2021
Editore: IEEE

Modeling of HEMT device using neural network

Autori: L. Cernaj, A. Chvala, J. Marek, D. Donoval, J. Kozarik, T. Zavodnik
Pubblicato in: ADEPT 2020: International conference on advances in electronic and photonic technologies, 2020
Editore: ADEPT

Learn to shape the digital transformation: the design approach of a learning factory for industrial engineers

Autori: F. Lindner, D. Winkler, K. Mühlan, U. Wend, S. Keil
Pubblicato in: 11th Conference on Learning Factories 2021, 2021
Editore: CLF
DOI: 10.2139/ssrn.3858409

Complementary SThM and TDTR characterization of Si-Ti-TiN-W-Al thin films for improved thermal management in future transistor technology

Autori: K. Fladischer, V. Leitgeb, L. Mitterhuber, S. Defregger
Pubblicato in: IMAPS, 2020
Editore: -

Foundry Process for Integrated Galvanic Isolation

Autori: XFAB-DD
Pubblicato in: Silicon Saxony Days, 2019
Editore: -

Spatial and Thermal Resolution in SThM images: A Study on the Probe's Heating Parameters

Autori: V. Leitgeb, K. Fladischer, L. Mitterhuber, and S. Defregger
Pubblicato in: Therminic 2020 video conference, 2020
Editore: 26th International Workshop for Thermal Investigations of ICs and Systems

Modified Adaptive Large Neighborhood Search for Scheduling Automated Guided Vehicle fleets considering dynamic transport carrier transfers

Autori: P. Boden, S. Rank, T. Schmidt
Pubblicato in: 2020 Logistics Journal, 2020
Editore: MDPI

Virtual Resistor Active Damping with Selective Harmonics Control of LCL-Filtered VSCs

Autori: Y. Wu, T. B. Soeiro, A. Shekhar, P. Bauer
Pubblicato in: IEE PEMC, 2021
Editore: 19th International Power Electronics and Motion Control Conference

Data Analytics for Grid Resilience with Early Failures and Wear-out Failures

Autori: R. Ross, P. Ypma, G. Koopmans
Pubblicato in: 2022
Editore: IWO

Power Function Algorithm for Linear Regression Weights with Weibull Data Analysis

Autori: R. Ross
Pubblicato in: 2021
Editore: IWO

Patterning of fine-features in nanoporous films synthesized by spark ablation

Autori: X. Ju, H.J. van Ginkel, D. Hu, A. Schmidt-Ott, H. van Zeijl, S. Vollebregt, G. Q. Zhang
Pubblicato in: IEEE Nano Conference, 2022
Editore: -

Experimental Investigation of Multidimensional Ultrasoni Heavy Wire Bonding

Autori: C. Shceidemann, O. Kirsch, T. Hemsel, W. Sextro
Pubblicato in: 9th Electronics Systems-Integration technology Conference, 2022
Editore: ESTC

Influence of substrate geometry and lateral temperature gradiens on the failure mode at power cycling

Autori: X. Liu, E. Deng, H. Wang, C. Herrmann, T. Basler, J. Lutz
Pubblicato in: Microelectronics Reliability, 2021, ISSN 0026-2714
Editore: Elsevier BV

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Autori: Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl, Alfred Binder
Pubblicato in: Energies, Numero 14/8, 2021, Pagina/e 2176, ISSN 1996-1073
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en14082176

Sensor reliability in cyber-physical systems using internet of things data: a review and case study

Autori: F. Castano, S. Strzelczak, A. Villalonga, R. E. Haber, J. Kossakowska
Pubblicato in: IEEE Transactions on Industrial Informatics, 2019, ISSN 1551-3203
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.3390/rs11192252

A humidity-induced novel failure mechanism in power semiconductor diodes

Autori: J. Leppänen, G. Ross, V. Vuorinen, J. Ingman, J. Jormanainen, M. Paulasto-Kröckel
Pubblicato in: Microelectronics Reliability, Numero 123, 2021, Pagina/e 114207, ISSN 0026-2714
Editore: Elsevier BV
DOI: 10.1016/j.microrel.2021.114207

Computer Vision System for Welding Inspection of Liquefied Petroleum Gas Pressure Vessels Based on Combined Digital Image Processing and Deep Learning Techniques

Autori: Yarens J. Cruz, Marcelino Rivas, Ramón Quiza, Gerardo Beruvides, Rodolfo E. Haber
Pubblicato in: Sensors, Numero 20/16, 2020, Pagina/e 4505, ISSN 1424-8220
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s20164505

Towards Sustainability of Manufacturing Processes by Multiobjective Optimization: A Case Study on a Submerged Arc Welding Process

Autori: Daniel Rivas, Ramon Quiza, Marcelino Rivas, Rodolfo E. Haber
Pubblicato in: IEEE Access, Numero 8, 2020, Pagina/e 212904-212916, ISSN 2169-3536
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2020.3040196

"Evaluating Cu Printed Interconnects ""Sinterconnects"" versus Wire Bonds for Switching Converters"

Autori: Md. N. Hasan, T. Polom, D. Holzmann, P. Malago, A. Binder, A. Roshanghias
Pubblicato in: electronis, Numero 11, 2022, ISSN 2079-9292
Editore: MDPI
DOI: 10.3390/electronics11091373

Thermal and spatial resolution in scanning thermal microscopy images: A study on the probe’s heating parameters

Autori: V. Leitgeb, R. Hammer, L. Mitterhuber, K. Fladischer, F. Peter, A. Buerke, S. Defregger
Pubblicato in: Journal of Applied Physics, Numero 129/16, 2021, Pagina/e 164502, ISSN 0021-8979
Editore: American Institute of Physics
DOI: 10.1063/5.0037983

Hydrogen Sulphide (H2S) Single Gas Testing on Power Semiconductor Modules under High Voltage

Autori: M. Hanf, J.-H. Peters, S. Clausner, N. Kaminski
Pubblicato in: Microelectronics Reliability, 2022, ISSN 0026-2714
Editore: Elsevier BV

Influence of Lateral Temperature Gradients on the Failure Modes at Power Cycling

Autori: Xing Liu, Erping Deng, Hao Wang, Clemens Herrmann, Thomas Basler, Josef Lutz
Pubblicato in: IEEE Transactions on Components, Packaging and Manufacturing Technology, Numero 11/3, 2021, Pagina/e 407-414, ISSN 2156-3950
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2021.3058201

Impact of design of small volume Cu3Sn microbumps on its electromigration reliability for 3D ICs

Autori: N. Tiwary, G. Ross, V. Vuorinen, M. Paulasto-Kröckel
Pubblicato in: IEEE Transactions on Electronic Devices, 2022, ISSN 0018-9383
Editore: Institute of Electrical and Electronics Engineers

Torsional Vibration Suppression in Railway Traction Drives

Autori: A. F. Abouzeid, J. M. Guerrero, I. Vicente-Makazaga, I. Muniategui-Aspiazu, A. Endemano-Isasi, F. Briz
Pubblicato in: IEEE Access, Numero 10, 2022, ISSN 2169-3536
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3162415

Ensemble of convolutional neural networks based on an evolutionary algorithm applied to an industrial welding process

Autori: Y. J., M. Rivas, R. Quiza, A. Villalonga, R. E. Haber, G. Beruvides
Pubblicato in: Computers in Industry, Numero 122, 2021, ISSN 0166-3615
Editore: Elsevier BV
DOI: 10.1016/j.compind.2021.103530

Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study

Autori: D. Hu, Z. Cui, J. Fan, X. Fan, G. Zhang
Pubblicato in: Results in Physics, Numero 19, 2020, ISSN 2211-3797
Editore: Elsevier
DOI: 10.1016/j.rinp.2020.103486

Quality monitoring of complex manufacturing systems on the basis of model driven approach

Autori: F. Castaño, R. E. Haber, W. M. Mohammed, M. Nejman, A. Villalonga, J. L. Martinez Lastra
Pubblicato in: Smart Structures and Systems, Numero Volume 26 Numero 4, 2020, ISSN 1738-1584
Editore: Techno-Press
DOI: 10.12989/sss.2020.26.4.495

Optimal Periodic Variable Switching PWM for Harmonic Performance Enhancement in Grid-Connected Voltage Source Converters

Autori: Yang Wu, Junzhong Xu, Thiago Batista Soeiro, Marco Stecca, Pavol Bauer
Pubblicato in: IEEE Transactions on Power Electronics, Numero Vol.37, No. 6, 2022, Pagina/e 7247-7262, ISSN 0885-8993
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tpel.2022.3141268

Aluminium corrosion in power semiconductor devices

Autori: J. Leppänen, J. Ingman, J.-H. Peters, M. Hanf, R. Ross, G. Koopmans, J. Jormamainen, A. Forsström, G. Ross, N. Kaminski, V. Vuorinen
Pubblicato in: Microelectronics Reliability, Numero Volume 137, 2022, ISSN 0026-2714
Editore: Elsevier BV
DOI: 10.1016/j.microrel.2022.114776

Digital Twin-Based Optimization for Ultraprecision Motion Systems With Backlash and Friction

Autori: Rodolfo Haber Guerra, Ramon Quiza, Alberto Villalonga, Javier Arenas, Fernando Castano
Pubblicato in: IEEE Access, Numero 7, 2019, Pagina/e 93462-93472, ISSN 2169-3536
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2019.2928141

A methodology for high-power drives emulation using a back-to-back configuration

Autori: F. Briz, M. Saaed, J. M. Guerrero, I. Larrazabal, D. Ortega, I. Ayarzaguena, A. Pulido
Pubblicato in: IEEE Access, 2022, ISSN 2169-3536
Editore: Institute of Electrical and Electronics Engineers Inc.

Control Strategies for Induction Motors in Railway Traction Applications

Autori: Ahmed Fathy Abouzeid, Juan Manuel Guerrero, Aitor Endemaño, Iker Muniategui, David Ortega, Igor Larrazabal, Fernando Briz
Pubblicato in: Energies, Numero 13/3, 2020, Pagina/e 700, ISSN 1996-1073
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en13030700

Cloud-Based Industrial Cyber–Physical System for Data-Driven Reasoning: A Review and Use Case on an Industry 4.0 Pilot Line

Autori: Alberto Villalonga, Gerardo Beruvides, Fernando Castano, Rodolfo E. Haber
Pubblicato in: IEEE Transactions on Industrial Informatics, Numero 16/9, 2020, Pagina/e 5975-5984, ISSN 1551-3203
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tii.2020.2971057

A transient thermal measurement on nanomaterial sintered die-attach joints using a termal test chip

Autori: R. Sattari, D. Hu, X. Liu, H. von Zeijl, S. Vollebregt, G. Q. Zhang
Pubblicato in: Applied thermal engineering, 2022, ISSN 1359-4311
Editore: Pergamon Press Ltd.

Power-Hardware-in-the-Loop Emulation of the Low-Frequency Oscillation Phenomenon in AC Railway Networks

Autori: F.-G. Paul, J. M. Guerrero, I. Muiategui-Aspiazu, I. Vicente-Makazaga, A. Endemano-Isasi, D. Ortega-Rodriguez, F. Briz
Pubblicato in: IEEE Access, Numero 10, 2022, ISSN 2169-3536
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3198945

Design and Implementation of a Re-configurable Phase-Shift Full-Bridge Converter for Wide Voltage Range EV Charging Application

Autori: D. Lyu, T. B. Soeiro, P. Bauer
Pubblicato in: IEEE Transactions on Transportation Electrification, 2022, ISSN 2332-7782
Editore: IEEE
DOI: 10.1109/tte.2022.3176826

A decision-making framework for dynamic scheduling of cyber-physical production systems based on digital twins

Autori: Alberto Villalonga, Elisa Negri, Giacomo Biscardo, Fernando Castano, Rodolfo E. Haber, Luca Fumagalli, Marco Macchi
Pubblicato in: Annual Reviews in Control, Numero 51, 2021, Pagina/e 357-373, ISSN 1367-5788
Editore: Pergamon Press Ltd.
DOI: 10.1016/j.arcontrol.2021.04.008

Temperaturanalyse von PCB basierten leistungseletronischen Modulen mit einer erhöhten IGBT Sperrschichttemperatur

Autori: Michael Schütz
Pubblicato in: 2021
Editore: TUDD

Combined Simulation of Electrical and Ageing Behaviour of Li-ion Automotive Batteries

Autori: L. Milanesi
Pubblicato in: 2021
Editore: ABB

SPeeding up an endurance test of an IGBT module in switched-mode power cycling

Autori: E. Kettunen
Pubblicato in: 2021
Editore: VIF

IGBT Structure Function Evaluation Method in Combined Power- and Temperature Cycle Test

Autori: A. Forsström
Pubblicato in: 2021
Editore: ABB

Measuring the junction temperature of IGBT module during switched-mode power cycling

Autori: S. Simpanen
Pubblicato in: 2020
Editore: Kemppi

Predictive Health Monitoring of Power Electronics using Machine Learning Techniques

Autori: E. Blazhevska
Pubblicato in: 2022
Editore: VIF

Wie sinnvoll sind digitale Technologien wirklich?

Autori: F. Lindner, D. Winkler
Pubblicato in: 2020
Editore: HSZG

Work in Power2Power

Autori: -
Pubblicato in: ECSEL Austria conference, 2019
Editore: -

Neues EU Forschungsprojekt Power2Power gestartet

Autori: F. Lindner
Pubblicato in: 2019
Editore: HSZG

Leben und Arbeiten mit erweiterer Realität

Autori: F. Lindner
Pubblicato in: 2021
Editore: HSZG

Rostocker Elektrotechniker nehmen neuen Prüfplatz ur Vermessung von Leistungshalbleitern in Betrieb

Autori: J. Fuhrmann
Pubblicato in: Press Release, 2020
Editore: UROS

Power2Power General Overview

Autori: O. Pyper
Pubblicato in: EFECS, 2019
Editore: -

Augmented Reality trifft auf Halbleiterindustrie

Autori: K. Przybysz, F. Lindner
Pubblicato in: 2022
Editore: HSZG

Control Strategies for Induction Motors in Railway Traction Applications

Autori: Ingeteam Traction
Pubblicato in: 2020
Editore: -

Model-free control for machine tools

Autori: A. Vilagra, C. Join, R. Haber, M. Fliess
Pubblicato in: 21st IFAC World Congress, 2020
Editore: IFAC

M6/M12 report intro and list of publications

Autori: M. Schulze-Steikow, N. Pluntke
Pubblicato in: Online Publication, 2020
Editore: IFD

European research project Power2Power for more efficient power semiconductors launches in Dresden

Autori: Infineon
Pubblicato in: 2019
Editore: Infineon

Innosuisse Discover 2019: Power2Power

Autori: M. Leibl, U. Grossner
Pubblicato in: 2019
Editore: BRUSA, ETH

Low frequency test rig for the experimental investigation of intermetallic bond formation in ultrasonic wire bonding

Autori: R. Schemmel, T. Hemsel, W. Sextro
Pubblicato in: International Workshop on Piezoelectric Material and Applications in Actuators, 2019
Editore: IWPMA

Partner in Power2Power

Autori: -
Pubblicato in: On site research Campus, 2019
Editore: -

Measuring the junction temperature of IGBT module during switched-mode power cycling

Autori: S. Simpanen
Pubblicato in: 2020
Editore: Kemppi

CSIC contributions to Power2Power project

Autori: CSIC
Pubblicato in: Madrid Open Science and Innovation Week, 2019
Editore: -

Methodology for designing embedded real-time electrothermal models in PYNG Z1 system on chip

Autori: J. M. Baron Rufete
Pubblicato in: 2022
Editore: -

CAE elektronickych prvkov: 2/3-D numericke simulácie - Návody na cvicenia

Autori: A. Chvala, J. Marek, D. Donoval
Pubblicato in: Educational scripts, 2022, ISBN 978-80-227-5183-4
Editore: Spektrum STU

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