The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade.

CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.

Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .

Livrables

Multiport Electric Vehicle Charger (Task 5.1.5, Month 36)

A laboratory scale demonstrator of 10 kW will be constructed, implementing the selected PEBB concept, which will verify the multiplexing circuit technique functionality and charging power flows. Additionally, an extra 10 kW prototype to test the integration of energy storage into the EV charge will be developed and tested.

Rolling stock PEBB in specific test bench demonstrator (Task 5.1.1, Month 40)

A universal test bench able to provide all the features needed to test the power stacks.

xHP2 PEBB for energy recovery systems in railway specific test bench demonstrator (Task 5.3.2, Month 40)

The purpose of this demonstrator is to assemble and partially test in real-world operating conditions the performance of xHP2 based Power Stacks for energy recovery systems in railway.

10-15kW Rolling stock battery charger-converter (Task 5.1.4, Month 40)

An industrial scale demonstrator for a converter-charger will be manufactured and tested in a simulated environment, subjecting it to typical challenging disturbances encountered in rail vehicles.

Fast DC EV-charger with bi-directional power flow (V2G compatible) (Task 5.3.1, Month 40)

Fast DC EV-charger with bi-directional power flow (V2G compatible) demonstrator to be build. Demonstrator to be built at power range of 2 x 20 kW (output voltage of 500V, 50 A). This size allow to make all necessary tests and comparison, but are still “small scale” model from most of the real cases. Comparison between different component technologies to be made with demonstrator. Demonstrator will also include new design of IGBT related component to get full performance out from developed semiconductors.

Power converter to welding industrial demonstrator (Task 5.2.2, Month 40)

One or two different size welding power sources to be build. In case of result of project two different component size/types to be developed (smaller discrete and larger module IGBTs) then both component types can be demonstrated at different size power source. In case only one component type is available, then one demonstrator. Demonstrator will include also new development at another component related to developed IGBT (ie. driving circuit, passive components etc.) and comparative tests to other technologies.

Automotive inverter demonstrator at TRL5 (Task 5.1.3, Month 36)

An automotive inverter with a power level of up to 80kW and an operating voltage of 800V built from new IGBT modules.

Setup of commutation cell demonstrator in extended operating range (Task 5.2.1,Month 40)

The demonstrator, which will be built and implemented, is a commutation cell of a converter to verify the thermal management and the electrical characteristics.

Battery storage and EV charger (Task 5.3.4, Month 40)

A battery energy system integrated into a power electronics circuit will be installed in the Netherlands in a controlled environment to provide various flexible functions like congestion management, power quality and other functions studied in this task. The theoretical research will be verified and validated in this demonstration site during the course of this project.

Technical power supply demonstrator for the testing of high-performance capacitors (Task 5.3.3, Month 40)

A single demonstrator is currently planned for the technical power supply for the testing of high performance capacitors. This demonstrator will be assembled at the facilities of EAAT and will be validated using high performance capacitors with output currents of over 1000A, voltages up to 800VAC and more. Various tests using a power frequency spectrum (100 or more frequencies up to 2500 Hz) will be run on the capacitors to determine the results of harmonics and other problematic occurrence resulting from renewable energy sources on the power grid on the high performance capacitors. These results will be used for the content of the report regarding the results of the demonstrator.

High-speed driver with regenerative system to grid industrial demonstrator (Task 5.2.3, Month 34)

The demonstrator is a prototype of a drive fulfilling the goals described before capable of driving high speed spindles for the machine tool market and high frequency torque or linear motors. This prototype will be tested under Fagor’s facilities and characterized for validation of models (mainly thermal models). Data will be continuously gathered and transmitted to improve models at real time.

Three-phase electric vehicle charger (Task 5.1.2, Month 40)

Functional laboratory demonstrator of the 11kW three-phase charger with galvanic isolation between the battery and the mains.

Initial online communication (Task 7.1.1, Month 01)

Publish press release at project start and online communication via corporate social media channels.

Automation in Backend facilities: requirements (Task 4.2.1, Month 6)

Report on requirements for and design of automation in backend facilities.

Corporate Design Documentation (Task 7.1.1, Month 01)

The project logo, document templates (reports, letters etc.) and presentation templates will be prepared and distributed before the project start.

Website (Task 7.1.1, Month 01)

The website will be setup as a content management system (CMS) before the official start of the project. The initial contents will be integrated within the first project month.

Publications

Scheduling by High-Performance Computing - An example for AGV considering transport carrier transfers

Auteurs: P. Boden, S. Rank, T. Schmidt
Publié dans: 1. Virtual European Advanced Process Control and Manufacturing Conference, 2021
Éditeur: -

Assessing the Impact of Information Assistance Systems on a Worker Level. A Pre-Study towards an Evaluation Framework

Auteurs: F. Lindner, D. Winkler, A. Müller, K. Mühlan, S. Keil
Publié dans: Mensch und Computer: MuC 2020 (online), Numéro "Workshop on ""Smart Collaboration – Mitarbeiterzentrierte Informationssysteme in der Produktentstehung""", 2020
Éditeur: HSZG
DOI: 10.18420/muc2020-ws116-001

Local Decision Making based on Distributed Digital Twin Framework

Auteurs: A. Villalonga, E. Negri, L. Fumagalli, M. Macchi, F. Castaño, R. Haber
Publié dans: 1st Virtual IFAC World Congress, 2020
Éditeur: IFAC-V 2020

Torqe Dynamics Enhancement of Railway Traction Drives Using Scalar Control

Auteurs: A. Abouzeid, J. Guerrero, A. Endemano, I. Muniategui, D. Ortega, F. Briz
Publié dans: IEEE, 2021
Éditeur: IEEE

Co-Simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization

Auteurs: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro
Publié dans: 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation, 2020
Éditeur: EuroSimE

The influence of electrical stress on the distribution of electrically active defects in IGBT

Auteurs: J. Drobny, J. Marek, A. Chvala, J. Faraga, M. Jagelka, L. Stuchlikova
Publié dans: 2021
Éditeur: Stuba

Influence of the gate driver circuit and common source inductance on the short circuit type II & III behavior of IGBT modules and protection

Auteurs: Xing L., C. Herrmann, C. Bäumler, J. Kowalsky, J. Lutz
Publié dans: PCIM Europe 2020 (online), 2020
Éditeur: PCIM Europe 2020

Experimentelle Analyse und Modellierung des Verbindungsaufbaus beim Ultraschall-Dickdrahtboden

Auteurs: C. Scheidemann, R. Schemmel, T. Hemsel, O. Kirsch, W. Sextro
Publié dans: IMAPS autumn conference, 2019
Éditeur: -

SImulation of electrical poperties and reliability of power IGBT module

Auteurs: F. Koval, A. Chvala
Publié dans: ADEPT 2022: 10th International conference on advances in electronic and photonic technologies, 2022
Éditeur: ADEPT

Techno-economical comparison between Si and SiC switches in a VIENNA rectifier

Auteurs: Petri Korhonen
Publié dans: ISIE2021, 2021
Éditeur: 30th International Symposium of Industrial Electronics

Electrothermal model of power IGBT for circuit simulation

Auteurs: P. Pribytny, A. Chvala, J. Marek, D. Donoval
Publié dans: ASDAM 2020: 13th International Conference on advanced semiconductor devices and microsystems, 2020
Éditeur: ASDAM

Visual analytics framework for condition monitoring in cyber-physical systems

Auteurs: A. Villalonga, F. Castano, G. Beruvides, R. Haber, S. Strzelczak, J. Kossakowska
Publié dans: 23rd International Conference on System Theory, Control and Computing, 2019
Éditeur: ICSTCC
DOI: 10.1109/icstcc.2019.8885611

A Review and Implementation Framework of Industrial Augmented Reality

Auteurs: K. Mühlan, K. A. Przybysz, F. Lindner, F. Akrmanova, D. Winkler, S. Keil
Publié dans: 26th IEEE International Conference on Emerging Technologies and Factor Automation, 2021
Éditeur: IEEE
DOI: 10.1109/etfa45728.2021.961

Experimental parameter identification and validation of a process model for ultrasonic eavy wire bonding

Auteurs: R. Schemmel, N. Müller, L. Klahold, T. Hemsel, W. Sextro
Publié dans: 2021
Éditeur: -

Study of semi-vertical GaN-on-Si FETs by DLFTS with optical excitation

Auteurs: J. Drobny, M. Matus, J. Marek, A. Chvala, K. Geens, M. Borga, H. Liang, S. You, S. Decoutere, L. Stuchlikova
Publié dans: ADEPT 2021: 9th International conference on advances in electronic and photonic technologies, 2021
Éditeur: ADEPT

Assessment of Overmodulation Strategies for AC Drives Considering Harmonics Content and Switching Losses

Auteurs: A. Abouzeid, J. Guerrero, A. Endemano, Iker, Muniategui, D. Ortega, F. Briz
Publié dans: 2021
Éditeur: IEEE

Power Electronics Building Block: Development and Validation for Traction Converters

Auteurs: -
Publié dans: RailLive! Conference, 2021
Éditeur: -

SImulation of Thermo Mechanical Properties and Reliability of Power IGBT Module

Auteurs: F. Koval, A. Chvala
Publié dans: ASDAM 2022: 14th International conference on advanced semiconductor devices and microsystems, 2022
Éditeur: ASDAM

Impacts of Different Charging Strategies on the Electric Vehicle Battery Charger Circuit Using Phase-Shift Full-Bridge Converter

Auteurs: D. Lyu, T. B. Soeiro, P. Bauer
Publié dans: IEE PEMC, 2021
Éditeur: 19th International Power Electronics and Motion Control Conference

Finding solder cavities in high power modules with temperature sensitive parameters

Auteurs: J. Fuhrmann, S. Klauke, H.-G. Eckel
Publié dans: PCIM Europe 2020 (online), 2020
Éditeur: PCIM Europe 2020

Calibration of electrothermal circuit model of power IGBT module

Auteurs: A. Chvala, J. Marek, P. Pribytny, J. Kozarik, D. Donoval
Publié dans: 2021
Éditeur: Stuba

Si-Ti-W-AlCu thin film stacks investigated with SThM and TDTR for improved thermal management

Auteurs: K. Fladischer, V. Leitgeb, L. Mitterhuber and S. Defregger
Publié dans: nanoFIS, 2020
Éditeur: Functional Integrated nanoSystems Conference

Methodology for Designing Embedded Real Time Electrothermal Models in PYNQ Z1 System on Chip

Auteurs: J. M. Baron, F. Vergara, P. J. Arnaiz, M. Vasic
Publié dans: 2nd Design Mehodologies Conference, 2022
Éditeur: IEEE Explore

Lotfehlstellen - elektrisch über temperatursensitive Parameter messbar

Auteurs: UROS
Publié dans: Power Seminconductor Colloquium, 2019
Éditeur: -

Lotfehlstellen im Leistungsmodul mit Hilfe einer Zth-Messung erkennen

Auteurs: J. Fuhrmann, H. Wang, H.-G- Eckel
Publié dans: Leistungshalbleiterkolloquium Freiburg, 2021
Éditeur: -

Bump planarization to enhance Cu to Cu thermosonic flipchip bonding

Auteurs: A. Roshanghias and A. Rodrigues
Publié dans: ESTC 2020, 2020
Éditeur: Electronics System-Integration Technology Conference

Detecting Solderin Quality in Power Modules with Zth in the Loading Phase

Auteurs: H. Wang, J. Fuhrmann, H.-G. Eckel
Publié dans: PCIM Europe 2022, 2022
Éditeur: PCIM

Interface management concerning disruptions within supply chains: empricial evidence from the semiconductor industry during the Covid-19 pandemic

Auteurs: K. A. Przybysz, F. Lindner, A. Ismail, H. Ehm, S. Keil
Publié dans: 29th European Operations Management Association Conference 2022, 2022
Éditeur: EurOMA

Interface Optimization Potential Concerning Disruptions along the Semiconductor Value Chain

Auteurs: K. Przybysz, F. Lindner, K. Mühlan, S. Keil
Publié dans: 20th European Advanced Process Control and Manufacturing Conferene 2022, 2022
Éditeur: APC-M

Electro-thermal simulation analysis and optimization of power IGBT under uis test condition

Auteurs: A. Chvala, J. Marek, P. Pribytny, D. Dovonal
Publié dans: ADEPT 2022: 10th International conference on advances in electronic and photonic technologies, 2022
Éditeur: ADEPT

Power2Power Genergal Overview

Auteurs: O. Pyper
Publié dans: EFECS 2020, 2020
Éditeur: -

TCAD simulation of improved surge curren capability of power diode module with copper metallization

Auteurs: P. Pribytny, A. Chvala, J. Marek, D. Donoval
Publié dans: ASDAM 2022: 14th International conference on advanced semiconductor devices and microsystems, 2022
Éditeur: ASDAM

Finding solder cavities in high power modules with temperature sensitive parameters

Auteurs: J. Fuhrmann, S. Klauke, H. G. Eckel
Publié dans: PCIM, 2020
Éditeur: PCIM

Weighted Linear Regression based Data Analytics for Decision Making after Early Failures

Auteurs: R. Ross, P. Ypma, G. Koopmans
Publié dans: 2021
Éditeur: IWO

Der Mensch im Mittelunt von Arbeiten und Lernen mit Industrial Augmented Reality

Auteurs: K. Mühlan, K. A. Przybysz, F. Lindner, D. Winkler, S. Keil
Publié dans: 15. Ingenieurspädagogische Jahrestagung 2022, 2022
Éditeur: HSZG

Power cycling - methods, measurement accuracy, comparability

Auteurs: J. Lutz
Publié dans: 11th International Conference on Integrated Power Electronics Systems, 2020
Éditeur: CIPS 2020

Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding

Auteurs: R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro
Publié dans: 11th International Conference on Integrated Power Electronics Systems, 2020
Éditeur: CIPS 2020

Methodology for multi-die package semiconductor Termal Model in a Dynamic Environment

Auteurs: J. M. Baron, G. Salinas, X. Mo, F. Vergara, P. J. Arnaiz, P. Alou, M. Vasic
Publié dans: 28th International Workshop on Electric Drives: Improving Reliability of Electri Drives, 2021
Éditeur: IEEE Explore
DOI: 10.1109/iwed52055.2021.9376341

Partner in Power2Power

Auteurs: -
Publié dans: Pwer electronics colloquium, 2019
Éditeur: -

Fully Printed Planar Interconnect Technology for Power Module Packaging

Auteurs: A. Roshanghias and J. Kaczynski, L. Mitterhuber and S. Defregger
Publié dans: ESTC 2020,, 2020
Éditeur: Electronics System-Integration Technology Conference

Digital twin-based Optimization on the basis of Grey Wolf Method. A Case Study on Motion Control Systems

Auteurs: F. Castaño, R. Haber, S. Strzelczak, Z. Miljković, L. Fumagalli, M. Petrović
Publié dans: IEEE International Conference on Industrial Cyber-Physical Systems, 2020
Éditeur: ICPS 2020

Electro-thermal characterizations, compact modeling and tcad based device simulations of power electronics modules

Auteurs: P. Pribytny, A. Chvala, J. Marek, D. Donoval
Publié dans: ADEPT 2022: 10th International conference on advances in electronic and photonic technologies, 2022
Éditeur: ADEPT

Low-frequency oscillations analysis in ac railway networks using eigenmode identication

Auteurs: P. Frutos, J. M. Guerrero, I. Muniategui, I. Vicente, A. Endemano, F. Briz
Publié dans: IEEE Explore, 2021
Éditeur: IEEE

Modeling of HEMT device using neural network

Auteurs: L. Cernaj, A. Chvala, J. Marek, D. Donoval, J. Kozarik, T. Zavodnik
Publié dans: ADEPT 2020: International conference on advances in electronic and photonic technologies, 2020
Éditeur: ADEPT

Learn to shape the digital transformation: the design approach of a learning factory for industrial engineers

Auteurs: F. Lindner, D. Winkler, K. Mühlan, U. Wend, S. Keil
Publié dans: 11th Conference on Learning Factories 2021, 2021
Éditeur: CLF
DOI: 10.2139/ssrn.3858409

Complementary SThM and TDTR characterization of Si-Ti-TiN-W-Al thin films for improved thermal management in future transistor technology

Auteurs: K. Fladischer, V. Leitgeb, L. Mitterhuber, S. Defregger
Publié dans: IMAPS, 2020
Éditeur: -

Foundry Process for Integrated Galvanic Isolation

Auteurs: XFAB-DD
Publié dans: Silicon Saxony Days, 2019
Éditeur: -

Spatial and Thermal Resolution in SThM images: A Study on the Probe's Heating Parameters

Auteurs: V. Leitgeb, K. Fladischer, L. Mitterhuber, and S. Defregger
Publié dans: Therminic 2020 video conference, 2020
Éditeur: 26th International Workshop for Thermal Investigations of ICs and Systems

Modified Adaptive Large Neighborhood Search for Scheduling Automated Guided Vehicle fleets considering dynamic transport carrier transfers

Auteurs: P. Boden, S. Rank, T. Schmidt
Publié dans: 2020 Logistics Journal, 2020
Éditeur: MDPI

Virtual Resistor Active Damping with Selective Harmonics Control of LCL-Filtered VSCs

Auteurs: Y. Wu, T. B. Soeiro, A. Shekhar, P. Bauer
Publié dans: IEE PEMC, 2021
Éditeur: 19th International Power Electronics and Motion Control Conference

Data Analytics for Grid Resilience with Early Failures and Wear-out Failures

Auteurs: R. Ross, P. Ypma, G. Koopmans
Publié dans: 2022
Éditeur: IWO

Power Function Algorithm for Linear Regression Weights with Weibull Data Analysis

Auteurs: R. Ross
Publié dans: 2021
Éditeur: IWO

Patterning of fine-features in nanoporous films synthesized by spark ablation

Auteurs: X. Ju, H.J. van Ginkel, D. Hu, A. Schmidt-Ott, H. van Zeijl, S. Vollebregt, G. Q. Zhang
Publié dans: IEEE Nano Conference, 2022
Éditeur: -

Experimental Investigation of Multidimensional Ultrasoni Heavy Wire Bonding

Auteurs: C. Shceidemann, O. Kirsch, T. Hemsel, W. Sextro
Publié dans: 9th Electronics Systems-Integration technology Conference, 2022
Éditeur: ESTC

Influence of substrate geometry and lateral temperature gradiens on the failure mode at power cycling

Auteurs: X. Liu, E. Deng, H. Wang, C. Herrmann, T. Basler, J. Lutz
Publié dans: Microelectronics Reliability, 2021, ISSN 0026-2714
Éditeur: Elsevier BV

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Auteurs: Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl, Alfred Binder
Publié dans: Energies, Numéro 14/8, 2021, Page(s) 2176, ISSN 1996-1073
Éditeur: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en14082176

Sensor reliability in cyber-physical systems using internet of things data: a review and case study

Auteurs: F. Castano, S. Strzelczak, A. Villalonga, R. E. Haber, J. Kossakowska
Publié dans: IEEE Transactions on Industrial Informatics, 2019, ISSN 1551-3203
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.3390/rs11192252

A humidity-induced novel failure mechanism in power semiconductor diodes

Auteurs: J. Leppänen, G. Ross, V. Vuorinen, J. Ingman, J. Jormanainen, M. Paulasto-Kröckel
Publié dans: Microelectronics Reliability, Numéro 123, 2021, Page(s) 114207, ISSN 0026-2714
Éditeur: Elsevier BV
DOI: 10.1016/j.microrel.2021.114207

Computer Vision System for Welding Inspection of Liquefied Petroleum Gas Pressure Vessels Based on Combined Digital Image Processing and Deep Learning Techniques

Auteurs: Yarens J. Cruz, Marcelino Rivas, Ramón Quiza, Gerardo Beruvides, Rodolfo E. Haber
Publié dans: Sensors, Numéro 20/16, 2020, Page(s) 4505, ISSN 1424-8220
Éditeur: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s20164505

Towards Sustainability of Manufacturing Processes by Multiobjective Optimization: A Case Study on a Submerged Arc Welding Process

Auteurs: Daniel Rivas, Ramon Quiza, Marcelino Rivas, Rodolfo E. Haber
Publié dans: IEEE Access, Numéro 8, 2020, Page(s) 212904-212916, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2020.3040196

"Evaluating Cu Printed Interconnects ""Sinterconnects"" versus Wire Bonds for Switching Converters"

Auteurs: Md. N. Hasan, T. Polom, D. Holzmann, P. Malago, A. Binder, A. Roshanghias
Publié dans: electronis, Numéro 11, 2022, ISSN 2079-9292
Éditeur: MDPI
DOI: 10.3390/electronics11091373

Thermal and spatial resolution in scanning thermal microscopy images: A study on the probe’s heating parameters

Auteurs: V. Leitgeb, R. Hammer, L. Mitterhuber, K. Fladischer, F. Peter, A. Buerke, S. Defregger
Publié dans: Journal of Applied Physics, Numéro 129/16, 2021, Page(s) 164502, ISSN 0021-8979
Éditeur: American Institute of Physics
DOI: 10.1063/5.0037983

Hydrogen Sulphide (H2S) Single Gas Testing on Power Semiconductor Modules under High Voltage

Auteurs: M. Hanf, J.-H. Peters, S. Clausner, N. Kaminski
Publié dans: Microelectronics Reliability, 2022, ISSN 0026-2714
Éditeur: Elsevier BV

Influence of Lateral Temperature Gradients on the Failure Modes at Power Cycling

Auteurs: Xing Liu, Erping Deng, Hao Wang, Clemens Herrmann, Thomas Basler, Josef Lutz
Publié dans: IEEE Transactions on Components, Packaging and Manufacturing Technology, Numéro 11/3, 2021, Page(s) 407-414, ISSN 2156-3950
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2021.3058201

Impact of design of small volume Cu3Sn microbumps on its electromigration reliability for 3D ICs

Auteurs: N. Tiwary, G. Ross, V. Vuorinen, M. Paulasto-Kröckel
Publié dans: IEEE Transactions on Electronic Devices, 2022, ISSN 0018-9383
Éditeur: Institute of Electrical and Electronics Engineers

Torsional Vibration Suppression in Railway Traction Drives

Auteurs: A. F. Abouzeid, J. M. Guerrero, I. Vicente-Makazaga, I. Muniategui-Aspiazu, A. Endemano-Isasi, F. Briz
Publié dans: IEEE Access, Numéro 10, 2022, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3162415

Ensemble of convolutional neural networks based on an evolutionary algorithm applied to an industrial welding process

Auteurs: Y. J., M. Rivas, R. Quiza, A. Villalonga, R. E. Haber, G. Beruvides
Publié dans: Computers in Industry, Numéro 122, 2021, ISSN 0166-3615
Éditeur: Elsevier BV
DOI: 10.1016/j.compind.2021.103530

Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study

Auteurs: D. Hu, Z. Cui, J. Fan, X. Fan, G. Zhang
Publié dans: Results in Physics, Numéro 19, 2020, ISSN 2211-3797
Éditeur: Elsevier
DOI: 10.1016/j.rinp.2020.103486

Quality monitoring of complex manufacturing systems on the basis of model driven approach

Auteurs: F. Castaño, R. E. Haber, W. M. Mohammed, M. Nejman, A. Villalonga, J. L. Martinez Lastra
Publié dans: Smart Structures and Systems, Numéro Volume 26 Numéro 4, 2020, ISSN 1738-1584
Éditeur: Techno-Press
DOI: 10.12989/sss.2020.26.4.495

Optimal Periodic Variable Switching PWM for Harmonic Performance Enhancement in Grid-Connected Voltage Source Converters

Auteurs: Yang Wu, Junzhong Xu, Thiago Batista Soeiro, Marco Stecca, Pavol Bauer
Publié dans: IEEE Transactions on Power Electronics, Numéro Vol.37, No. 6, 2022, Page(s) 7247-7262, ISSN 0885-8993
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tpel.2022.3141268

Aluminium corrosion in power semiconductor devices

Auteurs: J. Leppänen, J. Ingman, J.-H. Peters, M. Hanf, R. Ross, G. Koopmans, J. Jormamainen, A. Forsström, G. Ross, N. Kaminski, V. Vuorinen
Publié dans: Microelectronics Reliability, Numéro Volume 137, 2022, ISSN 0026-2714
Éditeur: Elsevier BV
DOI: 10.1016/j.microrel.2022.114776

Digital Twin-Based Optimization for Ultraprecision Motion Systems With Backlash and Friction

Auteurs: Rodolfo Haber Guerra, Ramon Quiza, Alberto Villalonga, Javier Arenas, Fernando Castano
Publié dans: IEEE Access, Numéro 7, 2019, Page(s) 93462-93472, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2019.2928141

A methodology for high-power drives emulation using a back-to-back configuration

Auteurs: F. Briz, M. Saaed, J. M. Guerrero, I. Larrazabal, D. Ortega, I. Ayarzaguena, A. Pulido
Publié dans: IEEE Access, 2022, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.

Control Strategies for Induction Motors in Railway Traction Applications

Auteurs: Ahmed Fathy Abouzeid, Juan Manuel Guerrero, Aitor Endemaño, Iker Muniategui, David Ortega, Igor Larrazabal, Fernando Briz
Publié dans: Energies, Numéro 13/3, 2020, Page(s) 700, ISSN 1996-1073
Éditeur: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en13030700

Cloud-Based Industrial Cyber–Physical System for Data-Driven Reasoning: A Review and Use Case on an Industry 4.0 Pilot Line

Auteurs: Alberto Villalonga, Gerardo Beruvides, Fernando Castano, Rodolfo E. Haber
Publié dans: IEEE Transactions on Industrial Informatics, Numéro 16/9, 2020, Page(s) 5975-5984, ISSN 1551-3203
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tii.2020.2971057

A transient thermal measurement on nanomaterial sintered die-attach joints using a termal test chip

Auteurs: R. Sattari, D. Hu, X. Liu, H. von Zeijl, S. Vollebregt, G. Q. Zhang
Publié dans: Applied thermal engineering, 2022, ISSN 1359-4311
Éditeur: Pergamon Press Ltd.

Power-Hardware-in-the-Loop Emulation of the Low-Frequency Oscillation Phenomenon in AC Railway Networks

Auteurs: F.-G. Paul, J. M. Guerrero, I. Muiategui-Aspiazu, I. Vicente-Makazaga, A. Endemano-Isasi, D. Ortega-Rodriguez, F. Briz
Publié dans: IEEE Access, Numéro 10, 2022, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3198945

Design and Implementation of a Re-configurable Phase-Shift Full-Bridge Converter for Wide Voltage Range EV Charging Application

Auteurs: D. Lyu, T. B. Soeiro, P. Bauer
Publié dans: IEEE Transactions on Transportation Electrification, 2022, ISSN 2332-7782
Éditeur: IEEE
DOI: 10.1109/tte.2022.3176826

A decision-making framework for dynamic scheduling of cyber-physical production systems based on digital twins

Auteurs: Alberto Villalonga, Elisa Negri, Giacomo Biscardo, Fernando Castano, Rodolfo E. Haber, Luca Fumagalli, Marco Macchi
Publié dans: Annual Reviews in Control, Numéro 51, 2021, Page(s) 357-373, ISSN 1367-5788
Éditeur: Pergamon Press Ltd.
DOI: 10.1016/j.arcontrol.2021.04.008

Temperaturanalyse von PCB basierten leistungseletronischen Modulen mit einer erhöhten IGBT Sperrschichttemperatur

Auteurs: Michael Schütz
Publié dans: 2021
Éditeur: TUDD

Combined Simulation of Electrical and Ageing Behaviour of Li-ion Automotive Batteries

Auteurs: L. Milanesi
Publié dans: 2021
Éditeur: ABB

SPeeding up an endurance test of an IGBT module in switched-mode power cycling

Auteurs: E. Kettunen
Publié dans: 2021
Éditeur: VIF

IGBT Structure Function Evaluation Method in Combined Power- and Temperature Cycle Test

Auteurs: A. Forsström
Publié dans: 2021
Éditeur: ABB

Measuring the junction temperature of IGBT module during switched-mode power cycling

Auteurs: S. Simpanen
Publié dans: 2020
Éditeur: Kemppi

Predictive Health Monitoring of Power Electronics using Machine Learning Techniques

Auteurs: E. Blazhevska
Publié dans: 2022
Éditeur: VIF

Wie sinnvoll sind digitale Technologien wirklich?

Auteurs: F. Lindner, D. Winkler
Publié dans: 2020
Éditeur: HSZG

Work in Power2Power

Auteurs: -
Publié dans: ECSEL Austria conference, 2019
Éditeur: -

Neues EU Forschungsprojekt Power2Power gestartet

Auteurs: F. Lindner
Publié dans: 2019
Éditeur: HSZG

Leben und Arbeiten mit erweiterer Realität

Auteurs: F. Lindner
Publié dans: 2021
Éditeur: HSZG

Rostocker Elektrotechniker nehmen neuen Prüfplatz ur Vermessung von Leistungshalbleitern in Betrieb

Auteurs: J. Fuhrmann
Publié dans: Press Release, 2020
Éditeur: UROS

Power2Power General Overview

Auteurs: O. Pyper
Publié dans: EFECS, 2019
Éditeur: -

Augmented Reality trifft auf Halbleiterindustrie

Auteurs: K. Przybysz, F. Lindner
Publié dans: 2022
Éditeur: HSZG

Control Strategies for Induction Motors in Railway Traction Applications

Auteurs: Ingeteam Traction
Publié dans: 2020
Éditeur: -

Model-free control for machine tools

Auteurs: A. Vilagra, C. Join, R. Haber, M. Fliess
Publié dans: 21st IFAC World Congress, 2020
Éditeur: IFAC

M6/M12 report intro and list of publications

Auteurs: M. Schulze-Steikow, N. Pluntke
Publié dans: Online Publication, 2020
Éditeur: IFD

European research project Power2Power for more efficient power semiconductors launches in Dresden

Auteurs: Infineon
Publié dans: 2019
Éditeur: Infineon

Innosuisse Discover 2019: Power2Power

Auteurs: M. Leibl, U. Grossner
Publié dans: 2019
Éditeur: BRUSA, ETH

Low frequency test rig for the experimental investigation of intermetallic bond formation in ultrasonic wire bonding

Auteurs: R. Schemmel, T. Hemsel, W. Sextro
Publié dans: International Workshop on Piezoelectric Material and Applications in Actuators, 2019
Éditeur: IWPMA

Partner in Power2Power

Auteurs: -
Publié dans: On site research Campus, 2019
Éditeur: -

Measuring the junction temperature of IGBT module during switched-mode power cycling

Auteurs: S. Simpanen
Publié dans: 2020
Éditeur: Kemppi

CSIC contributions to Power2Power project

Auteurs: CSIC
Publié dans: Madrid Open Science and Innovation Week, 2019
Éditeur: -

Methodology for designing embedded real-time electrothermal models in PYNG Z1 system on chip

Auteurs: J. M. Baron Rufete
Publié dans: 2022
Éditeur: -

CAE elektronickych prvkov: 2/3-D numericke simulácie - Návody na cvicenia

Auteurs: A. Chvala, J. Marek, D. Donoval
Publié dans: Educational scripts, 2022, ISBN 978-80-227-5183-4
Éditeur: Spektrum STU

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