The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade.

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Multiport Electric Vehicle Charger (Task 5.1.5, Month 36)

A laboratory scale demonstrator of 10 kW will be constructed, implementing the selected PEBB concept, which will verify the multiplexing circuit technique functionality and charging power flows. Additionally, an extra 10 kW prototype to test the integration of energy storage into the EV charge will be developed and tested.

Rolling stock PEBB in specific test bench demonstrator (Task 5.1.1, Month 40)

A universal test bench able to provide all the features needed to test the power stacks.

xHP2 PEBB for energy recovery systems in railway specific test bench demonstrator (Task 5.3.2, Month 40)

The purpose of this demonstrator is to assemble and partially test in real-world operating conditions the performance of xHP2 based Power Stacks for energy recovery systems in railway.

10-15kW Rolling stock battery charger-converter (Task 5.1.4, Month 40)

An industrial scale demonstrator for a converter-charger will be manufactured and tested in a simulated environment, subjecting it to typical challenging disturbances encountered in rail vehicles.

Fast DC EV-charger with bi-directional power flow (V2G compatible) (Task 5.3.1, Month 40)

Fast DC EV-charger with bi-directional power flow (V2G compatible) demonstrator to be build. Demonstrator to be built at power range of 2 x 20 kW (output voltage of 500V, 50 A). This size allow to make all necessary tests and comparison, but are still “small scale” model from most of the real cases. Comparison between different component technologies to be made with demonstrator. Demonstrator will also include new design of IGBT related component to get full performance out from developed semiconductors.

Power converter to welding industrial demonstrator (Task 5.2.2, Month 40)

One or two different size welding power sources to be build. In case of result of project two different component size/types to be developed (smaller discrete and larger module IGBTs) then both component types can be demonstrated at different size power source. In case only one component type is available, then one demonstrator. Demonstrator will include also new development at another component related to developed IGBT (ie. driving circuit, passive components etc.) and comparative tests to other technologies.

Automotive inverter demonstrator at TRL5 (Task 5.1.3, Month 36)

An automotive inverter with a power level of up to 80kW and an operating voltage of 800V built from new IGBT modules.

Setup of commutation cell demonstrator in extended operating range (Task 5.2.1,Month 40)

The demonstrator, which will be built and implemented, is a commutation cell of a converter to verify the thermal management and the electrical characteristics.

Battery storage and EV charger (Task 5.3.4, Month 40)

A battery energy system integrated into a power electronics circuit will be installed in the Netherlands in a controlled environment to provide various flexible functions like congestion management, power quality and other functions studied in this task. The theoretical research will be verified and validated in this demonstration site during the course of this project.

Technical power supply demonstrator for the testing of high-performance capacitors (Task 5.3.3, Month 40)

A single demonstrator is currently planned for the technical power supply for the testing of high performance capacitors. This demonstrator will be assembled at the facilities of EAAT and will be validated using high performance capacitors with output currents of over 1000A, voltages up to 800VAC and more. Various tests using a power frequency spectrum (100 or more frequencies up to 2500 Hz) will be run on the capacitors to determine the results of harmonics and other problematic occurrence resulting from renewable energy sources on the power grid on the high performance capacitors. These results will be used for the content of the report regarding the results of the demonstrator.

High-speed driver with regenerative system to grid industrial demonstrator (Task 5.2.3, Month 34)

The demonstrator is a prototype of a drive fulfilling the goals described before capable of driving high speed spindles for the machine tool market and high frequency torque or linear motors. This prototype will be tested under Fagor’s facilities and characterized for validation of models (mainly thermal models). Data will be continuously gathered and transmitted to improve models at real time.

Three-phase electric vehicle charger (Task 5.1.2, Month 40)

Functional laboratory demonstrator of the 11kW three-phase charger with galvanic isolation between the battery and the mains.

Initial online communication (Task 7.1.1, Month 01)

Publish press release at project start and online communication via corporate social media channels.

Automation in Backend facilities: requirements (Task 4.2.1, Month 6)

Report on requirements for and design of automation in backend facilities.

Corporate Design Documentation (Task 7.1.1, Month 01)

The project logo, document templates (reports, letters etc.) and presentation templates will be prepared and distributed before the project start.

Website (Task 7.1.1, Month 01)

The website will be setup as a content management system (CMS) before the official start of the project. The initial contents will be integrated within the first project month.

Publications

Scheduling by High-Performance Computing - An example for AGV considering transport carrier transfers

Author(s): P. Boden, S. Rank, T. Schmidt
Published in: 1. Virtual European Advanced Process Control and Manufacturing Conference, 2021
Publisher: -

Assessing the Impact of Information Assistance Systems on a Worker Level. A Pre-Study towards an Evaluation Framework

Author(s): F. Lindner, D. Winkler, A. Müller, K. Mühlan, S. Keil
Published in: Mensch und Computer: MuC 2020 (online), Issue "Workshop on ""Smart Collaboration – Mitarbeiterzentrierte Informationssysteme in der Produktentstehung""", 2020
Publisher: HSZG
DOI: 10.18420/muc2020-ws116-001

Local Decision Making based on Distributed Digital Twin Framework

Author(s): A. Villalonga, E. Negri, L. Fumagalli, M. Macchi, F. Castaño, R. Haber
Published in: 1st Virtual IFAC World Congress, 2020
Publisher: IFAC-V 2020

Torqe Dynamics Enhancement of Railway Traction Drives Using Scalar Control

Author(s): A. Abouzeid, J. Guerrero, A. Endemano, I. Muniategui, D. Ortega, F. Briz
Published in: IEEE, 2021
Publisher: IEEE

Co-Simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization

Author(s): R. Schemmel, V. Krieger, T. Hemsel, W. Sextro
Published in: 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation, 2020
Publisher: EuroSimE

The influence of electrical stress on the distribution of electrically active defects in IGBT

Author(s): J. Drobny, J. Marek, A. Chvala, J. Faraga, M. Jagelka, L. Stuchlikova
Published in: 2021
Publisher: Stuba

Influence of the gate driver circuit and common source inductance on the short circuit type II & III behavior of IGBT modules and protection

Author(s): Xing L., C. Herrmann, C. Bäumler, J. Kowalsky, J. Lutz
Published in: PCIM Europe 2020 (online), 2020
Publisher: PCIM Europe 2020

Experimentelle Analyse und Modellierung des Verbindungsaufbaus beim Ultraschall-Dickdrahtboden

Author(s): C. Scheidemann, R. Schemmel, T. Hemsel, O. Kirsch, W. Sextro
Published in: IMAPS autumn conference, 2019
Publisher: -

SImulation of electrical poperties and reliability of power IGBT module

Author(s): F. Koval, A. Chvala
Published in: ADEPT 2022: 10th International conference on advances in electronic and photonic technologies, 2022
Publisher: ADEPT

Techno-economical comparison between Si and SiC switches in a VIENNA rectifier

Author(s): Petri Korhonen
Published in: ISIE2021, 2021
Publisher: 30th International Symposium of Industrial Electronics

Electrothermal model of power IGBT for circuit simulation

Author(s): P. Pribytny, A. Chvala, J. Marek, D. Donoval
Published in: ASDAM 2020: 13th International Conference on advanced semiconductor devices and microsystems, 2020
Publisher: ASDAM

Visual analytics framework for condition monitoring in cyber-physical systems

Author(s): A. Villalonga, F. Castano, G. Beruvides, R. Haber, S. Strzelczak, J. Kossakowska
Published in: 23rd International Conference on System Theory, Control and Computing, 2019
Publisher: ICSTCC
DOI: 10.1109/icstcc.2019.8885611

A Review and Implementation Framework of Industrial Augmented Reality

Author(s): K. Mühlan, K. A. Przybysz, F. Lindner, F. Akrmanova, D. Winkler, S. Keil
Published in: 26th IEEE International Conference on Emerging Technologies and Factor Automation, 2021
Publisher: IEEE
DOI: 10.1109/etfa45728.2021.961

Experimental parameter identification and validation of a process model for ultrasonic eavy wire bonding

Author(s): R. Schemmel, N. Müller, L. Klahold, T. Hemsel, W. Sextro
Published in: 2021
Publisher: -

Study of semi-vertical GaN-on-Si FETs by DLFTS with optical excitation

Author(s): J. Drobny, M. Matus, J. Marek, A. Chvala, K. Geens, M. Borga, H. Liang, S. You, S. Decoutere, L. Stuchlikova
Published in: ADEPT 2021: 9th International conference on advances in electronic and photonic technologies, 2021
Publisher: ADEPT

Assessment of Overmodulation Strategies for AC Drives Considering Harmonics Content and Switching Losses

Author(s): A. Abouzeid, J. Guerrero, A. Endemano, Iker, Muniategui, D. Ortega, F. Briz
Published in: 2021
Publisher: IEEE

Power Electronics Building Block: Development and Validation for Traction Converters

Author(s): -
Published in: RailLive! Conference, 2021
Publisher: -

SImulation of Thermo Mechanical Properties and Reliability of Power IGBT Module

Author(s): F. Koval, A. Chvala
Published in: ASDAM 2022: 14th International conference on advanced semiconductor devices and microsystems, 2022
Publisher: ASDAM

Impacts of Different Charging Strategies on the Electric Vehicle Battery Charger Circuit Using Phase-Shift Full-Bridge Converter

Author(s): D. Lyu, T. B. Soeiro, P. Bauer
Published in: IEE PEMC, 2021
Publisher: 19th International Power Electronics and Motion Control Conference

Finding solder cavities in high power modules with temperature sensitive parameters

Author(s): J. Fuhrmann, S. Klauke, H.-G. Eckel
Published in: PCIM Europe 2020 (online), 2020
Publisher: PCIM Europe 2020

Calibration of electrothermal circuit model of power IGBT module

Author(s): A. Chvala, J. Marek, P. Pribytny, J. Kozarik, D. Donoval
Published in: 2021
Publisher: Stuba

Si-Ti-W-AlCu thin film stacks investigated with SThM and TDTR for improved thermal management

Author(s): K. Fladischer, V. Leitgeb, L. Mitterhuber and S. Defregger
Published in: nanoFIS, 2020
Publisher: Functional Integrated nanoSystems Conference

Methodology for Designing Embedded Real Time Electrothermal Models in PYNQ Z1 System on Chip

Author(s): J. M. Baron, F. Vergara, P. J. Arnaiz, M. Vasic
Published in: 2nd Design Mehodologies Conference, 2022
Publisher: IEEE Explore

Lotfehlstellen - elektrisch über temperatursensitive Parameter messbar

Author(s): UROS
Published in: Power Seminconductor Colloquium, 2019
Publisher: -

Lotfehlstellen im Leistungsmodul mit Hilfe einer Zth-Messung erkennen

Author(s): J. Fuhrmann, H. Wang, H.-G- Eckel
Published in: Leistungshalbleiterkolloquium Freiburg, 2021
Publisher: -

Bump planarization to enhance Cu to Cu thermosonic flipchip bonding

Author(s): A. Roshanghias and A. Rodrigues
Published in: ESTC 2020, 2020
Publisher: Electronics System-Integration Technology Conference

Detecting Solderin Quality in Power Modules with Zth in the Loading Phase

Author(s): H. Wang, J. Fuhrmann, H.-G. Eckel
Published in: PCIM Europe 2022, 2022
Publisher: PCIM

Interface management concerning disruptions within supply chains: empricial evidence from the semiconductor industry during the Covid-19 pandemic

Author(s): K. A. Przybysz, F. Lindner, A. Ismail, H. Ehm, S. Keil
Published in: 29th European Operations Management Association Conference 2022, 2022
Publisher: EurOMA

Interface Optimization Potential Concerning Disruptions along the Semiconductor Value Chain

Author(s): K. Przybysz, F. Lindner, K. Mühlan, S. Keil
Published in: 20th European Advanced Process Control and Manufacturing Conferene 2022, 2022
Publisher: APC-M

Electro-thermal simulation analysis and optimization of power IGBT under uis test condition

Author(s): A. Chvala, J. Marek, P. Pribytny, D. Dovonal
Published in: ADEPT 2022: 10th International conference on advances in electronic and photonic technologies, 2022
Publisher: ADEPT

Power2Power Genergal Overview

Author(s): O. Pyper
Published in: EFECS 2020, 2020
Publisher: -

TCAD simulation of improved surge curren capability of power diode module with copper metallization

Author(s): P. Pribytny, A. Chvala, J. Marek, D. Donoval
Published in: ASDAM 2022: 14th International conference on advanced semiconductor devices and microsystems, 2022
Publisher: ASDAM

Finding solder cavities in high power modules with temperature sensitive parameters

Author(s): J. Fuhrmann, S. Klauke, H. G. Eckel
Published in: PCIM, 2020
Publisher: PCIM

Weighted Linear Regression based Data Analytics for Decision Making after Early Failures

Author(s): R. Ross, P. Ypma, G. Koopmans
Published in: 2021
Publisher: IWO

Der Mensch im Mittelunt von Arbeiten und Lernen mit Industrial Augmented Reality

Author(s): K. Mühlan, K. A. Przybysz, F. Lindner, D. Winkler, S. Keil
Published in: 15. Ingenieurspädagogische Jahrestagung 2022, 2022
Publisher: HSZG

Power cycling - methods, measurement accuracy, comparability

Author(s): J. Lutz
Published in: 11th International Conference on Integrated Power Electronics Systems, 2020
Publisher: CIPS 2020

Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding

Author(s): R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro
Published in: 11th International Conference on Integrated Power Electronics Systems, 2020
Publisher: CIPS 2020

Methodology for multi-die package semiconductor Termal Model in a Dynamic Environment

Author(s): J. M. Baron, G. Salinas, X. Mo, F. Vergara, P. J. Arnaiz, P. Alou, M. Vasic
Published in: 28th International Workshop on Electric Drives: Improving Reliability of Electri Drives, 2021
Publisher: IEEE Explore
DOI: 10.1109/iwed52055.2021.9376341

Partner in Power2Power

Author(s): -
Published in: Pwer electronics colloquium, 2019
Publisher: -

Fully Printed Planar Interconnect Technology for Power Module Packaging

Author(s): A. Roshanghias and J. Kaczynski, L. Mitterhuber and S. Defregger
Published in: ESTC 2020,, 2020
Publisher: Electronics System-Integration Technology Conference

Digital twin-based Optimization on the basis of Grey Wolf Method. A Case Study on Motion Control Systems

Author(s): F. Castaño, R. Haber, S. Strzelczak, Z. Miljković, L. Fumagalli, M. Petrović
Published in: IEEE International Conference on Industrial Cyber-Physical Systems, 2020
Publisher: ICPS 2020

Electro-thermal characterizations, compact modeling and tcad based device simulations of power electronics modules

Author(s): P. Pribytny, A. Chvala, J. Marek, D. Donoval
Published in: ADEPT 2022: 10th International conference on advances in electronic and photonic technologies, 2022
Publisher: ADEPT

Low-frequency oscillations analysis in ac railway networks using eigenmode identication

Author(s): P. Frutos, J. M. Guerrero, I. Muniategui, I. Vicente, A. Endemano, F. Briz
Published in: IEEE Explore, 2021
Publisher: IEEE

Modeling of HEMT device using neural network

Author(s): L. Cernaj, A. Chvala, J. Marek, D. Donoval, J. Kozarik, T. Zavodnik
Published in: ADEPT 2020: International conference on advances in electronic and photonic technologies, 2020
Publisher: ADEPT

Learn to shape the digital transformation: the design approach of a learning factory for industrial engineers

Author(s): F. Lindner, D. Winkler, K. Mühlan, U. Wend, S. Keil
Published in: 11th Conference on Learning Factories 2021, 2021
Publisher: CLF
DOI: 10.2139/ssrn.3858409

Complementary SThM and TDTR characterization of Si-Ti-TiN-W-Al thin films for improved thermal management in future transistor technology

Author(s): K. Fladischer, V. Leitgeb, L. Mitterhuber, S. Defregger
Published in: IMAPS, 2020
Publisher: -

Foundry Process for Integrated Galvanic Isolation

Author(s): XFAB-DD
Published in: Silicon Saxony Days, 2019
Publisher: -

Spatial and Thermal Resolution in SThM images: A Study on the Probe's Heating Parameters

Author(s): V. Leitgeb, K. Fladischer, L. Mitterhuber, and S. Defregger
Published in: Therminic 2020 video conference, 2020
Publisher: 26th International Workshop for Thermal Investigations of ICs and Systems

Modified Adaptive Large Neighborhood Search for Scheduling Automated Guided Vehicle fleets considering dynamic transport carrier transfers

Author(s): P. Boden, S. Rank, T. Schmidt
Published in: 2020 Logistics Journal, 2020
Publisher: MDPI

Virtual Resistor Active Damping with Selective Harmonics Control of LCL-Filtered VSCs

Author(s): Y. Wu, T. B. Soeiro, A. Shekhar, P. Bauer
Published in: IEE PEMC, 2021
Publisher: 19th International Power Electronics and Motion Control Conference

Data Analytics for Grid Resilience with Early Failures and Wear-out Failures

Author(s): R. Ross, P. Ypma, G. Koopmans
Published in: 2022
Publisher: IWO

Power Function Algorithm for Linear Regression Weights with Weibull Data Analysis

Author(s): R. Ross
Published in: 2021
Publisher: IWO

Patterning of fine-features in nanoporous films synthesized by spark ablation

Author(s): X. Ju, H.J. van Ginkel, D. Hu, A. Schmidt-Ott, H. van Zeijl, S. Vollebregt, G. Q. Zhang
Published in: IEEE Nano Conference, 2022
Publisher: -

Experimental Investigation of Multidimensional Ultrasoni Heavy Wire Bonding

Author(s): C. Shceidemann, O. Kirsch, T. Hemsel, W. Sextro
Published in: 9th Electronics Systems-Integration technology Conference, 2022
Publisher: ESTC

Influence of substrate geometry and lateral temperature gradiens on the failure mode at power cycling

Author(s): X. Liu, E. Deng, H. Wang, C. Herrmann, T. Basler, J. Lutz
Published in: Microelectronics Reliability, 2021, ISSN 0026-2714
Publisher: Elsevier BV

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Author(s): Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl, Alfred Binder
Published in: Energies, Issue 14/8, 2021, Page(s) 2176, ISSN 1996-1073
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en14082176

Sensor reliability in cyber-physical systems using internet of things data: a review and case study

Author(s): F. Castano, S. Strzelczak, A. Villalonga, R. E. Haber, J. Kossakowska
Published in: IEEE Transactions on Industrial Informatics, 2019, ISSN 1551-3203
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.3390/rs11192252

A humidity-induced novel failure mechanism in power semiconductor diodes

Author(s): J. Leppänen, G. Ross, V. Vuorinen, J. Ingman, J. Jormanainen, M. Paulasto-Kröckel
Published in: Microelectronics Reliability, Issue 123, 2021, Page(s) 114207, ISSN 0026-2714
Publisher: Elsevier BV
DOI: 10.1016/j.microrel.2021.114207

Computer Vision System for Welding Inspection of Liquefied Petroleum Gas Pressure Vessels Based on Combined Digital Image Processing and Deep Learning Techniques

Author(s): Yarens J. Cruz, Marcelino Rivas, Ramón Quiza, Gerardo Beruvides, Rodolfo E. Haber
Published in: Sensors, Issue 20/16, 2020, Page(s) 4505, ISSN 1424-8220
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s20164505

Towards Sustainability of Manufacturing Processes by Multiobjective Optimization: A Case Study on a Submerged Arc Welding Process

Author(s): Daniel Rivas, Ramon Quiza, Marcelino Rivas, Rodolfo E. Haber
Published in: IEEE Access, Issue 8, 2020, Page(s) 212904-212916, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2020.3040196

"Evaluating Cu Printed Interconnects ""Sinterconnects"" versus Wire Bonds for Switching Converters"

Author(s): Md. N. Hasan, T. Polom, D. Holzmann, P. Malago, A. Binder, A. Roshanghias
Published in: electronis, Issue 11, 2022, ISSN 2079-9292
Publisher: MDPI
DOI: 10.3390/electronics11091373

Thermal and spatial resolution in scanning thermal microscopy images: A study on the probe’s heating parameters

Author(s): V. Leitgeb, R. Hammer, L. Mitterhuber, K. Fladischer, F. Peter, A. Buerke, S. Defregger
Published in: Journal of Applied Physics, Issue 129/16, 2021, Page(s) 164502, ISSN 0021-8979
Publisher: American Institute of Physics
DOI: 10.1063/5.0037983

Hydrogen Sulphide (H2S) Single Gas Testing on Power Semiconductor Modules under High Voltage

Author(s): M. Hanf, J.-H. Peters, S. Clausner, N. Kaminski
Published in: Microelectronics Reliability, 2022, ISSN 0026-2714
Publisher: Elsevier BV

Influence of Lateral Temperature Gradients on the Failure Modes at Power Cycling

Author(s): Xing Liu, Erping Deng, Hao Wang, Clemens Herrmann, Thomas Basler, Josef Lutz
Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology, Issue 11/3, 2021, Page(s) 407-414, ISSN 2156-3950
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2021.3058201

Impact of design of small volume Cu3Sn microbumps on its electromigration reliability for 3D ICs

Author(s): N. Tiwary, G. Ross, V. Vuorinen, M. Paulasto-Kröckel
Published in: IEEE Transactions on Electronic Devices, 2022, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers

Torsional Vibration Suppression in Railway Traction Drives

Author(s): A. F. Abouzeid, J. M. Guerrero, I. Vicente-Makazaga, I. Muniategui-Aspiazu, A. Endemano-Isasi, F. Briz
Published in: IEEE Access, Issue 10, 2022, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3162415

Ensemble of convolutional neural networks based on an evolutionary algorithm applied to an industrial welding process

Author(s): Y. J., M. Rivas, R. Quiza, A. Villalonga, R. E. Haber, G. Beruvides
Published in: Computers in Industry, Issue 122, 2021, ISSN 0166-3615
Publisher: Elsevier BV
DOI: 10.1016/j.compind.2021.103530

Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study

Author(s): D. Hu, Z. Cui, J. Fan, X. Fan, G. Zhang
Published in: Results in Physics, Issue 19, 2020, ISSN 2211-3797
Publisher: Elsevier
DOI: 10.1016/j.rinp.2020.103486

Quality monitoring of complex manufacturing systems on the basis of model driven approach

Author(s): F. Castaño, R. E. Haber, W. M. Mohammed, M. Nejman, A. Villalonga, J. L. Martinez Lastra
Published in: Smart Structures and Systems, Issue Volume 26 Issue 4, 2020, ISSN 1738-1584
Publisher: Techno-Press
DOI: 10.12989/sss.2020.26.4.495

Optimal Periodic Variable Switching PWM for Harmonic Performance Enhancement in Grid-Connected Voltage Source Converters

Author(s): Yang Wu, Junzhong Xu, Thiago Batista Soeiro, Marco Stecca, Pavol Bauer
Published in: IEEE Transactions on Power Electronics, Issue Vol.37, No. 6, 2022, Page(s) 7247-7262, ISSN 0885-8993
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tpel.2022.3141268

Aluminium corrosion in power semiconductor devices

Author(s): J. Leppänen, J. Ingman, J.-H. Peters, M. Hanf, R. Ross, G. Koopmans, J. Jormamainen, A. Forsström, G. Ross, N. Kaminski, V. Vuorinen
Published in: Microelectronics Reliability, Issue Volume 137, 2022, ISSN 0026-2714
Publisher: Elsevier BV
DOI: 10.1016/j.microrel.2022.114776

Digital Twin-Based Optimization for Ultraprecision Motion Systems With Backlash and Friction

Author(s): Rodolfo Haber Guerra, Ramon Quiza, Alberto Villalonga, Javier Arenas, Fernando Castano
Published in: IEEE Access, Issue 7, 2019, Page(s) 93462-93472, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2019.2928141

A methodology for high-power drives emulation using a back-to-back configuration

Author(s): F. Briz, M. Saaed, J. M. Guerrero, I. Larrazabal, D. Ortega, I. Ayarzaguena, A. Pulido
Published in: IEEE Access, 2022, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.

Control Strategies for Induction Motors in Railway Traction Applications

Author(s): Ahmed Fathy Abouzeid, Juan Manuel Guerrero, Aitor Endemaño, Iker Muniategui, David Ortega, Igor Larrazabal, Fernando Briz
Published in: Energies, Issue 13/3, 2020, Page(s) 700, ISSN 1996-1073
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en13030700

Cloud-Based Industrial Cyber–Physical System for Data-Driven Reasoning: A Review and Use Case on an Industry 4.0 Pilot Line

Author(s): Alberto Villalonga, Gerardo Beruvides, Fernando Castano, Rodolfo E. Haber
Published in: IEEE Transactions on Industrial Informatics, Issue 16/9, 2020, Page(s) 5975-5984, ISSN 1551-3203
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tii.2020.2971057

A transient thermal measurement on nanomaterial sintered die-attach joints using a termal test chip

Author(s): R. Sattari, D. Hu, X. Liu, H. von Zeijl, S. Vollebregt, G. Q. Zhang
Published in: Applied thermal engineering, 2022, ISSN 1359-4311
Publisher: Pergamon Press Ltd.

Power-Hardware-in-the-Loop Emulation of the Low-Frequency Oscillation Phenomenon in AC Railway Networks

Author(s): F.-G. Paul, J. M. Guerrero, I. Muiategui-Aspiazu, I. Vicente-Makazaga, A. Endemano-Isasi, D. Ortega-Rodriguez, F. Briz
Published in: IEEE Access, Issue 10, 2022, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3198945

Design and Implementation of a Re-configurable Phase-Shift Full-Bridge Converter for Wide Voltage Range EV Charging Application

Author(s): D. Lyu, T. B. Soeiro, P. Bauer
Published in: IEEE Transactions on Transportation Electrification, 2022, ISSN 2332-7782
Publisher: IEEE
DOI: 10.1109/tte.2022.3176826

A decision-making framework for dynamic scheduling of cyber-physical production systems based on digital twins

Author(s): Alberto Villalonga, Elisa Negri, Giacomo Biscardo, Fernando Castano, Rodolfo E. Haber, Luca Fumagalli, Marco Macchi
Published in: Annual Reviews in Control, Issue 51, 2021, Page(s) 357-373, ISSN 1367-5788
Publisher: Pergamon Press Ltd.
DOI: 10.1016/j.arcontrol.2021.04.008

Temperaturanalyse von PCB basierten leistungseletronischen Modulen mit einer erhöhten IGBT Sperrschichttemperatur

Author(s): Michael Schütz
Published in: 2021
Publisher: TUDD

Combined Simulation of Electrical and Ageing Behaviour of Li-ion Automotive Batteries

Author(s): L. Milanesi
Published in: 2021
Publisher: ABB

SPeeding up an endurance test of an IGBT module in switched-mode power cycling

Author(s): E. Kettunen
Published in: 2021
Publisher: VIF

IGBT Structure Function Evaluation Method in Combined Power- and Temperature Cycle Test

Author(s): A. Forsström
Published in: 2021
Publisher: ABB

Measuring the junction temperature of IGBT module during switched-mode power cycling

Author(s): S. Simpanen
Published in: 2020
Publisher: Kemppi

Predictive Health Monitoring of Power Electronics using Machine Learning Techniques

Author(s): E. Blazhevska
Published in: 2022
Publisher: VIF

Wie sinnvoll sind digitale Technologien wirklich?

Author(s): F. Lindner, D. Winkler
Published in: 2020
Publisher: HSZG

Work in Power2Power

Author(s): -
Published in: ECSEL Austria conference, 2019
Publisher: -

Neues EU Forschungsprojekt Power2Power gestartet

Author(s): F. Lindner
Published in: 2019
Publisher: HSZG

Leben und Arbeiten mit erweiterer Realität

Author(s): F. Lindner
Published in: 2021
Publisher: HSZG

Rostocker Elektrotechniker nehmen neuen Prüfplatz ur Vermessung von Leistungshalbleitern in Betrieb

Author(s): J. Fuhrmann
Published in: Press Release, 2020
Publisher: UROS

Power2Power General Overview

Author(s): O. Pyper
Published in: EFECS, 2019
Publisher: -

Augmented Reality trifft auf Halbleiterindustrie

Author(s): K. Przybysz, F. Lindner
Published in: 2022
Publisher: HSZG

Control Strategies for Induction Motors in Railway Traction Applications

Author(s): Ingeteam Traction
Published in: 2020
Publisher: -

Model-free control for machine tools

Author(s): A. Vilagra, C. Join, R. Haber, M. Fliess
Published in: 21st IFAC World Congress, 2020
Publisher: IFAC

M6/M12 report intro and list of publications

Author(s): M. Schulze-Steikow, N. Pluntke
Published in: Online Publication, 2020
Publisher: IFD

European research project Power2Power for more efficient power semiconductors launches in Dresden

Author(s): Infineon
Published in: 2019
Publisher: Infineon

Innosuisse Discover 2019: Power2Power

Author(s): M. Leibl, U. Grossner
Published in: 2019
Publisher: BRUSA, ETH

Low frequency test rig for the experimental investigation of intermetallic bond formation in ultrasonic wire bonding

Author(s): R. Schemmel, T. Hemsel, W. Sextro
Published in: International Workshop on Piezoelectric Material and Applications in Actuators, 2019
Publisher: IWPMA

Partner in Power2Power

Author(s): -
Published in: On site research Campus, 2019
Publisher: -

Measuring the junction temperature of IGBT module during switched-mode power cycling

Author(s): S. Simpanen
Published in: 2020
Publisher: Kemppi

CSIC contributions to Power2Power project

Author(s): CSIC
Published in: Madrid Open Science and Innovation Week, 2019
Publisher: -

Methodology for designing embedded real-time electrothermal models in PYNG Z1 system on chip

Author(s): J. M. Baron Rufete
Published in: 2022
Publisher: -

CAE elektronickych prvkov: 2/3-D numericke simulácie - Návody na cvicenia

Author(s): A. Chvala, J. Marek, D. Donoval
Published in: Educational scripts, 2022, ISBN 978-80-227-5183-4
Publisher: Spektrum STU

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