new generation of High thErmAl efficiency componenTs PACKages for space

Project Information

HEATPACK

Grant agreement ID: 821963

DOI 10.3030/821963

Project closed

EC signature date 24 October 2018

Start date 1 January 2019

End date 31 March 2023

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Space

Total cost € 2 941 298,75

EU contribution € 2 941 298,75

Coordinated by

THALES ALENIA SPACE FRANCE SAS
France

Deliverables

Documents, reports (1)

Thermally Conductive Adhesive film datasheet

Availability of a data sheet describing all the properties of the optimized products whose maturity level is sufficiently high to be marketed

Demonstrators, pilots, prototypes (1)

First active cooler available

First breadboard of a silicon block embedding horizontal micro heat pipes active cooler available

Publications

Conference proceedings (5)

A novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment of packaged devices

Author(s): Zeina Abdallah, Nathawat Poopakdee, James W. Pomeroyand Martin Kuball
Published in: CS MANTECH, 2022
Publisher: CS MANTECH

Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles

Author(s): Marcin Myśliwiec; Ryszard Kisiel; Krystian Pavłov; Mirosław J. Kruszewski
Published in: 45th International Spring Seminar on Electronics Technology (ISSE), 2022
Publisher: IEEE

In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging

Author(s): Nathawat Poopakdee, Zeina Abdallah, James W. Pomeroy, and Martin Kuball
Published in: ACS Applied Electronic Materials, 2022, ISSN 1558-1566
Publisher: American Chemical Society

Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications

Author(s): Ryszard Kisiel; Piotr Śpiewak; Mirosław J. Kruszewski
Published in: 44th International Spring Seminar on Electronics Technology (ISSE), 2021
Publisher: IEEE

Influence of Ag particle shape on mechanical and thermal properties of TIM joints

Author(s): Marcin Myśliwiec, Ryszard Kisiel, Mirosław J. Kruszewski
Published in: Microelectronics International, 2022
Publisher: Emerald Publishing Limited

Other (4)

Multifunctional adhesives through nano-enabling for use in space

Author(s): Nicolas Blasakis, Athanasios Baltopoulos, Antonios Vavouliotis
Published in: 15th International Symposium on Materials in the Space Environment (ISMSE), 2022
Publisher: ESA

High Thermal Conductivity Materials towards Efficient Thermal Management of Electronic Devices

Author(s): Guido Spinola Durante
Published in: SWISS IEEE EPS Webinar Event, 2021
Publisher: IEEE Electronics Packaging Society

Active cooling: a solution for low TCE, high thermal conductivity packages

Author(s): A. Hoogerwerf, T. Frei, G. Spinola Durante, R. Jose James
Published in: IEEE EPS Switzerland Chapter Webinar, 2021
Publisher: IEEE Electronics Packaging Society

Taking the heat out of space applications

Author(s): HEATPACK consortium
Published in: EU Research, 2021
Publisher: EU Research