Deliverables
Newsletter will feature events, future activities, important project results, contributions and success stories. The newsletters will be created as electronic documents and spread using our different communication channels.
D8.5c Electronic NewsletterNewsletter will feature events, future activities, important project results, contributions and success stories. The newsletters will be created as electronic documents and spread using our different communication channels.
D8.6f Electronic NewsletterNewsletter will feature events, future activities, important project results, contributions and success stories. The newsletters will be created as electronic documents and spread using our different communication channels.
D8.4 Social Media Account SetupThe social media accounts as well as the initial content will be set within the first project month.
D8.6b Electronic NewsletterNewsletter will feature events, future activities, important project results, contributions and success stories. The newsletters will be created as electronic documents and spread using our different communication channels.
D8.2 WebsiteThe website will be setup as a content management system (CMS) before the official start of the project. The initial contents will be integrated within the first project month.
D8.6e Electronic NewsletterNewsletter will feature events, future activities, important project results, contributions and success stories. The newsletters will be created as electronic documents and spread using our different communication channels.
D8.8 IoSense ClubFor the IoSense Club, a web community will be created on a privacy-protecting networking platform (preferably WatchOurIdeas). On this platform, innovation actions can be started with a set of dedicated stakeholders.
D8.3 Content Management SystemThe web-blogs will be setup as a content management system (CMS) before the official start of the project. IoSense aims do have domain-specific blogs for different interest groups. Therefore, the creation of new, or the substitution of existing blogs will be done over the whole project period.
D8.6a Electronic NewsletterNewsletter will feature events, future activities, important project results, contributions and success stories. The newsletters will be created as electronic documents and spread using our different communication channels.
D8.7 IoSense NetworkFor the IoSense network, a web community will be created on a social or domain-specific networking platform, such as facebook or WatchOurIdeas.
This deliverable will summarise the applicability of the different IoSense developments for the Smart Mobility Domain and the requested customizations for it. It will also include a report of the results of those proposed customizations in the domain demonstrator. Finally this report will include a gap analysis showing the needed elements to be covered in order to guarantee the full application of IoSense to the domain.
D8.13 Standard Compliance ReportThe complied standards along the entire value chain and deviations from current standards as well as reasons for deviation will be documented in a report. From the deviations suggestions for future standards will be extracted.
D5.3 IoSense for Smart EnergyThis deliverable will summarise the applicability of the different IoSense developments for the Smart Energy Domain and the requested customizations for it. It will also include a report of the results of those proposed customizations in the domain demonstrator. Finally this report will include a gap analysis showing the needed elements to be covered in order to guarantee the full application of IoSense to the domain.
D7.3.2 Risk assessment of reliability risksGeneral assessment of thermo-mechanical reliability risks is performed, weak points are identified and design optimizations are proposed.
D8.11a Report of Networking InitiativesThe list will contain networking activity implemented during the project lifespan. The report will contain a network map of project participants and stakeholders involved.
D5.1 IoSense for Smart Systems IntegrationThis deliverable will summarise the applicability of the different IoSense developments for the Smart Systems Integration Domain and the requested customizations for it. It will also include a report of the results of those proposed customizations in the domain demonstrators. Finally this report will include a gap analysis showing the needed elements to be covered in order to guarantee the full application of IoSense to the domain.
D8.10a IoSense Workshop ReportAlongside with the yearly General Assembly, the consortium plans to have IoSense Workshop once a year to invite external partners and stakeholders and present IoSense results. A summary of those workshops will be documented in a report.
D7.2.2 Reliability- and lifetime prognosis and automation concept for reliability testingReport on reliability- and lifetime prognosis for the considered applications and automation concept of cost-effective test equipment for reliability testing.
D5.5 IoSense for Smart ProductionThis deliverable will summarise the applicability of the different IoSense developments for the Smart Production Domain and the requested customizations for it. It will also include a report of the results of those proposed customizations in the domain demonstrator. Finally this report will include a gap analysis showing the needed elements to be covered in order to guarantee the full application of IoSense to the domain.
D5.2 IoSense for Smart Society andThis deliverable will summarise the applicability of the different IoSense developments for the Smart Society and Health Domain and the requested customizations for it. It will also include a report of the results of those proposed customizations in the domain demonstrators. Finally this report will include a gap analysis showing the needed elements to be covered in order to guarantee the full application of IoSense to the domain.
IoSense will organize two summer schools, one in year 2 (TUD) and one in year 3 (Delft).
D8.9b IoSense Summer SchoolIoSense will organize two summer schools, one in year 2 (TUD) and one in year 3 (Delft).
D8.1 Corporate Design DocumentationThe project logo, document templates (reports, letters etc.) and presentation templates will be prepared and distributed before the project start.
Publications
Author(s):
Angelos Antonopoulos, Christos Verikoukis
Published in:
IEEE Transactions on Industrial Informatics, Issue 14/4, 2018, Page(s) 1436-1446, ISSN 1551-3203
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/TII.2017.2754579
Author(s):
Gerardo Beruvides, Fernando Castaño, Rodolfo E. Haber, Ramón Quiza, Alberto Villalonga
Published in:
Complexity, Issue 2017, 2017, Page(s) 1-11, ISSN 1076-2787
Publisher:
John Wiley & Sons Inc.
DOI:
10.1155/2017/7317254
Author(s):
Wolfgang Granig, Dirk Hammerschmidt, Hubert Zangl
Published in:
SAE International Journal of Passenger Cars - Electronic and Electrical Systems, Issue 10/1, 2017, ISSN 1946-4622
Publisher:
SAE International
DOI:
10.4271/2017-01-0015
Author(s):
Rodolfo E. Haber, Gerardo Beruvides, Ramon Quiza, Alejandro Hernandez
Published in:
IEEE Access, Issue 5, 2017, Page(s) 22272-22281, ISSN 2169-3536
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/ACCESS.2017.2764047
Author(s):
Ali Roshanghias, Matic Krivec, Marcus Baumgart
Published in:
Flexible and Printed Electronics, Issue 2/4, 2017, Page(s) 045002, ISSN 2058-8585
Publisher:
IOP Publishing Ltd
DOI:
10.1088/2058-8585/aa8ed8
Author(s):
Prodromos-Vasileios Mekikis, Elli Kartsakli, Angelos Antonopoulos, Luis Alonso, Christos Verikoukis
Published in:
IEEE Transactions on Wireless Communications, Issue 17/4, 2018, Page(s) 2389-2401, ISSN 1536-1276
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/TWC.2018.2794963
Author(s):
Hubert Zangl, Lisa-Marie Faller, Wolfgang Granig
Published in:
COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Issue 36/5, 2017, Page(s) 1372-1385, ISSN 0332-1649
Publisher:
Emerald Group Publishing Ltd.
DOI:
10.1108/COMPEL-02-2017-0099
Author(s):
Wolfgang Granig, Lisa-Marie Faller, Hubert Zangl
Published in:
Microelectronics Reliability, Issue 87, 2018, Page(s) 113-124, ISSN 0026-2714
Publisher:
Elsevier BV
DOI:
10.1016/j.microrel.2018.06.005
Author(s):
Thomas Ulz, Thomas Pieber, Andrea Holler, Sarah Haas, Christian Steger
Published in:
IEEE Journal of Radio Frequency Identification, Issue 1/1, 2017, Page(s) 75-84, ISSN 2469-7281
Publisher:
IEEE Journal of Radio Frequency Identification
DOI:
10.1109/jrfid.2017.2745510
Author(s):
L-M Faller, W Granig, M Krivec, A Abram, H Zangl
Published in:
Journal of Micromechanics and Microengineering, Issue 28/10, 2018, Page(s) 104002, ISSN 0960-1317
Publisher:
Institute of Physics Publishing
DOI:
10.1088/1361-6439/aaadf4
Author(s):
Stefan Jaksic, Ezio Bartocci, Radu Grosu, Dejan Nickovic
Published in:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Issue 37/11, 2018, Page(s) 2233-2243, ISSN 0278-0070
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tcad.2018.2858460
Author(s):
Robert Wimmer-Teubenbacher, Florentyna Sosada-Ludwikowska, Bernat Travieso, Stefan Defregger, Oeznur Tokmak, Jan Niehaus, Marco Deluca, Anton Köck
Published in:
Chemosensors, Issue 6/4, 2018, Page(s) 56, ISSN 2227-9040
Publisher:
Chemosensors 2018
DOI:
10.3390/chemosensors6040056
Author(s):
Romana Boiger, Stefan Defregger, Mirza Grbic, Anton Köck, Manfred Mücke, Robert Wimmer-Teubenbacher, Bernat Zaragoza Travieso
Published in:
Proceedings, Issue 2/13, 2018, Page(s) 1058, ISSN 2504-3900
Publisher:
EUROSENSORS 2018
DOI:
10.3390/proceedings2131058
Author(s):
Fernando Castaño, Gerardo Beruvides, Alberto Villalonga, Rodolfo Haber
Published in:
Sensors, Issue 18/5, 2018, Page(s) 1508, ISSN 1424-8220
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s18051508
Author(s):
Mai, C., Grzelak, D., Zia, M., D.Lemme, & Aßmann, U.
Published in:
ijimt, 2019, ISSN 2010-0248
Publisher:
International Journal of Innovation, Management and Technology
Author(s):
Artuñedo, A., del Toro, R. M., & Haber, R. E.
Published in:
Sensors, Issue 17/5, 2017, Page(s) 953, ISSN 1424-8220
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s17050953
Author(s):
Juliana P. Leitzke, Astrid Della Mea, Lisa-Marie Faller, Stephan Mühlbacher-Karrer, Hubert Zangl
Published in:
Measurement, Issue 122, 2018, Page(s) 459-465, ISSN 0263-2241
Publisher:
Elsevier BV
DOI:
10.1016/j.measurement.2017.12.042
Author(s):
Marcus Baumgart, Markus Dielacher, Norbert Druml, Cristina Consani
Published in:
Proceedings, Issue 1/4, 2017, Page(s) 287, ISSN 2504-3900
Publisher:
MDPI
DOI:
10.3390/proceedings1040287
Author(s):
Alberto Villalonga, Gerardo Beruvides, Fernando Castaño, Rodolfo E. Haber, Marcelino Novo
Published in:
IFAC-PapersOnLine, Issue 51/11, 2018, Page(s) 200-204, ISSN 2405-8963
Publisher:
INCOM2018
DOI:
10.1016/j.ifacol.2018.08.259
Author(s):
Cristina Consani, Norbert Druml, Markus Dielacher, Marcus Baumgart
Published in:
Proceedings, Issue 2/13, 2018, Page(s) 859, ISSN 2504-3900
Publisher:
MDPI Journal
DOI:
10.3390/proceedings2130859
Author(s):
Wolfgang Granig, Lisa-Marie Faller, Dirk Hammerschmidt, Hubert Zangl
Published in:
Reliability Engineering & System Safety, Issue 190, 2019, Page(s) 106522, ISSN 0951-8320
Publisher:
Elsevier BV
DOI:
10.1016/j.ress.2019.106522
Author(s):
Castaño, F., Beruvides, G., Haber, R. E., & Artuñedo, A.
Published in:
Sensors, Issue 17/9, 2017, Page(s) 2109, ISSN 1424-8220
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s17092109
Author(s):
Marcus Baumgart, Cristina Consani, Markus Dielacher, Norbert Druml
Published in:
2017 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), 2017, Page(s) 1-1, ISBN 978-1-5090-6736-7
Publisher:
IEEE
DOI:
10.1109/CLEOE-EQEC.2017.8086908
Author(s):
Fernando Castaño, Gerardo Beruvides, Rodolfo E. Haber, Alberto Villalonga
Published in:
Proceedings, Issue 1/8, 2017, Page(s) 809, ISSN 2504-3900
Publisher:
MDPI
DOI:
10.3390/proceedings1080809
Author(s):
Norbert Druml, Bernhard Rutte-Vas, Sandra Wilfling, Cristina Consani, Marcus Baumgart, Thomas Herndl, Gerald Holweg
Published in:
2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), 2017, Page(s) 1-7, ISBN 978-1-5090-6505-9
Publisher:
IEEE
DOI:
10.1109/ETFA.2017.8247647
Author(s):
Wolfgang Granig, Dirk Hammerschmidt, Hubert Zangl
Published in:
2017 IEEE SENSORS, 2017, Page(s) 1-3, ISBN 978-1-5090-1012-7
Publisher:
IEEE
DOI:
10.1109/ICSENS.2017.8234088
Author(s):
Lisa-Marie Faller, Hubert Zangl
Published in:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017, Page(s) 1-6, ISBN 978-1-5090-4344-6
Publisher:
IEEE
DOI:
10.1109/EuroSimE.2017.7926279
Author(s):
Matic Krivec, Ali Roshanghias, Alfred Binder
Published in:
Proceedings, Issue 1/4, 2017, Page(s) 609, ISSN 2504-3900
Publisher:
MDPI
DOI:
10.3390/proceedings1040609
Author(s):
Johannes Manz, Gabriele Bosetti, Alfons Dehe, Gabriele Schrag
Published in:
2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017, Page(s) 67-70, ISBN 978-1-5386-2732-7
Publisher:
IEEE
DOI:
10.1109/TRANSDUCERS.2017.7993989
Author(s):
Carl Mai, René Schöne, Johannes Mey, Thomas Kühn, Uwe Aßmann
Published in:
Thinkmind, 2018, Page(s) 15-23, ISBN 978-1-61208-610-1
Publisher:
IARIA
Author(s):
Radu-Emil Precup, Teodor-Adrian Teban, Thiago Eustaquio Alves de Oliveira, Emil M. Petriu
Published in:
2016 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE), 2016, Page(s) 72-77, ISBN 978-1-5090-0626-7
Publisher:
IEEE
DOI:
10.1109/FUZZ-IEEE.2016.7737670
Author(s):
Thomas W. Pieber, Thomas Ulz, Christian Steger
Published in:
Proceedings of the 7th International Conference on Simulation and Modeling Methodologies, Technologies and Applications, 2017, Page(s) 65-72, ISBN 978-989-758-265-3
Publisher:
SCITEPRESS - Science and Technology Publications
DOI:
10.5220/0006404800650072
Author(s):
Thomas Ulz, Thomas Pieber, Christian Steger, Sarah Haas, Rainer Matischek
Published in:
2017 IEEE International Conference on RFID Technology & Application (RFID-TA), 2017, Page(s) 260-265, ISBN 978-1-5386-1833-2
Publisher:
IEEE
DOI:
10.1109/RFID-TA.2017.8098906
Author(s):
Thomas Ulz, Thomas Pieber, Christian Steger, Sarah Haas, Holger Bock, Rainer Matischek
Published in:
2017 IEEE International Conference on Industrial Technology (ICIT), 2017, Page(s) 1430-1435, ISBN 978-1-5090-5320-9
Publisher:
IEEE
DOI:
10.1109/ICIT.2017.7915575
Author(s):
W.D. van Driel, B. Jacobs, D. Schenkelaars, M. Klompenhouwer, R. Poelma, B. El Mansouri, L.M. Middelburg
Published in:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017, Page(s) 1-4, ISBN 978-1-5090-4344-6
Publisher:
IEEE
DOI:
10.1109/EuroSimE.2017.7926293
Author(s):
Thomas W. Pieber, Thomas Ulz, Christian Steger, Rainer Matischek
Published in:
2017, Page(s) 632-642
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-319-64701-2_50
Author(s):
Oliver Zendel, Katrin Honauer, Markus Murschitz, Martin Humenberger, Gustavo Fernandez Dominguez
Published in:
2017 IEEE Conference on Computer Vision and Pattern Recognition (CVPR), 2017, Page(s) 6670-6680, ISBN 978-1-5386-0457-1
Publisher:
IEEE
DOI:
10.1109/CVPR.2017.706
Author(s):
Florian Wenig, Peter Klanatsky, Christian Heschl, Cristinel Mateis, Nickovic Dejan
Published in:
2017 IEEE 26th International Symposium on Industrial Electronics (ISIE), 2017, Page(s) 1507-1512, ISBN 978-1-5090-1412-5
Publisher:
IEEE
DOI:
10.1109/ISIE.2017.8001469
Author(s):
Thomas Ulz, Thomas Pieber, Christian Steger, Christian Lesjak, Holger Bock, Rainer Matischek
Published in:
2017 IEEE International Conference on RFID (RFID), 2017, Page(s) 41-46, ISBN 978-1-5090-4576-1
Publisher:
IEEE
DOI:
10.1109/RFID.2017.7945585
Author(s):
Alberto Villalonga, Gerardo Beruvides, Fernando Castano, Rodolfo Haber
Published in:
2018 IEEE Industrial Cyber-Physical Systems (ICPS), 2018, Page(s) 637-642, ISBN 978-1-5386-6531-2
Publisher:
IEEE
DOI:
10.1109/icphys.2018.8390780
Author(s):
M. Baumgart, N. Druml, M. Consani
Published in:
ISPRS - International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences, Issue XLII-2, 2018, Page(s) 83-89, ISSN 2194-9034
Publisher:
ISPRS TC II Symposium
DOI:
10.5194/isprs-archives-xlii-2-83-2018
Author(s):
Josef Steinbaeck, Norbert Druml, Allan Tengg, Christian Steger, Bernhard Hillbrand
Published in:
2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4, ISBN 978-1-5386-7490-1
Publisher:
IEEE
DOI:
10.1109/asdam.2018.8544683
Author(s):
Jordi Serra, David Pubill, Christos Verikoukis
Published in:
2017 IEEE International Symposium on Signal Processing and Information Technology (ISSPIT), 2017, Page(s) 163-167, ISBN 978-1-5386-4662-5
Publisher:
IEEE
DOI:
10.1109/isspit.2017.8388635
Author(s):
Saud Althunibat, Angelos Antonopoulos, Elli Kartsakli, Fabrizio Granelli, Christos Verikoukis
Published in:
IEEE Sensors Journal, 2016, Page(s) 1-1, ISSN 1530-437X
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/jsen.2016.2606759
Author(s):
W. D. van Driel, J.G.J. Beijer, J.W. Bikker, C.H.M. van Blokland, C. Ankomah, B. Jacobs
Published in:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018, Page(s) 1-6, ISBN 978-1-5386-2359-6
Publisher:
IEEE
DOI:
10.1109/eurosime.2018.8369875
Author(s):
David Pubill, Jordi Serra, Christos Verikoukis
Published in:
2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD), 2018, Page(s) 1-6, ISBN 978-1-5386-6151-2
Publisher:
IEEE
DOI:
10.1109/camad.2018.8514995
Author(s):
Angelos Antonopoulos, Christos Verikoukis
Published in:
2016 IEEE 14th International Conference on Industrial Informatics (INDIN), 2016, Page(s) 1024-1027, ISBN 978-1-5090-2870-2
Publisher:
IEEE
DOI:
10.1109/indin.2016.7819313
Author(s):
A. Kock, M. Deluca, F. Sosada-Ludwikowska, R. Wimmer-Teubenbacher, E. Lackner, K. Rohracher, E. Wachmann, J. S. Niehaus, S. Becker, S. Steinhauer, M. Sowwan, V. Singh, O. Tokmak
Published in:
2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-5, ISBN 978-1-5386-7490-1
Publisher:
IEEE
DOI:
10.1109/asdam.2018.8544608
Author(s):
R. Wimmer-Teubenbacher, S. Defregger, R. Boiger, A. Kock, I. Hotovy, M. Mikolasek, M. Predanocy, G. Toschkoff
Published in:
2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-5, ISBN 978-1-5386-7490-1
Publisher:
IEEE
DOI:
10.1109/asdam.2018.8544639
Author(s):
Romana Boiger, Stefan Defregger, Anton Kock, Manfred Mucke, Robert Wimmer-Teubenbacher, Gregor Toschkoff
Published in:
2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4, ISBN 978-1-5386-7490-1
Publisher:
IEEE
DOI:
10.1109/asdam.2018.8544491
Author(s):
Albrecht, J., Weissbach, M., Vobl, M., Krumbein, U., & Rzepka, S
Published in:
Nanoindentation and Coupled Finite Element Analysis for Robustness and Design Evaluation of MEMS-Microphones, 2018, Page(s) 225, ISBN 978-1-5386-7488-8
Publisher:
IEEE
Author(s):
B. Jacobs, W. D. van Driel, M. Schuld
Published in:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018, Page(s) 1-4, ISBN 978-1-5386-2359-6
Publisher:
IEEE
DOI:
10.1109/eurosime.2018.8369895
Author(s):
Jorge Godoy, Rodolfo Haber, Juan Muñoz, Fernando Matía, Álvaro García
Published in:
Sensors, Issue 18/7, 2018, Page(s) 2092, ISSN 1424-8220
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s18072092
Author(s):
Marcus Baumgart, Norbert Druml, Markus Dielacher, Cristina Consani
Published in:
Proceedings, Issue 2/13, 2018, Page(s) 1056, ISSN 2504-3900
Publisher:
MDPI
DOI:
10.3390/proceedings2131056
Author(s):
Leonardo Gonzalez Alarcon, Myriam Elizabeth Vaca Recalde, Mauricio Marcano, Enrique Marti
Published in:
2018 IEEE International Conference on Vehicular Electronics and Safety (ICVES), 2018, Page(s) 1-6, ISBN 978-1-5386-3543-8
Publisher:
IEEE
DOI:
10.1109/icves.2018.8519586
Author(s):
M. Baumgart, N. Druml, M. Dielacher, C. Consani
Published in:
2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-2, ISBN 978-1-5386-7490-1
Publisher:
IEEE
DOI:
10.1109/asdam.2018.8544507
Author(s):
Thomas Ulz, Thomas Pieber, Christian Steger, Andrea Holler, Sarah Haas, Rainer Matischek
Published in:
2018 IEEE 13th International Symposium on Industrial Embedded Systems (SIES), 2018, Page(s) 1-8, ISBN 978-1-5386-4155-2
Publisher:
IEEE
DOI:
10.1109/sies.2018.8442106
Author(s):
Thomas Ulz, Thomas Pieber, Christian Steger, Sarah Haas, Rainer Matischek
Published in:
2018 IEEE International Conference on RFID (RFID), 2018, Page(s) 1-8, ISBN 978-1-5386-1456-3
Publisher:
IEEE
DOI:
10.1109/rfid.2018.8376190
Author(s):
Norbert Druml, Thomas Pietsch, Markus Dielacher, Christian Steger, Marcus Baumgart, Cristina Consani, Thomas Herndl, Gerald Holweg
Published in:
2018 21st Euromicro Conference on Digital System Design (DSD), 2018, Page(s) 450-457, ISBN 978-1-5386-7377-5
Publisher:
IEEE
DOI:
10.1109/dsd.2018.00081
Author(s):
Thang Phan Duy
Published in:
Proceedings of the Seventh International Conference on Telecommunications and Remote Sensing - ICTRS '18, 2018, Page(s) 17-20, ISBN 9781-450365802
Publisher:
ACM Press
DOI:
10.1145/3278161.3278164
Author(s):
Gabriele Bosetti, Johannes Manz, Gabriele Schrag, Alfons Dehe
Published in:
2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2017, Page(s) 1-5, ISBN 978-1-5386-2952-9
Publisher:
IEEE
DOI:
10.1109/dtip.2017.7984459
Author(s):
L.M. Middelburg, B. El Mansouri, Rene Poelma, G.Q. Zhang, Henk Van Zeijl, Jia Wei
Published in:
2018 IEEE SENSORS, 2018, Page(s) 1-4, ISBN 978-1-5386-4707-3
Publisher:
IEEE
DOI:
10.1109/icsens.2018.8589630
Author(s):
L. M. Middelburg, B. El Mansouri, R. H. Poelma, H. W. van Zeijl, J. Wei, G. Q. Zhang, W. D. van Driel
Published in:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018, Page(s) 1-3, ISBN 978-1-5386-2359-6
Publisher:
IEEE
DOI:
10.1109/eurosime.2018.8369954
Author(s):
Thomas Ulz, Thomas Pieber, Christian Steger, Sarah Haas, Rainer Matischek
Published in:
2018 IEEE Industrial Cyber-Physical Systems (ICPS), 2018, Page(s) 812-817, ISBN 978-1-5386-6531-2
Publisher:
IEEE
DOI:
10.1109/icphys.2018.8390811
Author(s):
Wolfgang Granig, Slimane Aoudjit, Lisa Marie Faller, Hubert Zangl
Published in:
2018 International Conference of Electrical and Electronic Technologies for Automotive, 2018, Page(s) 1-5, ISBN 978-8-8872-3738-2
Publisher:
IEEE
DOI:
10.23919/eeta.2018.8493172
Author(s):
Thomas Ulz, Thomas Pieber, Christian Steger, Rainer Matischek, Holger Bock
Published in:
2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), 2017, Page(s) 1-8, ISBN 978-1-5090-6505-9
Publisher:
IEEE
DOI:
10.1109/etfa.2017.8247636
Author(s):
Uwe Aßmann, Dominik Grzelak, Johannes Mey, Dmytro Pukhkaiev, René Schöne, Christopher Werner, Georg Püschel
Published in:
SOFSEM 2019: Theory and Practice of Computer Science - 45th International Conference on Current Trends in Theory and Practice of Computer Science, Nový Smokovec, Slovakia, January 27-30, 2019, Proceedings, Issue 11376, 2019, Page(s) 1-20, ISBN 978-3-030-10800-7
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-10801-4_1
Author(s):
Johannes Manz, Alfons Dehe, Gabriele Schrag
Published in:
Smart Sensors, Actuators, and MEMS VIII, 2017, Page(s) 1024608
Publisher:
SPIE
DOI:
10.1117/12.2266014
Author(s):
Wolfgang Granig, Friedrich Rasbornig, Dirk Hammerschmidt, Mario Motz, Thomas Zettler, Michael Strasser, Alessandro Michelutti
Published in:
SAE Technical Paper Series, 2017
Publisher:
SAE International
DOI:
10.4271/2017-01-0053
Author(s):
Erwin Schoitsch
Published in:
Schriftenreihe Informatik, Issue 47, 2018, Page(s) 153-165, ISBN 978-3-99062-339-8
Publisher:
Trauner Verlag
DOI:
10.5281/zenodo.2590949
Author(s):
Albrecht, J., Weissbach, M., Vobl, M., Krumbein, U., & Rzepka, S.
Published in:
2018
Publisher:
not yet published
Author(s):
Della Mea, A., Padilha Leitzke, J., & Zangl, H. (2018)
Published in:
2018
Publisher:
Auersbach
Author(s):
Grzelak, D., Mey, J., & Aßmann, U.
Published in:
2018, ISBN 1-60132-476-6
Publisher:
Int'l Conf. Foundations of Computer Science
Author(s):
Mikolášek, M., Ondrejka, P., Chymo, F., Řeháček, V., Predanocy, M., Kostič, I., & Hotový, I.
Published in:
2018, ISBN 978-1-5386-7488-8
Publisher:
IEEE
Author(s):
Thomas Ulz, Thomas Pieber, Christian Steger, Sarah Haas, Rainer Matischek, Holger Bock
Published in:
2017 Euromicro Conference on Digital System Design (DSD), 2017, Page(s) 229-236, ISBN 978-1-5386-2146-2
Publisher:
IEEE
DOI:
10.1109/dsd.2017.24
Author(s):
Mueller, J.
Published in:
2018
Publisher:
SEMICON Europa
Author(s):
Dehe, A.
Published in:
2017
Publisher:
SPIE Micro Technologies Conference
Author(s):
Theuss, H.
Published in:
2017
Publisher:
Aalto Universit
Author(s):
Theuss, H.
Published in:
2018
Publisher:
IEMT
Author(s):
Ali Roshanghias, Matic Krivec, Jochen Bardong, Alfred Binder
Published in:
2020
Publisher:
NYP
Author(s):
Boiger, R., Defregger, S., Grbic, M., Köck, A., Mücke, M., Wimmer-Teubenbacher, R., & Zaragoza Travieso, B.
Published in:
2020
Publisher:
Not Yet Published
Author(s):
Dominik Grzelak, Carl Mai, Uwe Aßmann
Published in:
Proceedings of the 4th International Conference on Internet of Things, Big Data and Security, 2019, Page(s) 197-206, ISBN 978-989-758-369-8
Publisher:
SCITEPRESS - Science and Technology Publications
DOI:
10.5220/0007414101970206
Author(s):
Mikolasek, M., Meri, J., Chymo, F., Ondrejka, P., Rehacek, V., Predanocy, M., . . . Hotovy, I
Published in:
2020
Publisher:
IOP Science Journal of Physics
Author(s):
Mitterer, T., & Zangl, H.
Published in:
2020
Publisher:
Not Published Yet
Author(s):
Mitterer, T., & Zangl, H.
Published in:
2020
Publisher:
Not Published Yet
Author(s):
o. A.
Published in:
2020
Publisher:
Not Published Yet
Author(s):
Pham, N. P., Du Bois, B., Van Hoof, R., Winderickx, G., Tyagi, H. K., Sabuncuoglu, D., & Tilmans, H. A.
Published in:
2020
Publisher:
Not Published Yet
Author(s):
Predanocy, M., Hotový, I., Mikolášek, M., Botcher, R., & Spiess, L
Published in:
OP Science Journal of Physics: Conference Series, 2020
Publisher:
Not Published Yet
Author(s):
TECNALIA + VIF
Published in:
10th IAV 2019 Intelligent Autonomous Vehicles, 2020
Publisher:
Not Published Yet
Author(s):
Theuss, H. et al.
Published in:
ECTC (Electronics Components Technology Conference), 2020
Publisher:
Not Yet Published
Author(s):
Ulz, T., Pieber, T., Steger, C., Haas, S., & Matischek, R.
Published in:
IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2018, 2020
Publisher:
Not Published Yet
Author(s):
Wimmer-Teubenbacher, R., Sosada-Ludwikowska, F., Defregger, S., & Köck, A.
Published in:
Eurosensors 2018 Conference on Digital System Design (DSD)., 2020
Publisher:
Not Published Yet
Author(s):
Ray Lattarulo (TECNALIA), Joshue Perez (TECNALIA), Martin Dendaluce (TECNALIA)
Published in:
IFAC 2017 Conference, Issue July 9-12, 2017, 2017
Publisher:
IFAC 2017 Conference
Author(s):
Thomas ULZ (TUG), Christian STEGER (TUG), Holger BOCK (IFAT), Thomas RUPRECHTER (IFAT)
Published in:
IEEE RFID 2017, Issue May 9-11, 2017, 2017
Publisher:
IEEE RFID 2017
Author(s):
Reinhard Kloibhofer, Erwin Kristen, Stefan Jakšić
Published in:
Developments in Language Theory - 22nd International Conference, DLT 2018, Tokyo, Japan, September 10-14, 2018, Proceedings, Issue 11088, 2018, Page(s) 190-201, ISBN 978-3-319-98653-1
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-319-99229-7_17
Author(s):
Kostas Ramantas, Elli Kartsakli, Mikel Irazabal, Angelos Antonopoulos, Christos Verikoukis
Published in:
Interactive Mobile Communication Technologies and Learning, Issue 725, 2018, Page(s) 791-796, ISBN 978-3-319-75174-0
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-319-75175-7_77
Author(s):
John S. Vardakas, Elli Kartsakli, Sotirios Papaioannou, George Kalfas, Nikos Pleros, Angelos Antonopoulos, Christos Verikoukis
Published in:
Interactive Mobile Communication Technologies and Learning, Issue 725, 2018, Page(s) 797-804, ISBN 978-3-319-75174-0
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-319-75175-7_78
Author(s):
Thomas W. Pieber, Thomas Ulz, Christian Steger
Published in:
Simulation and Modeling Methodologies, Technologies and Applications - 7th International Conference, SIMULTECH 2017 Madrid, Spain, July 26–28, 2017 Revised Selected Papers, Issue 873, 2019, Page(s) 241-256, ISBN 978-3-030-01469-8
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-01470-4_13
Author(s):
Erwin Schoitsch
Published in:
Schriftenreihe Informatik, Issue 46, 2017, Page(s) 361-374, ISBN 978-3-99062-119-6
Publisher:
Trauner Verlag
DOI:
10.5281/zenodo.1043960
Author(s):
J. Albrecht, G. Gadhiya, S. Rzepka
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 317-330, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_11
Author(s):
Raffaele Coppeta, Ayoub Lahlalia, Darjan Kozic, René Hammer, Johann Riedler, Gregor Toschkoff, Anderson Singulani, Zeeshan Ali, Martin Sagmeister, Sara Carniello, Siegfried Selberherr, Lado Filipovic
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 17-72, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_2
Author(s):
Marcus Baumgart, Norbert Druml, Cristina Consani
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 93-147, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_4
Author(s):
Norbert Druml, Thomas Pietsch, Marcus Baumgart, Cristina Consani, Thomas Herndl, Gerald Holweg
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 179-199, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_6
Author(s):
Granig, W., Faller, L.-M., Zangl, H.
Published in:
2020
Publisher:
Springer
Author(s):
Dominik Grzelak, Carl Mai, René Schöne, Jan Falkenberg, Uwe Aßmann
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 253-282, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_9
Author(s):
J. Kjellman, N. Hosseini, Jeong Hwan Song, T. Tongnyuy, S. Dwivedi, B. Troia, B. Figeys, S. Kerman, A. Stassen, P. Neutens, S. Severi, R. Jansen, P. Soussan, S. S. Saseendran, A. Marinins, X. Rottenberg
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 427-447, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_15
Author(s):
B. El Mansouri, W. D. van Driel, G. Q. Zhang
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 397-425, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_14
Author(s):
L. M. Middelburg, W. D. van Driel, G. Q. Zhang
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 1-15, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_1
Author(s):
J. Murgoitio Larrauri, E. D. Martí Muñoz, M. E. Vaca Recalde, B. Hillbrand, A. Tengg, Ch. Pilz, N. Druml
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 331-365, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_12
Author(s):
Thomas Wolfgang Pieber, Thomas Ulz, Christian Steger
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 227-251, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_8
Author(s):
Jordi Serra, David Pubill, Christos Verikoukis
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 201-226, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_7
Author(s):
Horst Theuss, Stefan Kolb, Matthias Eberl, Rainer Schaller
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 73-92, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_3
Author(s):
W. D. van Driel, L. M. Middelburg, B. El Mansouri, B. J. C. Jacobs
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 367-395, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_13
Author(s):
Fernando Castaño, Gerardo Beruvides, Alberto Villalonga, Rodolfo E. Haber
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 149-178, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_5
Author(s):
Wolfgang Granig, Lisa-Marie Faller, Hubert Zangl
Published in:
Sensor Systems Simulations - From Concept to Solution, 2020, Page(s) 283-316, ISBN 978-3-030-16576-5
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-16577-2_10
Author(s):
Thomas Wolfgang Pieber, Thomas Ulz, Christian Steger
Published in:
2019, ISBN 978-3-030-01470-4
Publisher:
Springer
DOI:
10.1007/978-3-030-01470-4
Author(s):
Van Driel, W.D., Pyper, O., Schumann, C.
Published in:
2020, ISBN 978-3-030-16577-2
Publisher:
Springer
DOI:
10.1007/978-3-030-16577-2
Intellectual Property Rights
Application/Publication number:
SK
271-2017
Date:
2017-12-08
Applicant(s):
POWERTEC SRO
Application/Publication number:
SK
8459
Date:
2017-10-25
Applicant(s):
POWERTEC SRO
Application/Publication number:
SK
28513
Date:
2017-12-08
Applicant(s):
POWERTEC SRO
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