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Origami electronics for three dimensional integration of computational devices

Leistungen

Report on a 2DM circuit library

Report on a 2DM circuit library in the form of a publishable white book

Report on integrated circuit and neuron element

A report will be provided on integrated logic circuits and neuron elements developed within this project. The report will be made public in the format of a white book.

Report on the stacked NMOS/CMOS platform demonstrator

Final report on the stacked NMOS/CMOS platform demonstrator including key performance parameters.

Communication Plan

A communication plan for the project will be provided.

Report on neuromorphic architecture

Final report on neuromorphic architecture including key parameters.

Project website

Project website online including public and internal site.

Open workshop

An open workshop on TMDC based flexible logic and folding will be organized.

Veröffentlichungen

Analogue two-dimensional semiconductor electronics

Autoren: Dmitry K. Polyushkin, Stefan Wachter, Lukas Mennel, Matthias Paur, Maksym Paliy, Giuseppe Iannaccone, Gianluca Fiori, Daniel Neumaier, Barbara Canto, Thomas Mueller
Veröffentlicht in: Nature Electronics, Ausgabe 3/8, 2020, Seite(n) 486-491, ISSN 2520-1131
Herausgeber: Nature Springer
DOI: 10.1038/s41928-020-0460-6

Stable Al2O3 Encapsulation of MoS2-FETs Enabled by CVD Grown h-BN

Autoren: Agata Piacentini, Damiano Marian, Daniel S. Schneider, Enrique González Marín, Zhenyu Wang, Martin Otto, Bárbara Canto, Aleksandra Radenovic, Andras Kis, Gianluca Fiori, Max C. Lemme, and Daniel Neumaier
Veröffentlicht in: Advanced Electronic Materials, 2022, ISSN 2199-160X
Herausgeber: Wiley
DOI: 10.1002/aelm.202200123

A SPICE Compact Model for Ambipolar 2-D-Material FETs Aiming at Circuit Design

Autoren: Ahsan, Sheik Aamir; Singh, Shivendra Kumar; Mir, Mehak Ashraf; Perucchini, Marta; Polyushkin, Dmitry K.; Mueller, Thomas; Fiori, Gianluca; Marin, Enrique G.
Veröffentlicht in: IEEE Transactions on Electron Devices, Ausgabe 12, 2021, Seite(n) 3096 - 3103, ISSN 0018-9383
Herausgeber: Institute of Electrical and Electronics Engineers
DOI: 10.1109/TED.2021.3074357

Potential of Transition Metal Dichalcogenide Transistors forFlexible Electronics Applications

Autoren: Agata Piacentini, Alwin Daus, Zhenxing Wang, Max C. Lemme, and Daniel Neumaier
Veröffentlicht in: Advanced Electronic Materials, 2023, ISSN 2199-160X
Herausgeber: Wiley
DOI: 10.1002/aelm.202300181

Inkjet-printed low-dimensional materials-based complementary electronic circuits on paper

Autoren: Brunetti, Irene; Pimpolari, Lorenzo; Conti, Silvia; Worsley, Robin; Majee, Subimal; Polyushkin, Dmitry K.; Paur, Matthias; Dimaggio, Elisabetta; Pennelli, Giovanni; Iannaccone, Giuseppe; Macucci, Massimo; Pieri, Francesco; Mueller, Thomas; Casiraghi, Cinzia; Fiori, Gianluca
Veröffentlicht in: npj 2D Materials and Applications, Ausgabe 2, 2021, ISSN 2397-7132
Herausgeber: Springer Nature
DOI: 10.1038/s41699-021-00266-5

Plasma-Enhanced Atomic Layer Deposition of Al2O3 on Graphene Using Monolayer hBN as Interfacial Layer

Autoren: Bárbara Canto,Martin Otto,Michael J. Powell,Vitaliy Babenko,Aileen O'Mahony,Harm C. M. Knoops,Ravi S. Sundaram,Stephan Hofmann,Max C. Lemme,Daniel Neumaier
Veröffentlicht in: Advanced Materials Technology, Ausgabe 6 / 11, 2021, Seite(n) 2100489, ISSN 2365-709X
Herausgeber: Wiley
DOI: 10.1002/admt.202100489

Sub-Maxwellian Source Injection and Negative Differential Transconductance in Decorated Graphene Nanoribbons

Autoren: Damiano Marian, Enrique G. Marin, Giuseppe Iannaccone, Gianluca Fiori
Veröffentlicht in: Physical Review Applied, 2020, Seite(n) 064019, ISSN 2331-7019
Herausgeber: American Physical Society
DOI: 10.1103/physrevapplied.14.064019

A 2-D-Material FET Verilog-A Model for Analog Neuromorphic Circuit Design

Autoren: Kumar Dubey, Prabhat; Strangio, Sebastiano; Marin, Enrique G.; Iannaccone, Giuseppe; Fiori, Gianluca
Veröffentlicht in: IEEE TRANSACTIONS ON ELECTRON DEVICES, Ausgabe 4, 2023, ISSN 0018-9383
Herausgeber: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2023.3298876

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