Objective
Driven by the end-users requirements and needs, the main objective of the HIPERDIAS project is to demonstrate high
throughput laser-based manufacturing using high-power, high-repetition rate sub-1ps laser. Although the laser system to be
developed within HIPERDIAS can address other material processing applications, the focus here will be 3D structuring of
silicon at high-speed, precision processing of diamond material and fine cutting of metal for the watch and the medical
industry. Chirped Pulse Amplification (CPA) approach based on highly efficient compressors gratings will be implemented in
order to minimize the overall losses of the laser system. The final targets of the project are to demonstrate:
- a 10-times increase of ablation rate and productivity of large area 3D-structuring of silicon
- a 10 times increase of speed in fine cutting metals
- an increase of process speed (6-10 times) at a low processing tools cost of diamond machining
Therefore, the laser parameters, as well as the beam shaping, beam guiding (based on Kagomé fibers) and machine
systems will be developed and optimized to fulfill the above manufacturing targets. The laser architecture will be based on
fully passive amplifier stages combining hybrid (fiber-bulk) amplifier and thin-disk multipass amplifiers to achieve sub-500fs
at an average output power of 500W and sub-1ps at an average output of 1kW, at a repetition rate of 1-2 MHz. Furthermore,
second harmonic generation (SHG, 515 nm) and third harmonic generation (THG, 343 nm) will be implemented to allow
processing investigation at these wavelengths. At 515 nm (respectively 343 nm) an average power of >=250W (respectively
>=100W) shall be demonstrated.
Fields of science
- engineering and technologymaterials engineeringfibers
- engineering and technologymechanical engineeringmanufacturing engineeringsubtractive manufacturing
- social scienceseconomics and businesseconomicsproduction economicsproductivity
- natural scienceschemical sciencesinorganic chemistrymetalloids
- natural sciencesphysical sciencesopticslaser physics
Programme(s)
Topic(s)
Funding Scheme
RIA - Research and Innovation actionCoordinator
70174 Stuttgart
Germany
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Participants (12)
33600 Pessac
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
3400 Burgdorf
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
52074 Aachen
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
70839 Gerlingen-Schillerhoehe
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87032 Limoges
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Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
75794 Paris
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4102 Seraing
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
87100 Limoges
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
Shannon
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Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
SL5 8BP Ascot
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Participation ended
HD1 3BD Huddersfield
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
DD2 1TY DUNDEE
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.