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Extended Image Sensing Technologies

Deliverables

Second Benchmarking report
First Benchmarking report
Public final evaluation results

o Censored version of deliverable D3.5, that can be published

Final Public Demonstrator Results

Shortened version of summary of the performance of all demonstrators to be published outside the consortium

Publications

Adimec_and_partners_awarded_two_projects_developing_next_generation_image_sensor_and_camera_technologies

Author(s): ADMIEC
Published in: Press Release, 2016
Publisher: -

CCD-in-CMOS Time Delay Integration Imagers: the best of 2 worlds

Author(s): Piet De Moor
Published in: 2017
Publisher: -

Time Delay Integration CCD-in-CMOS platform development

Author(s): Pierre Boulenc, Linkun Wu, Vasyl Motsnyi, David San Segundo Bello, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans, Piet De Moor
Published in: 2017
Publisher: -

TDI imaging using embedded CCD in CMOS technology: the optimal solution for low orbit earth observation

Author(s): Piet De Moor, Paul Goetschalckx, Jonathan Borremans, Maarten Rosmeulen, Luc Haspeslagh, Andy Lambrechts
Published in: 2016
Publisher: -

TDI Imaging Using CCD-in-CMOS Technology: An Optimal Solution for Earth Observation, Industrial Inspection and Life Sciences Applications

Author(s): Piet De Moor
Published in: 2017
Publisher: -

New image sensor technologies for enhanced vision systems

Author(s): Piet De Moor
Published in: 2018
Publisher: -

Ultimate earth observation using time delay integration line scan imagers using the CCD-in-CMOS technology

Author(s): P. De Moor, Paul Goetschalckx, Maarten Rosmeulen, Luc Haspeslagh, David San Segundo Bello, Pierre Boulenc, Steven Thijs, Stefano Guerrieri
Published in: 2018
Publisher: -

Multispectral time delay integration line scan imagers using CCD-in-CMOS technology

Author(s): Piet De Moor
Published in: 2018
Publisher: -

Goals and directions of the newly started EXIST project

Author(s): Piet De Moor
Published in: 2015
Publisher: -

Multispectral Time Delay Integration imager using CCD-in-CMOS technology

Author(s): Piet De Moor et al
Published in: 2018
Publisher: -

CCD-in-CMOS Platform for Time Delay Integration

Author(s): David San Segundo Bello, Pierre Boulenc, Linkun Wu, Vasyl Motsnyi, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans, Piet De Moor
Published in: 2018
Publisher: -

Imec presented a poster about the EXIST project

Author(s): -
Published in: 2015
Publisher: -

Imec advertised both the CCD-in-CMOS TDI technology and the hyperspectral imaging systems at a booth at the SPIE Photonics West show (Jan 30th – Feb 1st 2018, San Francisco, US)

Author(s): -
Published in: 2018
Publisher: -

Goals and directions of the newly started EXIST project.

Author(s): Piet De Moor et al.
Published in: Advanced Concepts for Intelligent Vision Systems, 2015
Publisher: Springer

CMOS Image Sensors: Masterpieces of 3D Integration

Author(s): Albert Theuwissen
Published in: 6th Fraunhofer CMOS Image Sensor workshop, 2016
Publisher: Fraunhofer

CMOS Image Sensors: Masterpieces of 3D Integration

Author(s): Albert Theuwissen
Published in: Norwegian Electro-Optical meeting, 2016
Publisher: Norwegian Electro-Optical Society

Noise : You Love It or You Hate It

Author(s): Albert Theuwissen
Published in: ISSCC, 2016
Publisher: IEEE

CMOS Image Sensors: Masterpieces of 3D integration

Author(s): Albert Theuwissen
Published in: Workshop Smart Sensors, Delft University of Technology, 2016
Publisher: Delft University

A new way of seeing tissues

Author(s): Nanda van der Stap et al.
Published in: 24th International Congress of the European Association of Endoscopic Surgery, 2016
Publisher: TNO

Spectral imaging “Beyond Vision” and even “Beyond Silicon: High potential does EXIST!

Author(s): Fokko P. Wieringa
Published in: 2016
Publisher: TNO

High-speed and TDI CMOS imagers for machine vision, life-sciences, remote sensing and scientific applications

Author(s): Jonathan Borremans
Published in: SPIE Industry Events at SPIE defense and commercial sensing, 2016
Publisher: SPIE

EXIST project poster

Author(s): JU ECSEL office with input from Piet De Moor, IMEC
Published in: European Nanoelectronics Forum, 2015
Publisher: European Commission

CMOS-based hyperspectral imaging enabling innovation in health care, agriculture and food safety

Author(s): Jerome Baron
Published in: SPIE Industry Events at SPIE defense and commercial sensing, 2016
Publisher: SPIE

A 7-band CCD-in-CMOS multispectral TDI imager

Author(s): David San Segundo Bello, Maarten De Bock, Pierre Boulenc, Roeland Vandebriel, Linkun Wu, Jan Van Olmen, Vezio Malandruccolo, Jan Craninckx, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans
Published in: International Image Sensor Workshop 2017, 2017, Page(s) 129-132
Publisher: -

High speed TDI embedded CCD in CMOS sensor

Author(s): P. Boulenc, J. Robbelein, Linkun Wu, L. Haspeslagh, P. De Moor, J. Borremans, M. Rosmeulen
Published in: International Conference on Space Optics — ICSO 2016, 2017, Page(s) 152, ISBN 9781-510616141
Publisher: SPIE
DOI: 10.1117/12.2296149

High speed backside illuminated TDI CCD-in-CMOS sensor

Author(s): Pierre Boulenc, Jo Robbelein, Linkun Wu, Vasyl Motsnyi, Luc Haspeslagh, Stefano Guerrieri, Jonathan Borremans, Maarten Rosmeulen
Published in: International Image Sensor Workshop 2017, 2017, Page(s) 364-367
Publisher: -

A first order analytical TOD sensor performance model

Author(s): Piet Bijl, Maarten A. Hogervorst
Published in: Electro-Optical and Infrared Systems: Technology and Applications XIII, Issue 9987, 2016, Page(s) 99870P
Publisher: SPIE
DOI: 10.1117/12.2242262

Progress in sensor performance testing, modeling and range prediction using the TOD method: an overview

Author(s): Piet Bijl, Maarten A. Hogervorst, Alexander Toet
Published in: Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVIII, Issue 10178, 2017, Page(s) 101780U
Publisher: SPIE
DOI: 10.1117/12.2266788

High speed TDI embedded CCD in CMOS sensor

Author(s): Pierre Boulenc, Jo Robbelein, Linkun Wu, Luc Haspeslagh, Piet De Moor, Jonathan Borremans, Maarten Rosmeulen
Published in: International Conference on Space Optics 2016 proceedings, Issue Every 2 years, 2016
Publisher: CNES / ESA

Joint denoising, demosaicing, and chromatic aberration correction for UHD video

Author(s): Ljubomir Jovanov, Wilfried Philips, Klaas Jan Damstra, Frank Ellenbroek,
Published in: Applications of Digital Image Processing XL, Proceedings of SPIE Vol. 10396, 2017, Page(s) 10396-2, ISBN 9781-510612495
Publisher: SPIE

Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization

Author(s): C. Cavaco, L. Peng, S. Lavizzari, J. Claes, N. V. Hoovels, S. Guerrieri, D. S. Tezcan, and H. Osman
Published in: ECS Transastions 2016, Issue volume 75, issue 7, 2016, Page(s) 43-46
Publisher: ECS transactions

Rotation invariant similarity measure for non-local self-similarity based image denoising

Author(s): Chenglin Zuo, Ljubomir Jovanov, Hiep Quang Luong, Bart Goossens, Wilfried Philips, Yu Liu, Maojun Zhang
Published in: 2015 IEEE International Conference on Image Processing (ICIP), 2015, Page(s) 1618-1622, ISBN 978-1-4799-8339-1
Publisher: IEEE
DOI: 10.1109/ICIP.2015.7351074

HDR video synthesis for vision systems in dynamic scenes

Author(s): Shopovska, I. and Jovanov, L. and Goossens, B. and Philips, W.
Published in: Applications of Digital Image Processing XXXIX, Proceedings of SPIE Vol. 9971, 2016
Publisher: SPIE

High Dynamic Range Spectral Imaging Pipeline For Multispectral Filter Array Cameras

Author(s): Pierre-Jean Lapray, Jean-Baptiste Thomas, Pierre Gouton
Published in: Sensors, Issue 17/6, 2017, Page(s) 1281, ISSN 1424-8220
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s17061281

Energy balance in Spectral Filter Array camera design

Author(s): Pierre-Jean Lapray, Jean-Baptiste Thomas, Pierre Gouton, Yassine Ruichek
Published in: Journal of the European Optical Society-Rapid Publications, Issue 13/1, 2017, ISSN 1990-2573
Publisher: Institute of Physics Publishing
DOI: 10.1186/s41476-016-0031-7

Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization

Author(s): C. Cavaco, L. Peng, S. Lavizzari, J. Claes, N. V. Hoovels, S. Guerrieri, D. S. Tezcan, H. Osman
Published in: ECS Transactions, Issue 75/7, 2016, Page(s) 43-46, ISSN 1938-5862
Publisher: Electrochemical Society, Inc.
DOI: 10.1149/07507.0043ecst

Content-aware objective video quality assessment

Author(s): Benhur Ortiz-Jaramillo, Jorge Niño-Castañeda, Ljiljana Platiša, Wilfried Philips
Published in: Journal of Electronic Imaging, Issue 25/1, 2016, Page(s) 013011, ISSN 1017-9909
Publisher: S P I E - International Society for Optical Engineering
DOI: 10.1117/1.JEI.25.1.013011

Paper No S8.3: Content Capture and View Interpolation Algorithm for Multiview Autostereoscopic Displays

Author(s): Ljubomir Jovanov, Hiep Luong, Wilfried Philips
Published in: SID Symposium Digest of Technical Papers, Issue 46/S1, 2015, Page(s) 35-35, ISSN 0097-966X
Publisher: Society for Information Display-SID
DOI: 10.1002/sdtp.10572

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