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Thermoplastically deformable circuits for embedded randomly shaped electronics

Projektbeschreibung


Heterogeneous Integration and take-up of of Key Enabling Technologies for Components and Systems

The overall aim of the TERASEL project is the development, the industrial implementation and the application in a wide range of domains of large area, cost-effective, randomly shaped electronics and sensor circuit technologies. More specifically the TERASEL objectives are the following :
• To develop a basic technology platform for rigid large-area randomly shaped electronic circuits. Key common features of the technologies in this platform are :
1. Electronic circuit fabrication and component assembly on flat substrates, compatible with existing equipment.2. Application and embedding of the flat circuits in thermoplastically deformable polymers.3. Development of high pressure, low temperature thermoforming technologies to deform the polymer embedded flat circuit into its random final functional shape.
• To set up a complete multi-competence industrial production chain for such circuits. Indeed, the goal is to achieve mature, near-to-production industrial processes for manufacturing randomly shaped circuits.
• To apply the developed technologies in a number of functional demonstrators close to products: a TV set with ambient illumination, a free-form man-machine interface, an intelligent car interior component, a 2.5D lighting device, a household appliance.
This novel technology can be developed successfully only thanks to the synergy and intensive co-operation between partners of the 2 industry sectors involved in TERASEL: the electronics circuit fabrication and assembly industry on one hand, and the polymer processing industry on the other. 6 SME's and 5 large industrial partners are complemented with 4 research institutes, thus forming a well-balanced consortium, fully capable of achieving the ambitious TERASEL goals. The merging of polymer and electronics industry competences will lead to a whole new range of products for a wide range of application domains.

Wissenschaftliches Gebiet

Programm/Programme

Thema/Themen

Aufforderung zur Vorschlagseinreichung

FP7-ICT-2013-10
Andere Projekte für diesen Aufruf anzeigen

Finanzierungsplan

CP - Collaborative project (generic)

Koordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
EU-Beitrag
€ 717 438,00
Adresse
KAPELDREEF 75
3001 Leuven
Belgien

Auf der Karte ansehen
Region
Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven
Aktivitätstyp
Research Organisations
Kontakt Verwaltung
Christine Van Houtven (Mrs.)
Links
Gesamtkosten
Keine Daten

Beteiligte (15)

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Letzte Aktualisierung: 22 April 2017

Mein Booklet

Permalink: https://cordis.europa.eu/project/id/611439/de

European Union, 2024