Skip to main content
European Commission logo
polski polski
CORDIS - Wyniki badań wspieranych przez UE
CORDIS
CORDIS Web 30th anniversary CORDIS Web 30th anniversary
Zawartość zarchiwizowana w dniu 2024-06-18

Thermoplastically deformable circuits for embedded randomly shaped electronics

Opis projektu


Heterogeneous Integration and take-up of of Key Enabling Technologies for Components and Systems

The overall aim of the TERASEL project is the development, the industrial implementation and the application in a wide range of domains of large area, cost-effective, randomly shaped electronics and sensor circuit technologies. More specifically the TERASEL objectives are the following :
• To develop a basic technology platform for rigid large-area randomly shaped electronic circuits. Key common features of the technologies in this platform are :
1. Electronic circuit fabrication and component assembly on flat substrates, compatible with existing equipment.2. Application and embedding of the flat circuits in thermoplastically deformable polymers.3. Development of high pressure, low temperature thermoforming technologies to deform the polymer embedded flat circuit into its random final functional shape.
• To set up a complete multi-competence industrial production chain for such circuits. Indeed, the goal is to achieve mature, near-to-production industrial processes for manufacturing randomly shaped circuits.
• To apply the developed technologies in a number of functional demonstrators close to products: a TV set with ambient illumination, a free-form man-machine interface, an intelligent car interior component, a 2.5D lighting device, a household appliance.
This novel technology can be developed successfully only thanks to the synergy and intensive co-operation between partners of the 2 industry sectors involved in TERASEL: the electronics circuit fabrication and assembly industry on one hand, and the polymer processing industry on the other. 6 SME's and 5 large industrial partners are complemented with 4 research institutes, thus forming a well-balanced consortium, fully capable of achieving the ambitious TERASEL goals. The merging of polymer and electronics industry competences will lead to a whole new range of products for a wide range of application domains.

Zaproszenie do składania wniosków

FP7-ICT-2013-10
Zobacz inne projekty w ramach tego zaproszenia

Koordynator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Wkład UE
€ 717 438,00
Adres
KAPELDREEF 75
3001 Leuven
Belgia

Zobacz na mapie

Region
Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven
Rodzaj działalności
Research Organisations
Kontakt administracyjny
Christine Van Houtven (Mrs.)
Linki
Koszt całkowity
Brak danych

Uczestnicy (15)