Descrizione del progetto
Next-Generation Nanoelectronics Components and Electronics Integration
NANOPACK - Large Scale Integrating IP Project: Nano Packaging Technology for Interconnect and Heat Dissipation
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and multi-core logic. These efforts must combine high density electrical interconnects with low resistance thermal interfaces to remove heat from the intricate layered assemblies. Power electronics applications in hybrid vehicles and power supplies are also being pushed to new integration densities that are largely limited by the ability to transfer heat across interfaces to liquid coolers and heat sinks. Improved thermal management and integration densities for these applications will also be important to improve energy and manufacturing efficiency and component reliability.The proposed project aims at developing new technologies and materials for low thermal resistance interfaces and electrical interconnects by exploring systems such as carbon nanotubes, nanoparticles and nano-structured surfaces using different enhancing contact formation mechanisms combined with high volume compatible manufacturing technologies such as electro-spinning. Recent groundbreaking work on nested channel interfaces to control particle interactions during the formation of interfaces will be utilized to exploit the beneficial properties of the new materials. In addition, state-of-the-art modelling and simulation techniques with world class supercomputers will be combined with the development of experimental test structures to measure the performance of new interface technologies and validate design tools. Finally the technology will be used in several different applications to demonstrate improved performance of high power radio frequency switches, microprocessors and hybrid vehicle power electronics.
Campo scientifico
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyradio frequency
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringcomputer hardwarecomputer processors
- engineering and technologymechanical engineeringvehicle engineering
- engineering and technologynanotechnologynano-materials
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringcomputer hardwaresupercomputers
Invito a presentare proposte
FP7-ICT-2007-1
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Meccanismo di finanziamento
CP - Collaborative project (generic)Contatti coordinatore
Coordinatore
92190 MEUDON
Francia
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Partecipanti (16)
Partecipazione conclusa
3400 KLOSTERNEUBURG
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8803 Rueschlikon
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92676 ESCHENBACH
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80686 Munchen
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70839 Gerlingen-Schillerhoehe
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12489 Berlin
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08193 Cerdanyola Del Valles
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02044 VTT ESPOO
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33700 Merignac
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75794 Paris
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1037 BUDAPEST
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Partecipazione conclusa
1119 BUDAPEST
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1111 Budapest
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SE-42249 HISINGS BACKA
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412 96 GOTEBORG
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59655 VILLENEUVE D'ASCQ
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