Project description
Next-Generation Nanoelectronics Components and Electronics Integration
NANOPACK - Large Scale Integrating IP Project: Nano Packaging Technology for Interconnect and Heat Dissipation
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and multi-core logic. These efforts must combine high density electrical interconnects with low resistance thermal interfaces to remove heat from the intricate layered assemblies. Power electronics applications in hybrid vehicles and power supplies are also being pushed to new integration densities that are largely limited by the ability to transfer heat across interfaces to liquid coolers and heat sinks. Improved thermal management and integration densities for these applications will also be important to improve energy and manufacturing efficiency and component reliability.The proposed project aims at developing new technologies and materials for low thermal resistance interfaces and electrical interconnects by exploring systems such as carbon nanotubes, nanoparticles and nano-structured surfaces using different enhancing contact formation mechanisms combined with high volume compatible manufacturing technologies such as electro-spinning. Recent groundbreaking work on nested channel interfaces to control particle interactions during the formation of interfaces will be utilized to exploit the beneficial properties of the new materials. In addition, state-of-the-art modelling and simulation techniques with world class supercomputers will be combined with the development of experimental test structures to measure the performance of new interface technologies and validate design tools. Finally the technology will be used in several different applications to demonstrate improved performance of high power radio frequency switches, microprocessors and hybrid vehicle power electronics.
Fields of science
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyradio frequency
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringcomputer hardwarecomputer processors
- engineering and technologymechanical engineeringvehicle engineering
- engineering and technologynanotechnologynano-materials
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringcomputer hardwaresupercomputers
Call for proposal
FP7-ICT-2007-1
See other projects for this call
Funding Scheme
CP - Collaborative project (generic)Coordinator Contact
Coordinator
92190 MEUDON
France
See on map
Participants (16)
Participation ended
3400 KLOSTERNEUBURG
See on map
8803 Rueschlikon
See on map
92676 ESCHENBACH
See on map
80686 Munchen
See on map
70839 Gerlingen-Schillerhoehe
See on map
12489 Berlin
See on map
08193 Cerdanyola Del Valles
See on map
02044 VTT ESPOO
See on map
33700 Merignac
See on map
75794 Paris
See on map
1037 BUDAPEST
See on map
Participation ended
1119 BUDAPEST
See on map
1111 Budapest
See on map
SE-42249 HISINGS BACKA
See on map
412 96 Goteborg
See on map
59655 VILLENEUVE D'ASCQ
See on map