Eco-friendly interconnection technology
One of the critical challenges that many European industries face in order to stay competitive is the development of new high density, environmentally compatible interconnection technologies. Within this context the IMECAT project focused on developing suitable interconnection materials, such as lead-free solders and adhesives. The new materials may be employed in several industrial sectors ranging from automotive and telecoms to manufacture of Liquid Crystal Displays (LCDs), and smart cards. One of the key project results involved the development of a cost-effective connection technology using Isotropically Conductive and Non-Conductive Adhesives (ICAs and NCAs respectively). Based on a patented invention, a combination of NCAs and ICAs is employed for a flip-chip interconnection of silicon dies onto printed circuit boards (PCBs). Within this project the technology was modified to allow connection of flex to glass and become more cost-effective. Process modifications were found to lead to stable and reliable low resistance contacts. In addition, the use of boards or glass substrates of a bigger size allows printing of several substrates using one print stroke with significant cost savings. In comparison to the use of Anisotropic Conductive Adhesives (ACA), the adoption of an ICA-NCA interconnection is more complicated, but less costly due to the use of inexpensive base materials. For further information click at: http://trappist.elis.ugent.be/ELISgroups/tfcg/projects/imecat/Welcome.html