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NanoPhOtonic devices applying SElf-assembled colloIDs for novel ON-chip light sources

Project description

Monolithic low-cost colloid-based on-chip light sources

Silicon photonics are forming the backbone of next-generation on-chip technologies and optical telecommunications. Unlike the competing III-V semiconductor technology, silicon photonics promises far more cost-effective photonic integrated circuits (PICs). The EU-funded POSEIDON project will address the critical need for monolithic integration of on-chip light sources ready for mass production. Utilising active colloids that can self-organise into 3D structures, the project aims to develop nanoscale light sources of variable length that can be monolithically integrated into the back-end of PICs. Project activities will encompass the entire process chain from computer-aided design to controlled synthesis, hierarchical assembly, optoelectronic integration and device fabrication. Realising this breakthrough platform for generic PICs comprising monolithically integrated active colloidal components could boost Europe’s competitiveness in many sectors.

Objective

Silicon photonics made tremendous progress in the last decade and promises far more cost effective photonic integrated circuits (PICs) than competing III-V semiconductors. However, a monolithically integrable, mass-manufacturable light source is missing. All approaches of heterogeneous integration of III-V light sources are costly and not highly scalable, creating massive cost and complexity barriers for the commercialization of PICs. The ground-breaking aim of POSEIDON is to develop a radically new bottom-up approach towards multi-scale, on chip self-assembly of active colloids based on low cost colloid technology. For the first time this encompasses the entire process chain of computer-aided design, controlled synthesis, hierarchical assembly, optoelectronic integration and device fabrication. By controlling and designing self-assembly processes directly on a device, addressing length scales from nm to 100’s of μm simultaneously, our approach allows to fabricate functional nanophotonic components with 3D, single-nm resolution integrated into complex PICs. The ambitious goal of POSEIDON is to thereby develop electrically pumped light sources which can be monolithically integrated into the back-end of CMOS chips. This breakthrough overcomes the limitations of top-down PIC fabrication and tears down the massive cost and complexity barriers initially mentioned. The short term benefits can be quantum leaps in data center energy efficiency and network performance, enabled by the project targeting the usual Datacom wavelengths, and cheap yet powerful optical sensors. In the long run a revolutionary platform for generic PICs consisting of monolithically integrated active colloidal components (light sources and detectors), Si/Si nitride photonics and CMOS electronics can emerge from POSEIDON. This will transform Europe’s industrial landscape and provide sustainable solutions to societal challenges across ICT, quantum technologies, energy, environment, health and security.

Call for proposal

H2020-FETOPEN-2018-2020

See other projects for this call

Sub call

H2020-FETOPEN-2018-2019-2020-01

Coordinator

GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Net EU contribution
€ 593 250,00
Address
OTTO BLUMENTHAL STRASSE
52074 Aachen
Germany

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Nordrhein-Westfalen Köln Städteregion Aachen
Activity type
Other
Links
Total cost
€ 593 250,00

Participants (7)