CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Deliverables
Publications
Author(s):
Yannick Raffel, Sourav De, Maximilian Lederer, Ricardo Revello Olivo, Raik Hoffmann, Sunanda Thunder, Luca Pirro, Sven Beyer, Talha Chohan, Thomas Kämpfe, Konrad Seidel, Johannes Heitmann
Published in:
ACS Applied Electronic Materials, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
ACS
DOI:
10.1021/acsaelm.2c00771
Author(s):
S. De, F. Müller, N. Laleni, M. Lederer, Y. Raffel, S. Mojumder, S. Abdulazhanov, T. Ali, S. Dünkel, S. Beyer, K. Seidel, T. Kämpfe
Published in:
IEEE Electron Device Letters, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
IEEE
DOI:
10.1109/led.2022.3216558
Author(s):
Rubino, Arianna; Livanelioglu, Can; Qiao, Ning; Payvand, Melika; Indiveri, Giacomo
Published in:
IEEE Transactions on Circuits and Systems I: Regular Papers, 68, Issue 15498328, 2021, ISSN 1549-8328
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tcsi.2020.3035575
Author(s):
Martino Sorbaro; Martino Sorbaro; Qian Liu; Massimo Bortone; Sadique Sheik
Published in:
Frontiers in Neuroscience, Vol 14 (2020), Issue 00000000, 2020, ISSN 0000-0000
Publisher:
Frontiers in Neuroscience
DOI:
10.48550/arxiv.1912.01268
Author(s):
S. De, F. Müller, H.-H. Le, M. Lederer, Y. Raffel, T. Ali, D. Lu, T. Kämpfe
Published in:
IEEE Journal of the Electron Device Society, Issue 21686734, 2022, ISSN 2168-6734
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2022.3195119
Author(s):
A. Sünbül, T. Ali, K. Mertens, R. Olivo, D. Lehninger, F. Müller, M. Lederer, K. Kühnel, M. Rudolph, S. Oehler, R. Hoffmann, K. Zimmermann, K. Biedermann, P. Schramm, M. Czernohorsky, K. Seidel, T. Kämpfe, L. M. Eng
Published in:
IEEE Transactions on Electron Devices, Issue 00189383, 2021, ISSN 0018-9383
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2021.3131971
Author(s):
A. Kazemi, M.M. Sharifi, A.F. Balon Laguna, F. Muller, X. Yin, T. Kampfe, M. Niemier, X.S. Hu
Published in:
IEEE Transactions on Computers, Issue 00189340, 2021, ISSN 0018-9340
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tc.2021.3136576
Author(s):
M. Arsalan, A. Santra, V. Issakov
Published in:
IEEE Sensors Journal, 2022, ISSN 0000-0000
Publisher:
IEEE
Author(s):
Arman Kazemi, Franz Müller, Mohammad Mehdi Sharifi, Hamza Errahmouni, Gerald Gerlach, Thomas Kämpfe, Mohsen Imani, X. Sharon Hu, Michael
Niemier
Published in:
Scientific Reports, 2022, ISSN 0000-0000
Publisher:
Nature Springer
Author(s):
M. Arsalan, A. Santra, V. Issakov
Published in:
Applied Intelligence, 2022, ISSN 0000-0000
Publisher:
Springer
Author(s):
M. Chmurski, M. Zubert; K. Bierzynski, A. Santra
Published in:
IEEE Access, Issue 00000000, 2021, ISSN 0000-0000
Publisher:
IEEE
DOI:
10.1109/access.2021.3081353
Author(s):
M. Lederer, R. Olivo, N. Yadav, S. De, K. Seidel, L. M. Eng, T. Kämpfe
Published in:
Solid State Electronics, Issue 00000000, 2023, ISSN 0000-0000
Publisher:
Elsevier
DOI:
10.1016/j.sse.2022.108501
Author(s):
"Christensen, Dennis Valbjø rn; Dittmann, Regina; Linares-Barranco, Bernabe; Sebastian, Abu; Le Gallo, Manuel; Redaelli, Andrea; Slesazeck, Stefan; Mikolajick, Thomas; Spiga, Sabina; Menzel, Stephan; Valov, Ilia; Milano, Gianluca; Ricciardi, Carlo; Liang, Shi-Jun; Miao, Feng; Lanza, Mario; Quill, Tyler J.; Keene, Scott Tom; Salleo, Alberto; Grollier, Julie; Markovic, Danijela; Mizrahi, Alice;"
Published in:
Neuromorphic Computing and Engineering, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
IOP Publishing
DOI:
10.17863/cam.85140
Author(s):
M. Lederer, T. Kämpfe, T. Ali, F. Müller, R. Olivo, R. Hoffmann, N. Laleni, K. Seidel
Published in:
IEEE Transactions on Electron Devices, Issue 00189383, 2021, ISSN 0018-9383
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2021.3068716
Author(s):
Mateusz Chmurski; Gianfranco Mauro; Avik Santra; Mariusz Zubert; Gökberk Dagasan
Published in:
MDPI Sensors, Issue 00000000, 2021, ISSN 0000-0000
Publisher:
MDPI
DOI:
10.3390/s21217298
Author(s):
Maximilian Lederer, Konrad Seidel, Ricardo Olivo, Thomas Kämpfe, Lukas M. Eng
Published in:
Frontiers in Nanotechnology, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
Frontiers
DOI:
10.3389/fnano.2022.900379
Author(s):
C. De la Parra, T. Soliman, A. Guntoro, A. Kumar, N. Wehn
Published in:
IEEE Micro, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
IEEE
DOI:
10.1109/mm.2022.3196865
Author(s):
S. De, F. Müller, N. Laleni, T. Soliman, A. Shrivastava, N. Yadav, S. Abdulazhanov, M. Lederer, S. Mojumder, A. Vardar, T. Ali, T. Kirchner, F.-X. Liang, H.-H. Le, Md.A. Baig, D. Lu, K. Seidel, T. Kämpfe
Published in:
TechRxiv, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
IEEE
DOI:
10.36227/techrxiv.19491212.v1
Author(s):
T. Soliman, N. Laleni, T. Kirchner, F. Müller, A. Shrivastava, T. Kämpfe, A. Guntoro, N. Wehn
Published in:
ACM Transactions on Embedded Computing Systems, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
ACM
DOI:
10.1145/3529760
Author(s):
M. Arsalan, A. Santra, V. Issakov
Published in:
IEEE Sensor Letters, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
IEEE
DOI:
10.1109/lsens.2022.3173589
Author(s):
M. Arsalan, A. Santra, V. Issakov
Published in:
IEEE Transactions on Microwave Theory and Techniques, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
IEEE
DOI:
10.1109/tmtt.2022.3148403
Author(s):
Elisa Vianello, Alexandre Valentian
Published in:
Journal Neuromorphic Computing and Engineering, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
IOP Publishing
DOI:
10.1088/2634-4386/ac4a83
Author(s):
Felix Christian Bauer; Dylan R. Muir; Giacomo Indiveri
Published in:
IEEE Transactions on Biomedical Circuits and Systems, Issue 19324545, 2019, ISSN 1932-4545
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tbcas.2019.2953001
Author(s):
Julian Büchel; Dmitrii Zendrikov; Sergio Solinas; Giacomo Indiveri; Dylan R. Muir
Published in:
Scientific Reports, Vol 11, Iss 1, Issue 00000000, 2021, ISSN 0000-0000
Publisher:
Nature
DOI:
10.1038/s41598-021-02779-x
Author(s):
S. Hoppner, Y. Yan, B. Vogginger, C. Liu, F. Kelber, A. Dixius, S. Scholze, J. Partzsch, M. Stolba, F. Neumarker, G. Ellguth, S. Hartmann, S. Schiefer, T.Hocker, D. Walter, G. Liu, M. Mikaitis, J. Garside, S. Furber, C. Mayr
Published in:
arxiv, Issue 00000000, 2022, ISSN 0000-0000
Publisher:
arxiv
DOI:
10.48550/arxiv.2103.08392
Author(s):
A.F. Wandesleben, D. Truffier-Boutry, V. Brackmann, B. Lilienthal-Uhlig, M. Jaysnkar, S. Beckx, I. Madarevic, A. Demarest, B. Hintze, F. Hochschulz, Y. Le Tiec, A. Spessot, F. Nemouchi
Published in:
Industrial Artificial Intelligence Technologies and Applications, 2022
Publisher:
River Publishers
Author(s):
Nelli Laleni, Taha Soliman, Alptekin Vardar, Thomas Kämpfe
Published in:
Embedded Artificial Intelligence, 2022
Publisher:
River Publishers
Author(s):
L. Zhang, D. Borggreve, F. Vanselow, R. Brederlow
Published in:
Intelligent Edge-Embedded Technologies for Digitising Industry, 2022
Publisher:
River Publishers
Author(s):
Rameez Ismail
Published in:
Embedded Artificial Intelligence, 2022
Publisher:
River Publishers
Author(s):
N. Laleni, T. Soliman, A. Vardar, T. Kämpfe
Published in:
Intelligent Edge-Embedded Technologies for Digitising Industry, 2022
Publisher:
River Publishers
Author(s):
Hannah Bos, Dylan Muir
Published in:
Embedded Artificial Intelligence, 2022
Publisher:
River Publishers
Author(s):
P. Vijayan, A. Yousefzadeh, M. Sifalakis, R. van Leuken
Published in:
Industrial Artificial Intelligence Technologies and Applications, 2022
Publisher:
River Publishers
Author(s):
Roland Müller
Published in:
Embedded Artificial Intelligence, 2022
Publisher:
River Publishers
Author(s):
M. Molendijk, K. Vadivel, F. Corradi, G.-J. van Schaik, A. Yousefzadeh, H. Corporaal
Published in:
Industrial Artificial Intelligence Technologies and Applications, 2022
Publisher:
River Publishers
Author(s):
Jianyu Zhao
Published in:
Embedded Artificial Intelligence, 2022
Publisher:
River Publishers
Author(s):
Björn Debaillie, Ilja Ocket, and Peter Debacker
Published in:
Intelligent Edge-Embedded Technologies for Digitising Industry, 2022
Publisher:
River Publishers
DOI:
10.13052/rp-9788770226103
Author(s):
C. De la Parra, A. El-Yamany, T. Soliman, A. Kumar, N. Wehn, A. Guntoro,
Published in:
IEEE International Symposium on Circuits and Systems (ISCAS), 2021
Publisher:
IEEE
DOI:
10.1109/iscas51556.2021.9401517
Author(s):
Chirag Sudarshan; Taha Soliman; Cecilia De la Parra; Christian Weis; Leonardo Ecco; Matthias Jung; Norbert Wehn; Andre Guntoro
Published in:
Asia and South Pacific Design Automation Conference (ASP-DAC), 2021
Publisher:
IEEE
DOI:
10.1145/3394885.3431522
Author(s):
Y. Raffel, S. Thunder, M. Lederer, R. Olivo, R. Hoffmann, L. Pirro, S. Beyer, T. Chohan, P.T. Huang, S. De, T. Kämpfe, K. Seidel, J. Heitman
Published in:
International Conference on IC Design and Technology (ICICDT), 2022
Publisher:
IEEE
DOI:
10.1109/icicdt56182.2022.993311
Author(s):
M. Lederer, T. Kämpfe, T. Ali, K. Seidel
Published in:
European Materials Research Society (E-MRS), 2019
Publisher:
European Materials Research Society
Author(s):
C. Frenkel, G. Indiveri
Published in:
International Solid-State Circuits Conference (ISSCC), 2022
Publisher:
IEEE
DOI:
10.1109/isscc42614.2022.9731734
Author(s):
T. Soliman, R. Olivo, T. Kirchner, C. De La Parra, M. Lederer, T. Kämpfe, A. Guntoro, N. Wehn
Published in:
International Conference on Application-specific Systems, Architectures and Processors (ASAP), 2020
Publisher:
IEEE
DOI:
10.1109/asap49362.2020.00027
Author(s):
L. Grenouillet, N. Castellani, A. Persico, V. Meli, S. Martin, O. Billoint, R. Segaud, S. Bernasconi, C. Pellissier, C. Jahan, C. Charpin-Nicolle, P. Dezest, C. Carabasse, P. Besombes, S. Ricavy, N.-P. Tran, A. Magalhaes-Lucas, A. Roman, C. Boixaderas, T. Magis, M. Bedjaoui, M. Tessaire, A. Seignard, F. Mazen, S. Landis, E. Vianello, G. Molas, F. Gaillard, J. Arcamone, E. Nowak
Published in:
IEEE International Memory Workshop (IMW), 2021
Publisher:
IEEE
DOI:
10.1109/imw51353.2021.9439607
Author(s):
D. Lehninger, H. Mähne, T. Ali, R. Hoffmann, R. Olivo, M. Lederer, K. Mertens, T. Kämpfe, K. Biedermann, M. Landwehr, A. Heinig, D. Wang, Y. Shen, K. Bernert, S. Thiem, K. Seidel
Published in:
International Memory Workshop (IMW), 2022
Publisher:
IEEE
DOI:
10.1109/imw52921.2022.9779252
Author(s):
F. Müller , M. Lederer, R. Olivo, A. Reck, T. Ali, K. Seidel, T. Kämpfe
Published in:
IEEE International Symposium on Applications of Ferroelectrics (ISAF), 2021
Publisher:
IEEE
DOI:
10.1109/isaf51943.2021.9477384
Author(s):
S. Mohapatra, M. Hodaei, S. Yogamani, S. Milz, H. Gotzig, M. Simon, H. Rashed, P. Maeder
Published in:
International Conference on Computer Vision Theory and Applications (VISAPP), 2022
Publisher:
arxiv
DOI:
10.48550/arxiv.2111.04875
Author(s):
T. Soliman, A. Eldebiky, C. De La Parra, A. Guntoro, N. Wehn
Published in:
International System-on-Chip Conference (SOCC), 2022
Publisher:
IEEE
DOI:
10.1109/socc56010.2022.9908072
Author(s):
A. Yousefzadeh, M. Sifalakis
Published in:
International Joint Conference on Neural Networks (IJCNN), 2021
Publisher:
IEEE
DOI:
10.48550/arxiv.2107.07305
Author(s):
M. Lederer, T. Kämpfe, C. Mart, T. Ali, L. Roy, K. Seidel
Published in:
Dresden Nanoanalysis Symposium (DNS), 2019
Publisher:
Dresden Nanoanalysis Symposium
Author(s):
A. Safa, I. Ocket, A. Bourdoux, H. Sahli, Francky Catthoor, Georges G.E. Gielen
Published in:
International Joint Conference on Neural Networks (IJCNN), 2022
Publisher:
IEEE
DOI:
10.1109/ijcnn55064.2022.9892362
Author(s):
Arman Kazemi; Mohammad Mehdi Sharifi; Ann Franchesca Laguna; Franz Muller; Ramin Rajaei; Ricardo Olivo; Thomas Kampfe; Michael Niemier; X. Sharon Hu
Published in:
Design, Automation & Test in Europe (DATE), 2021
Publisher:
IEEE
DOI:
10.48550/arxiv.2011.07095
Author(s):
N. Laleni, T. Soliman, F. Muller, S. Mojumder, T. Kirchner, M. Lederer, T. Hoffmann, A. Guntoro, N. Wehn, T. Kampfe
Published in:
MikroSystemTechnik Congress (MSTK), 2021
Publisher:
IEEE
Author(s):
T. Soliman, F. Müller, T. Kirchner, T. Hoffmann, H. Ganem, E. Karimov, T. Ali, M. Lederer, C. Sudarshan, T. Kämpfe, A. Guntoro, N. Wehn
Published in:
IEEE International Electron Devices Meeting (IEDM), 2020
Publisher:
IEEE
DOI:
10.1109/iedm13553.2020.9372124
Author(s):
M. Lederer, O. R. Olivo, Y. Nandakishor, de Sourav, K. Seidel, E. Lukas, T. Kämpfe
Published in:
International Conference on Simulation of Semiconductor Processes and Devices, 2022
Publisher:
IEEE
Author(s):
K. Seidel, D. Lehninger, R. Hoffmann, T. Ali, M. Lederer, R. Revello, K. Mertens, K. Biedermann, Y. Shen, D. Wang, M. Landwehr, A. Heinig, T. Kämpfe, H. Mähne, K. Bernert, S. Thiem
Published in:
VLSI Symposium on Technology & Circuits, 2022
Publisher:
IEEE
DOI:
10.1109/vlsitechnologyandcir46769.2022.9830141
Author(s):
T. Soliman, R. Olivo, M. Lederer, T. Kämpfe, T. Kirchner, A. Guntoro, N. Wehn
Published in:
IEEE International System-on-Chip Conference (SOCC), 2020
Publisher:
IEEE
DOI:
10.1109/socc49529.2020.9524750
Author(s):
Alexandre Valentian
Published in:
AI Expo, 2020
Publisher:
ValleyML
Author(s):
T. Ali, A. Sünbül, K. Mertens, R. Revello, M. Lederer, D. Lehninger, F. Müller, K. Kühnel, M. Rudolph, S. Oehler, R. Hoffmann, K. Zimmermann, K. Biedermann, M. Czernohorsky, K. Seidel, T. Kämpfe, L.M. Eng
Published in:
Silicon Nanoelectronics Workshop (SNW), 2021
Publisher:
IEEE
DOI:
10.1109/snw51795.2021.00032
Author(s):
Büchel, Julian; Faber, Fynn; Muir, Dylan R.
Published in:
International Conference on Learning Representations (ICLR), 2022
Publisher:
ICLR
DOI:
10.48550/arxiv.2106.05009
Author(s):
B. Vogginger, F. Kelber, S.B. Sampath, J. Partzsch, C. Mayr
Published in:
Workshop on Compilers, Deployment, and Tooling for Edge AI (CDAI), 2022
Publisher:
IEEE
Author(s):
Lei Zhang; David Borggreve; Frank Vanselow; Ralf Brederlow
Published in:
International Conference on Modern Circuits and Systems Technologies (MOCAST), 2020
Publisher:
IEEE
DOI:
10.1109/mocast49295.2020.9200280
Author(s):
M. Gall, M. Gardill, T. Horn, J. Fuchs
Published in:
German Microwave Conference (GeMiC), 2020, ISBN 978-3-9820-3971-8
Publisher:
IEEE
Author(s):
M. Gall, M. Gardill, J. Fuchs, T. Horn
Published in:
MTT-S International Microwave Symposium (IMS), 2020
Publisher:
IEEE
DOI:
10.1109/ims30576.2020.9223841
Author(s):
Amirreza Yousefzadeh, Manolis Sifalakis
Published in:
International Joint Conference on Neural Networks (IJCNN), 2022
Publisher:
IEEE
DOI:
10.1109/ijcnn55064.2022.9892578
Author(s):
M. Arsalan,M. Chmurski, A. Santra, M. El-Masry, R. Weigel, V. Issakov
Published in:
IEEE MTT-S International Microwave Symposium (IMS), 2021
Publisher:
IEEE
DOI:
10.1109/ims19712.2021.9574994
Author(s):
M. Arsalan, A. Santra, V. Issakov
Published in:
IEEE International Conference on Machine Learning an Application (ICMLA), 2022
Publisher:
IEEE
Author(s):
C. Sudarshan, T. Soliman, T. Kämpfe, C. Weis, N. Wehn
Published in:
IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), 2022
Publisher:
IEEE
Author(s):
Giacomo Indiveri
Published in:
IEEE International Electron Devices Meeting (IEDM), 2021
Publisher:
IEEE
Author(s):
Alexandre Valentian
Published in:
Planet Tech’Care, 2021
Publisher:
Planet Tech’Care
Author(s):
A. Safa, I. Ocket, A. Bourdoux, H. Sahli, Francky Catthoor, Georges G.E. Gielen
Published in:
International Conference on Intelligent Robots and Systems (IROS), 2022
Publisher:
IEEE
DOI:
10.48550/arxiv.2202.08023
Author(s):
M. Arsalan,M. Chmurski, A. Santra, M. El-Masry, G. Mauro, V. Issakov
Published in:
IEEE International Conference on Emerging Technologies and Factory Automation, 2021
Publisher:
IEEE
DOI:
10.1109/etfa45728.2021.9613183
Author(s):
M. Lederer, T. Kämpfe, T. Ali, Y. Gao, K. Seidel
Published in:
International Symposium on Integrated Functionalities (ISIF), 2019
Publisher:
International Symposium on Integrated Functionalities
Author(s):
E. Esmanhotto, L. Brunet, N. Castellani, D. Bonnet, T. Dalgaty, L. Grenouillet, D.R.B Ly, C. Cagli, C. Vizioz, N. Allouti, F. Laulagnet, O. Gully, N. Bernard-Henriques, M. Bocquet, G. Molas, P. Vivet, D. Querlioz, J.M. Portal, S. Mitra, F. Andrieu, C. Fenouillet-Beranger, E. Nowak, E. Vianello
Published in:
IEEE International Electron Devices Meeting (IEDM), 2020
Publisher:
IEEE
DOI:
10.1109/iedm13553.2020.9372019
Author(s):
T. Soliman, C. De La Parra, A. Guntoro and N. Wehn
Published in:
International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2021
Publisher:
IEEE
DOI:
10.1109/aicas51828.2021.9458456
Author(s):
X. Guo, X. Ma, F. Müller, R. Olivo, J. Wu, K. Ni, T. Kämpfe, Y. Liu, H. Yang, X. Li
Published in:
European Solid State Circuits Conference (ESSCIRC), 2021
Publisher:
IEEE
DOI:
10.1109/esscirc53450.2021.9567880
Author(s):
S. Mohapatra, T. Mesquida, M. Hodaei, S. Yogamani, H. Gotzig, P. Maeder
Published in:
International Conference on Event-Based Control, Communication, and Signal Processing (EBCCSP), 2022
Publisher:
IEEE
DOI:
10.1109/ebccsp56922.2022.9845647
Author(s):
A. Sünbül, T. Ali, Tarek, R. Hoffmann, R. Revello, Y. Raffel, P. Duhan, D. Lehninger, K. Kühnel, M. Rudolph, S. Oehler, P. Schramm, M. Czernohorsky, K. Seidel, T. Kämpfe, L.M. Eng
Published in:
International Reliability Physics Symposium (IRPS), 2022
Publisher:
IEEE
DOI:
10.1109/irps48227.2022.9764585
Author(s):
S. De, Y. Raffel, S. Thunder, F. Müller, M. Lederer, T. Kämpfe
Published in:
International Electron Devices & Materials Symposium (IEDMS), 2022
Publisher:
IEEE
Author(s):
L. Zhang, D. Borggreve, F. Vanselow, R. Brederlow
Published in:
IEEE International Symposium on Circuits and Systems (ISCAS), 2021
Publisher:
IEEE
DOI:
10.1109/iscas51556.2021.9401279
Author(s):
S. Mohapatra, S. Yogamani, H. Gotzig, S. Milz, P. Mader
Published in:
IEEE Intelligent Transportation Systems Conference (ITSC), 2021
Publisher:
IEEE
DOI:
10.48550/arxiv.2104.10780
Author(s):
A. Yousefzadeh, G.-J. van Schaik, M. Tahghighi, P. Detterer, S. Traferro, M. Hijdra, J. Stuijt, F. Corradi, M. Sifalakis, M. Konijnenburg
Published in:
Artificial Intelligence Circuit and Systems (AICAS), 2022
Publisher:
IEEE
DOI:
10.1109/aicas54282.2022.9870025
Author(s):
M. Lederer, F. Müller, A. Varanasi, R. Olivo, K. Mertens, D. Lehninger, Y. Raffel, R. Hoffmann, T. Ali, K. Seidel, T. Kämpfe, L.M. Eng
Published in:
Silicon Nanoelectronics Workshop (SNW), 2021
Publisher:
IEEE
DOI:
10.1109/snw51795.2021.00033
Author(s):
Cagla Sozen
Published in:
MSc dissertation, 2022
Publisher:
TUe
Author(s):
Thomas Kämpfe
Published in:
Thesis (habilitation), 2022
Publisher:
ResearchGate
Author(s):
G. van Schaik
Published in:
ICT.OPEN2022, 2022
Publisher:
ictopen.nl
Author(s):
AI4DI, TEMPO, ANDANTE
Published in:
Workshop announcement, 2022
Publisher:
vimeo
Author(s):
TEMPO consortium
Published in:
Press release Fraunhofer Journal, 2020
Publisher:
Fraunhofer Journal
Author(s):
G. van Schaik
Published in:
Neuromorphic Computing Netherlands (NCN2021), 2021
Publisher:
cwi
Author(s):
Thomas Kämpfe
Published in:
WIOT Day Automotive & IIOT Livestream, 2022
Publisher:
WIOT Day Automotive & IIOT
Author(s):
Giacomo Indiveri
Published in:
tinyML EMEA Technical Forum, 2021
Publisher:
tinyML
Author(s):
T. Soliman, A. Eldebiky, C. De La Parra, A. Guntoro, N. Wehn
Published in:
Design Automation Conference (DAC), 2021
Publisher:
IEEE
Author(s):
AI4DI, TEMPO, ANDANTE
Published in:
Workshop announcement, 2022
Publisher:
vimeo
Author(s):
Videantis
Published in:
Press release videantis, 2022
Publisher:
Videantis
Author(s):
Björn Debaillie
Published in:
The international workshop on edge artificial intelligence for industrial applications (EAI4IA), 2022
Publisher:
TEMPO
Author(s):
Giacomo Indiveri
Published in:
Invited lecture Dipartimento Politecnico di Ingegneria e Architettura, University of Udine, 2021
Publisher:
University of Udine
Author(s):
A. Yousefzadeh
Published in:
TinyML summit 2022, 2022
Publisher:
TinyML
Author(s):
Giacomo Indiveri
Published in:
International Workshop on Artificial life and evolutionary computation, 2021
Publisher:
International Workshop on Artificial life and evolutionary computation
Author(s):
TEMPO consortium
Published in:
Imec press release, 2019
Publisher:
imec
Author(s):
Thomas Kämpfe
Published in:
International Conference on IC Design and Technology, 2022
Publisher:
IEEE
Author(s):
SynSense
Published in:
SynSense press release, 2019
Publisher:
SynSense
Author(s):
Ovidiu Vermesan, Franz Wotawa, Mario Diaz Nava, Björn Debaillie
Published in:
Industrial Artificial Intelligence Technologies and Applications, 2022
Publisher:
River Publishers
DOI:
10.13052/rp-9788770227902
Author(s):
Ovidiu Vermesan, Björn Debaillie, Mario Diaz Nava
Published in:
Embedded Artificial Intelligence, 2022
Publisher:
River Publishers
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