Periodic Reporting for period 3 - QAMeleon (Sliceable multi-QAM format SDN-powered transponders and ROADMs Enabling Elastic Optical Networks)
Reporting period: 2021-01-01 to 2022-10-31
QAMeleon aimed at a holistic solution towards the development of a new generation of SDN-programmable photonic components, modules and subsystems comprising a) sliceable bandwidth variable transponders (S-BVTs) capable of 128 Gbaud speed and b) ultra-fast, energy-efficient, integrated and scalable photonic switches (Fig. 1).
With respect to the development of the switches QAMeleon exploits InP Photonic Integrated Circuit (PIC) technology platform for the development of polarization insensitive components and novel co-integration and assembly approaches based on a polymer electro-optic circuit board (EOPCB) as a host matrix. To this end, a fully packaged semiconductor optical amplifier (SOA)-based nanosecond-scale 1x4 WSS was developed integrating InP PICs into the polymer board (Fig. 4). Polarization dependent gain lower than 2dB for entire C-band for the SOAs and λ dispersion for both polarizations for AWGs below 0.4nm was achieved. QAMeleon aimed at developing an additional optical switch based on the hybrid co-integration of InP waveguide front-ends (WFEs) with Liquid Crystal on Silicon (LCoS) technology reducing footprint and energy consumption by 20x and 11.5x respectively. During the project, 1x10 and 3x5 WFEs were successfully developed and evaluated both on InP and polymer platforms.
Novel DSP algorithms for the evaluation of high-speed signals based on advanced modulation and probabilistically shaped (PS)-M-QAM constellations have been also developed. Based on those, VPI added new modules and application examples in its VPIphotonics Design Suite. QAMeleon developed the full SDN framework interfacing its developed devices to a centralized SDN controller via the northbound and southbound SDN agent interfaces and controller plugins. NXW already exploits the SDN developments in their services. Laboratory evaluations and SDN system integration of the S-BVT and ROADM were carried out using the developed agents including field trials up to 96 Gbaud for the SBV-T agent and demonstration of a 2-degree ROADM node in the lab for the WSS-agents. End-to-end programmability over in-field links at TIM’s metro network was demonstrated using QAMeleon NLL and a commercial modulator (QAMeleon Tx module failed during the experiment, see D8.4). Despite the various challenges encountered it was possible to configure the NLL wavelength and the modulation format as well as the ROADM WSS ports via the developed SDN framework.
At the project start (2017) 64 Gbaud transceivers were making their debut in the market, 90 Gbaud generation was an intermediate step that will be superseded towards 128 Gbaud transceivers with first products demonstrations in 2023. The new NLL design has been adopted within FNSR in several products of the company while the new packaging concepts including higher-speed rf package feedthroughs, 128Gbaud PCBA test board designs led to invest in the improvement of the company’s measurement capabilities and to setup first in-house 128Gbaud characterization systems towards the development of the 128Gbaud/800Gbps IC-TROSA. The InP modulator new highspeed approaches is the only technology for double-bandwidth while maintaining a low Vpi for low power consumption. On the electronics side, dual-channel linear InP DHBT drivers and TIAs are key components for the development of CDM and ICR for 96 and 130 Gbaud systems as well as analog multiplexers showing remarkable performances targeting future >1Tbps transceivers. The highspeed DAC design on SiGe BiCMOS technology has led to a new design of a CMOS-based DAC targeting both high speed (> 160 GSps) yet exploiting low power consumption. Finally, a combined transceiver solution based on the QAMeleon photonics and electronics technologies strengthened joint exploitation potential via technology transfer and joint product development among its partners.
The global market for ROADM WSS components is envisaged to be doubled by 2026 (reaching ~1.2 billion USD) with US and Japan being the main players in this field. Europe lacks the manufacturing capabilities and local design. QAMeleon brings the entire value chain into play, with InP polarization insensitive fabrication, and the polymer host board is key for integrating multiple InP PICs towards a compact densely integrated WSS solution which is compounded by the polarization insensitive development done within QAMeleon. The use of InP is enabled through components such as spot size converters for the interface of the InP PIC platform with other platforms (eg. EOPCB) and underpinned with validated and tested integration and packaging process flows. ALTER brings the entire integration and packaging expertise, thusly providing the entire value chain. QAMeleon approach is a way for Europe to have an integrated and port-scalable WSSs that will leverage the benefits of optical switching architectures in metro/core networks as well as datacenter interconnect applications. It is also imperative to add, that the cooperation of the relevant companies and experts in these fields (SMART, VARIO, ALTER) will lead to joint exploitation scenarios.
During QAMeleon, two patents were submitted; IMEC patent on Analog Interleavers and SMART patent on polarization insensitive SSCs.