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Pilot line for paper based electrochemical test strips dedicated to quantitative biosensing in liquids

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Publications

Inkjet-printing for bio-functionalizing paper-based electrochemical biosensors

Author(s): T. Kothe, T. Maier, G. Mutinati, M. Pickrell, S. Vosseler, T. Wittwer, M. Haft, T. Elschner, W. Schmidt, R- Gumbiowski, R. Hainberger
Published in: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 2022
Publisher: IEEE
DOI: 10.1109/fleps53764.2022.9781584

Mismatch Reduction Techniques for Current-Mirror Based Potentiostats

Author(s): Markus Haberler, Inge Siegl, Christoph Steffan, Mario Auer
Published in: 2020 43rd International Convention on Information, Communication and Electronic Technology (MIPRO), 2020, Page(s) 99-103, ISBN 978-953-233-099-1
Publisher: IEEE
DOI: 10.23919/mipro48935.2020.9245441

Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers

Author(s): Muhammad Hassan Malik, Lukas Rauter, Hubert Zangl Alfred Binder, Ali Roshanghias
Published in: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 2022
Publisher: IEEE
DOI: 10.1109/fleps53764.2022.9781561

Power-Aware System-on-Chip for Point-Of-Care Diagnostic Applications

Author(s): Christian Zajc, Markus Haberler, Inge Siegl, Gerald Holweg, Christian Steger
Published in: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 2022
Publisher: IEEE
DOI: 10.1109/fleps53764.2022.9781515

Quantitative detection of C-reactive protein in human saliva using an electrochemical lateral flow device

Author(s): Loric Petruzzi; Maier Thomas; Peter Ertl; Rainer Hainberger
Published in: Biosensors and Bioelectronics: X, Issue 10, 2022, Page(s) 100136, ISSN 2590-1370
Publisher: Elsevier
DOI: 10.1016/j.biosx.2022.100136

Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders

Author(s): Augusto Daniel Rodrigues, Thomas Weissbach, Muhammad Hassan Malik, Wolfgang Schmidt, Rainer Gumbiowski, Arved C Hübler, Alfred Binder, Ali Roshanghias
Published in: Journal of Materials Science: Materials in Electronics, Issue 1573482X, 2022, Page(s) 19252–19262, ISSN 1573-482X
Publisher: Springer Nature
DOI: 10.1007/s10854-022-08763-z

A Bidirectional Current-Mirror-Based Potentiostat Using a Slice-Based Class-AB Amplifier

Author(s): Markus Haberler, Inge Siegl, Christoph Steffan, Mario Auer
Published in: IEEE Solid-State Circuits Letters, Issue 3, 2020, Page(s) 298-301, ISSN 2573-9603
Publisher: IEEE
DOI: 10.1109/lssc.2020.3013667

Intellectual Property Rights

SENSORANORDNUNG FÜR DIE VOLTAMMETRIE

Application/Publication number: 10 2018115460
Date: 2018-06-27
Applicant(s): INFINEON TECHNOLOGIES AUSTRIA AG

VORRICHTUNG ZUM REGISTERHALTIGEN PLATZIEREN VON HALBLEITERBAUTEILEN AUF EINEM BEWEGTEN SUBSTRAT

Application/Publication number: 10 2020114736
Date: 2020-06-03
Applicant(s): MAURER SERVICES GMBH

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