Obiettivo
The project will investigate the deposition of functional materials for thin-film electronics by so-called additive methods, also referred to as "printable electronics". Current manufacturing processes for thin-film electronics are based on photolithographic processes. These processes have good resolution, however at the same time west most materials that are used and need many process steps (sheet deposition of metal and resist, exposure, development, etching, stripping). Also, some new materials such as light-emitting polymers do not withstand all photolithographic process steps. These cost- and environmental considerations introduce the need for new cost-effective patterning methods that do not waste material. In an ideal scenario, the functional material is added to the substrate in one step, possibly followed by a conversion step. Additive methods suitable for this purpose can be borrowed from the printing industry. However, printing methods are at best developed to resolutions of order ten micrometer, as smaller features cannot be distinguished by the human eye. Although the resolution of some printing methods may be extended somewhat beyond their "graphical reach", there is a need for new methods that can enter the (sub-) micron range. The project consists of two parts. Early stage researchers 1 and 3 will investigate new additive methods for (sub-) micrometer deposition. One of these methods is the use of contact printing methods in the field of soft lithography. The other one is the generation and guided deposition of small droplets generated by electro spraying. Early stage researchers 2 will focus on the functional characterisation of materials deposited by printing methods. During the second part of the project, as printing methods are expected be able to deliver multiplayer integration of patterned materials, we want to investigate the relation between the deposition method and the final electronic functionality and structure of the material in a device.
Campo scientifico (EuroSciVoc)
CORDIS classifica i progetti con EuroSciVoc, una tassonomia multilingue dei campi scientifici, attraverso un processo semi-automatico basato su tecniche NLP.
CORDIS classifica i progetti con EuroSciVoc, una tassonomia multilingue dei campi scientifici, attraverso un processo semi-automatico basato su tecniche NLP.
- ingegneria e tecnologiaingegneria elettrica, ingegneria elettronica, ingegneria informaticaingegneria elettronicasensoribiosensori
- ingegneria e tecnologiaingegneria meccanicaingegnerizzazione dei prodotti
- scienze naturaliscienze fisichemeccanica classicameccanica dei fluididinamica dei fluidi
- ingegneria e tecnologiaingegneria dei materialirivestimenti e pellicole
- ingegneria e tecnologiananotecnologiananomateriali
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Parole chiave
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FP6-2002-MOBILITY-2
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Meccanismo di finanziamento
EIF - Marie Curie actions-Intra-European FellowshipsCoordinatore
EINDHOVEN
Paesi Bassi