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Zawartość zarchiwizowana w dniu 2024-06-18

AEROSPACE HOUSING FOR EXTREME ENVIRONMENTS

Cel

"The amount of electronically controlled tasks in modern aircraft is increasing steadily and the overall weight of an aircraft has reached a magnitude that requires an analysis to obtain mass reduction. Conventional electronics enclosures are made from metal. Most of the boxes fielded today offer a monolithic architecture in the form of closed box packed with electronics and lots of connectors at the front or the back with corresponding heavy cable harness. The proper housing protects the electronics against the environment, ensures EMC and supports the thermal management. In order to reach higher power density and lower costs the optimisation of the housing is a must.
Modern structures built in composite technology are able to provide important mass savings with respect to conventional designs. The advantages of high performance composites are many, including lighter weight, the ability to tailor lay-ups for optimum strength and stiffness, improved fatigue life, corrosion resistance and, with good design practice, reduced assembly costs due to fewer detail parts and fasteners.
The objective of the present project is the development of an integrated solution for a lightweight hermetic sealed power electronic housing for unpressurised area with cost neutrality and according to DO160. The final objective is the reengineering of the flat top and bottom covers of the housing in order to demonstrate the technical and economical viability of composite materials as housing materials for extreme environments. The aluminium vertical walls providing the attachment points to the electronic components and to the covers will be maintained in the prototype design. Thus, a hybrid composite-aluminium enclosure will be developed and validated against the requirements fulfilled by the current full aluminium design. The aim is to reduce 40 % the weight of the covers made currently of anodized aluminium with electrically conductive bonding areas (Alodine 1200)."

Zaproszenie do składania wniosków

SP1-JTI-CS-2012-03
Zobacz inne projekty w ramach tego zaproszenia

Koordynator

FUNDACION TECNALIA RESEARCH & INNOVATION
Wkład UE
€ 220 882,98
Adres
PARQUE CIENTIFICO Y TECNOLOGICO DE GIPUZKOA, PASEO MIKELETEGI 2
20009 DONOSTIA-SAN SEBASTIAN (GIPUZKOA)
Hiszpania

Zobacz na mapie

Region
Noreste País Vasco Gipuzkoa
Rodzaj działalności
Research Organisations
Kontakt administracyjny
Garbiñe Atxaga (Ms.)
Linki
Koszt całkowity
Brak danych