Ziel
The main objectives of this project are to design and build novel photonic integrated circuits (PICs) that can be inserted into high-performance optical communications systems. PICs will be built for high capacity advanced modulation format telecommunications systems, for all-optical switching and routing, for microwave photonic systems, for free space lasers communications systems, and for biosensors. PICs combine more than one optical function on a single chip. The functions can be active functions such as optical signal generation, optical modulation, or photodetection, as well as passive functions such as optical signal routing or filtering. PICs provide a means for significantly reducing system size, weight and power, improving reliability, and increasing system performance and functionality. Traditionally optical systems are built from discrete components and the components are connected together using fiber connections. This is cumbersome in that each time light is coupled from a chip to an optical fiber, or from an optical fiber to a chip, signal power is reduced. This negatively impacts the system because each fiber connection is a potential failure point, and the devices must operate at higher levels to compensate for the optical losses. PICs can overcome these issues by connecting components on the chip using optical waveguides. They can realize novel system architectures employing advanced modulation formats where systems built from discrete components might be too complex and negatively impact size, weight, and power requirements. Additionally, when PICs are inserted into systems employing feedback networks, significantly higher bandwidth can be realized because of the lower feedback loop delays that are achievable. The novel devices and PICs that will be developed are intended to drastically improve the performance of systems for optical communications.
Wissenschaftliches Gebiet
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsbiosensors
- engineering and technologymaterials engineeringfibers
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunications
- natural sciencesphysical sciencesopticsfibre optics
- natural sciencesphysical sciencesopticslaser physics
Aufforderung zur Vorschlagseinreichung
FP7-PEOPLE-2011-IIF
Andere Projekte für diesen Aufruf anzeigen
Finanzierungsplan
MC-IIF - International Incoming Fellowships (IIF)Koordinator
56127 Pisa
Italien