Data Center Interconnects - Towards mass manufacturing
6 October 2020 - 6 October 2020
Berlin, Germany
H2020-MASSTART Project is proudly contributing to the Photonics Days Berlin Brandenburg 2020 organized by OpTecBB with a dedicated conference session on "Data Center Interconnects - Towards mass manufacturing", chaired by Benjamin Wohlfeil (ADVA) & Paraskevas Bakopoulos (Mellanox Technologies / NVIDIA).
A holistic transformation to the assembly and characterization of high speed photonic transceivers is required towards bringing the cost down to €1/Gb/s or even lower in mass production. The cost metric threshold can be addressed by using enhanced and scalable techniques, such as
• glass interface based laser/PIC and fiber/PIC coupling approaches, leveraging glass waveguide technology to obtain spot size and pitch converters in order to dramatically increase optical I/O density,
• while facilitating automated assembly processes,
• 3D packaging (TSV) enabling backside connection of the high speed PIC to a Si carrier,
• a new generation of flip chip bonders with enhanced placement in a complete assembly line compatible with Industry 4.0 which will guarantee an x6 improvement in throughput and
• wafer-level evaluation of assembled circuits with novel tools that will reduce the characterization time by a factor of 10, down to 1 minute per device.
Such process flow is assessed with the fabrication and characterization of demonstrators, addressing the mid-term requirements of next generation transceivers required by Data Center operators and covering both inter- and intra- Data Center applications. These demonstrators are:
• a 4-channel PSM4 module in QSFP-DD format with 400G aggregate bit rate,
• an 8-channel WDM module in a QSFP-DD format with 800G aggregate bit rate,
• a 16-channel WDM on-board module delivering 1.6Tb/s aggregate line rate and
• a tunable single-wavelength coherent transceiver with 600Gb/s capacity following the DP-64QAM modulation format on 64Gbaud/s line rate.
The first half of the session is dedicated to high level to introduction of the system perspective, as well as focus on the main topic of the session which is the automated assembly.
All MASSTART technology building blocks will be presented in the second half of the session together with the overall packaging solution.
This conference session is organized in cooperation with MASSTART Consortium and OpTecBB.
16:00 – 16:15 Automated assembly solutions as key for mass manufacturing of high-speed photonic transceivers
Moritz Seyfried, ficonTEC Service GmbH, Germany
16:15 – 16:30 PICs for data center interconnects
Benjamin Wohlfeil, ADVA Optical Networking SE, Germany
16:30 – 16:45 High-speed optical interconnects for intra- and inter-DC applications
Stelios Pitris, Aristotle University of Thessaloniki, Greece
16:45 – 17:00 Towards mass manufacturable Terabit transceivers for the datacentre
Elad Mentovich, Mellanox / NVIDIA Networking, Israel
17:00 – 17:15 High throughput validation for 400G/800G optical transceivers
Ali Emsia, Tektronix GmbH, Germany
17:15 – 17:30 Advances in optical packaging for the design of datacenter transceivers
Kobi Hasharoni, DustPhotonics Ltd, Israel
17:30 – 17:45 Advances in Silicon Photonics targeting next generation transceiver PICs
Stéphane Bernabé, CEA-Leti, France
17:45 – 18:00 TSV integration into silicon photonics interposer for next generation transceiver PICs
Bogdan Sirbu & Kai Zoschke, Fraunhofer IZM, Germany
18:00 – 18:15 ioNext, a glass-based platform complementing Silicon Photonics
Adrien Billat, Teem Photonics SA, France
18:15 – 18:30 Design and realization of high-power DFB lasers based on Al-free MQW for new generation of transceivers PICS
Sofiane Belahsene, Almae Technologies, France
18:30 – 18:45 Develop your custom Photonic Integrated Circuit for Data Centers
Katarzyna Ławniczuk, Bright Photonics BV, Netherlands
18:45 – 19:00 Wrap up, Q&A
Paraskevas Bakopoulos, Mellanox / NVIDIA Networking
Benjamin Wohlfeil, ADVA Optical Networking
https://photonics-days-berlin-brandenburg-2020.b2match.io/agenda?session=62260
A holistic transformation to the assembly and characterization of high speed photonic transceivers is required towards bringing the cost down to €1/Gb/s or even lower in mass production. The cost metric threshold can be addressed by using enhanced and scalable techniques, such as
• glass interface based laser/PIC and fiber/PIC coupling approaches, leveraging glass waveguide technology to obtain spot size and pitch converters in order to dramatically increase optical I/O density,
• while facilitating automated assembly processes,
• 3D packaging (TSV) enabling backside connection of the high speed PIC to a Si carrier,
• a new generation of flip chip bonders with enhanced placement in a complete assembly line compatible with Industry 4.0 which will guarantee an x6 improvement in throughput and
• wafer-level evaluation of assembled circuits with novel tools that will reduce the characterization time by a factor of 10, down to 1 minute per device.
Such process flow is assessed with the fabrication and characterization of demonstrators, addressing the mid-term requirements of next generation transceivers required by Data Center operators and covering both inter- and intra- Data Center applications. These demonstrators are:
• a 4-channel PSM4 module in QSFP-DD format with 400G aggregate bit rate,
• an 8-channel WDM module in a QSFP-DD format with 800G aggregate bit rate,
• a 16-channel WDM on-board module delivering 1.6Tb/s aggregate line rate and
• a tunable single-wavelength coherent transceiver with 600Gb/s capacity following the DP-64QAM modulation format on 64Gbaud/s line rate.
The first half of the session is dedicated to high level to introduction of the system perspective, as well as focus on the main topic of the session which is the automated assembly.
All MASSTART technology building blocks will be presented in the second half of the session together with the overall packaging solution.
This conference session is organized in cooperation with MASSTART Consortium and OpTecBB.
16:00 – 16:15 Automated assembly solutions as key for mass manufacturing of high-speed photonic transceivers
Moritz Seyfried, ficonTEC Service GmbH, Germany
16:15 – 16:30 PICs for data center interconnects
Benjamin Wohlfeil, ADVA Optical Networking SE, Germany
16:30 – 16:45 High-speed optical interconnects for intra- and inter-DC applications
Stelios Pitris, Aristotle University of Thessaloniki, Greece
16:45 – 17:00 Towards mass manufacturable Terabit transceivers for the datacentre
Elad Mentovich, Mellanox / NVIDIA Networking, Israel
17:00 – 17:15 High throughput validation for 400G/800G optical transceivers
Ali Emsia, Tektronix GmbH, Germany
17:15 – 17:30 Advances in optical packaging for the design of datacenter transceivers
Kobi Hasharoni, DustPhotonics Ltd, Israel
17:30 – 17:45 Advances in Silicon Photonics targeting next generation transceiver PICs
Stéphane Bernabé, CEA-Leti, France
17:45 – 18:00 TSV integration into silicon photonics interposer for next generation transceiver PICs
Bogdan Sirbu & Kai Zoschke, Fraunhofer IZM, Germany
18:00 – 18:15 ioNext, a glass-based platform complementing Silicon Photonics
Adrien Billat, Teem Photonics SA, France
18:15 – 18:30 Design and realization of high-power DFB lasers based on Al-free MQW for new generation of transceivers PICS
Sofiane Belahsene, Almae Technologies, France
18:30 – 18:45 Develop your custom Photonic Integrated Circuit for Data Centers
Katarzyna Ławniczuk, Bright Photonics BV, Netherlands
18:45 – 19:00 Wrap up, Q&A
Paraskevas Bakopoulos, Mellanox / NVIDIA Networking
Benjamin Wohlfeil, ADVA Optical Networking
https://photonics-days-berlin-brandenburg-2020.b2match.io/agenda?session=62260
Keywords
Photonics, Optical Communications, Photonic integration, photonic integrated circuits, Data center, Photonic interconnects, Packaging, Assembly, Automation, Manufacturing, Testing, Data Center Interconnect, Transceiver, Silicon Photonics, Pigtailing